| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/29/1997 | US5625227 Circuit board-mounted IC package cooling apparatus |
| 04/29/1997 | US5625222 Semiconductor device in a resin package housed in a frame having high thermal conductivity |
| 04/29/1997 | US5625022 Curable organopolysiloxane composition |
| 04/29/1997 | US5624750 Adhesive heater and method for securing an object to a surface |
| 04/29/1997 | US5624741 Matrix of oxygen impermeable anhygroscopic inorganic dielectric with insulatively coated, abutting dispersed metal particles; application of electrical potential between two points breaks down coating forming conductive path |
| 04/29/1997 | US5624708 High-density circuit and method of its manufacture |
| 04/29/1997 | US5624297 Buffing apparatus suitable to buff thin plate work and controlling method for the apparatus |
| 04/29/1997 | US5624268 Electrical connectors using anisotropic conductive films |
| 04/29/1997 | US5623872 Screen printing apparatus |
| 04/29/1997 | CA2124196C Magnetic vias within multilayer, 3 dimensional structures/substrates |
| 04/29/1997 | CA2057689C Universal surface mount package |
| 04/24/1997 | WO1997015173A1 Method for radiation-induced thermal transfer of resist for flexible printed circuitry |
| 04/24/1997 | WO1997015097A1 Solder element |
| 04/24/1997 | DE19642922A1 Hydrophilic catalytic solution for producing patterned film on substrate prior to electroless coating |
| 04/24/1997 | DE19539193A1 Making epoxy] resin coated films for via sheets for multi layer switches for IC s |
| 04/24/1997 | DE19538984C1 Laser drilling appts. for producing blind holes in dielectric layers esp. for multiple layer circuit boards |
| 04/23/1997 | EP0769817A2 Method of fixing photoelectric semiconductor devices on a base |
| 04/23/1997 | EP0769726A2 Process for projection exposure of a workpiece with alignment marks on the rear side and device for executing the process |
| 04/23/1997 | EP0769378A2 Recording head, head cartridge and recording apparatus |
| 04/23/1997 | EP0769346A1 Composite solder paste for flip chip bumping |
| 04/23/1997 | EP0769214A1 Process for producing an electrically conductive connection |
| 04/23/1997 | EP0698130B1 Process for the deposition of palladium layers |
| 04/23/1997 | EP0550460B1 Solder fluxes bearing oxide removers generated by light |
| 04/23/1997 | CN2253101Y Improved structure of integration circuit pins arranging machine |
| 04/23/1997 | CN1148377A Omega-hydrofluoroalkyle ethers, precursor carboxylic acid and derivatives thereof, and their prepn. and application |
| 04/23/1997 | CN1148281A Method and apparatus for locating electrical circuit members |
| 04/23/1997 | CN1148188A Method and compositions for diffusion patterning |
| 04/23/1997 | CN1034706C Solder-coated printed circuit board, and method for mfg. same |
| 04/23/1997 | CN1034638C Subliming solder flux composition |
| 04/22/1997 | US5623395 Integrated circuit package assembly |
| 04/22/1997 | US5623293 Contact electrode connector |
| 04/22/1997 | US5623160 Signal-routing or interconnect substrate, structure and apparatus |
| 04/22/1997 | US5623127 Single alloy solder clad substrate |
| 04/22/1997 | US5623006 Solder interconnection |
| 04/22/1997 | US5622895 Metallization for polymer-dielectric multichip modules |
| 04/22/1997 | US5622788 Multilayer bonding pad |
| 04/22/1997 | US5622782 Useful in manufacture of printed circuit boards |
| 04/22/1997 | US5622770 Printed circuit board design utilizing flexible interconnects for programmable logic components |
| 04/22/1997 | US5622769 Ceramic circuit board having a thermal conductivity substrate |
| 04/22/1997 | US5622752 Methods and system for applying a uniform coating to a moving workpiece using an ultrasonic spray head |
| 04/22/1997 | US5622652 Solution mixture comprising electroconductive powder |
| 04/22/1997 | US5622608 Depositing copper and magnesium on substrate, annealing to form inert magnesium oxide layer |
| 04/22/1997 | US5622303 Method and device for soldering workpieces |
| 04/17/1997 | WO1997014282A1 Method of plating through holes of a printed circuit board |
| 04/17/1997 | WO1997014157A1 An electrical circuit component formed of a conductive liquid printed directly onto a substrate |
| 04/17/1997 | DE19538046A1 Process for making metal to ceramic layers |
| 04/17/1997 | CA2224236A1 An electrical circuit component formed of a conductive liquid printed directly onto a substrate |
| 04/16/1997 | EP0768815A1 Process for manufacturing electrical circuits having a circuit board |
| 04/16/1997 | EP0768814A1 Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom |
| 04/16/1997 | EP0768813A2 Printed circuit boards |
| 04/16/1997 | EP0768712A2 Bump-type contact head for a circuit board and semiconductor module using the same |
| 04/16/1997 | EP0768708A2 Method for forming bumps on substrates for electronic components |
| 04/16/1997 | EP0768285A1 Method for producing resistive gradients on substrates and articles produced thereby |
| 04/16/1997 | EP0768176A1 System and method for high resolution screen printing |
| 04/16/1997 | EP0768141A1 Punching machine |
| 04/16/1997 | EP0768021A1 Method of processing printed circuit boards and device therefore |
| 04/16/1997 | EP0767964A1 Anisotropically conducting adhesive and process for its production |
| 04/16/1997 | EP0710161A4 Post treatment of a coated substrate with a gas containing excited halogen to remove residues |
| 04/16/1997 | EP0647251A4 Surface mount conductive adhesives. |
| 04/16/1997 | CN1147839A Device for processing flat workpieces, in particular printed circuit boards |
| 04/16/1997 | CN1147838A Device for processing printed circuit boards |
| 04/16/1997 | CN1147805A Coating of substrates |
| 04/16/1997 | CN1147708A Anti-wicking board to board connector |
| 04/15/1997 | US5621619 All ceramic surface mount sip and dip networks having spacers and solder barriers |
| 04/15/1997 | US5621193 Ceramic edge connect process |
| 04/15/1997 | US5621190 Ceramic package main body |
| 04/15/1997 | US5621068 Thermoplastic polyimide polymer; thermoplastic polyimide film; polyimide laminate; and method of manufacturing the laminate |
| 04/15/1997 | US5620927 Solder ball attachment machine for semiconductor packages |
| 04/15/1997 | US5620831 Cyanoguanidine derivatives, and thermosetting or photocurable, thermosetting resin composition using the same |
| 04/15/1997 | US5620800 Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure |
| 04/15/1997 | US5620795 Adhesives containing electrically conductive agents |
| 04/15/1997 | US5620782 Method of fabricating a flex laminate package |
| 04/15/1997 | US5620739 Thin film capacitors on gallium arsenide substrate and process for making the same |
| 04/15/1997 | US5620618 Multi-wavelength programmable laser processing mechanisms and apparatus |
| 04/15/1997 | US5620612 Method for the manufacture of printed circuit boards |
| 04/15/1997 | US5620558 Using etching solution containing hydrofluoric acid, cupric chloride and hydrochloric acid; increased resolution, reproducible control |
| 04/15/1997 | US5620286 Flycutting machine for manufacturing printed circuit boards |
| 04/15/1997 | US5620129 Device and method for forming and attaching an array of conductive balls |
| 04/15/1997 | US5620086 Miniature jumper switch |
| 04/15/1997 | US5619791 Method for fabricating highly conductive vias |
| 04/15/1997 | CA2063682C Solder-coated printed circuit board and method of manufacturing the same |
| 04/14/1997 | CA2187582A1 Edge terminals for electronic circuit modules |
| 04/11/1997 | CA2187475A1 Method for producing resistive gradients on substrates and articles produced thereby |
| 04/11/1997 | CA2186974A1 System and method for high resolution screen printing |
| 04/10/1997 | WO1997013393A1 Printed circuit board interconnection between layers |
| 04/10/1997 | WO1997013392A2 Button contact for surface mounting an ic device to a circuit board |
| 04/10/1997 | WO1997013295A1 Connector and manufacturing method therefor |
| 04/10/1997 | WO1997012718A1 Soldering methods and compositions |
| 04/10/1997 | DE19641613A1 Module with microcomponent and carrier manufacturing method |
| 04/10/1997 | DE19640435A1 Power dissipation device for semiconductor component, e.g. SMD or PCB |
| 04/10/1997 | DE19544815C1 Sensor which is sealed against liq. and gases |
| 04/09/1997 | EP0767600A1 Device for treating radio frequency signals having a surface mounted component |
| 04/09/1997 | EP0767496A1 Multilayer high-frequency circuit with integrated active elements |
| 04/09/1997 | EP0767257A2 Process for manufacturing integrated electrodes in plastic moulds, plastic moulds with integrated electrodes and its use |
| 04/09/1997 | EP0766909A1 Vertical interconnect process for silicon segments |
| 04/09/1997 | EP0766908A1 Method and device for coating printed-circuit boards, in particular for the manufacture of multi-chip-modules |
| 04/09/1997 | EP0766907A1 Metallized laminate material having ordered distribution of conductive through holes |
| 04/09/1997 | EP0766851A1 Document verification system |
| 04/09/1997 | EP0766829A2 Method of cleaning probe tips of probe cards and apparatus for implementing the method |
| 04/09/1997 | EP0710433B1 Electrical circuits with very high conductivity and great fineness, methods of manufacture and devices comprising same |