| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/12/1996 | EP0716563A2 Process for connecting the lead of an electric component and device manufactured by this process |
| 06/12/1996 | EP0716430A1 Thick film conductor compositions with improved adhesion |
| 06/12/1996 | EP0716164A1 Organic rust-proof treated copper foil |
| 06/12/1996 | EP0715773A1 Cross-connect system |
| 06/12/1996 | EP0715570A1 Multiple layer printed circuit boards and method of manufacture |
| 06/12/1996 | CN1124470A Process and apparatus for the wave soldering of circuit boards |
| 06/12/1996 | CN1124301A Method for fixation of catalyst metal in the process of surface treatment for electroless plating |
| 06/12/1996 | CN1031980C Washing/drying method and apparatus |
| 06/11/1996 | US5526234 Packaging electrical components |
| 06/11/1996 | US5525763 Printed circuit board arrangement |
| 06/11/1996 | US5525761 Copper-based paste containing refractory metal additions for densification control |
| 06/11/1996 | US5525760 Fan-fold shielded electrical leads |
| 06/11/1996 | US5525758 Bus bar of branch joint box |
| 06/11/1996 | US5525644 Potted electrical components and methods of making the same |
| 06/11/1996 | US5525564 Reacting a platinum halide with an organic compound having atleast one triple bond |
| 06/11/1996 | US5525454 Multilayer on temporary substrate comprising an alkali-soluble thermoplastic resin blends; high speed without entrapping air bubbles, easy stripping off, easy removal |
| 06/11/1996 | US5525433 Epoxy adhesives and copper foils and copper clad laminates using same |
| 06/11/1996 | US5525402 Bump forming paste is metal oxide including copper oxide as major component and bumps are made of reduced and sintered body of paste; used for semiconductors |
| 06/11/1996 | US5525374 Infiltering metal in molten state in sintered ceramic body to fill the void space by capillary action, cooling |
| 06/11/1996 | US5525369 Cooling and tensioning a composite of metal and polymeric material while depositing a metal from vapor phase |
| 06/11/1996 | US5525205 Process for forming circuit with laser |
| 06/11/1996 | US5525204 Applying a solder mask after plating process |
| 06/11/1996 | US5525181 Method of manufacturing a multilayer printed circuit board having first and second conducting patterns connected through an adhesive layer and laminate for the manufacture of such a printed circuit board |
| 06/11/1996 | US5525065 Cavity and bump interconnection structure for electronic packages |
| 06/11/1996 | US5524654 Etching, developing and peeling apparatus for printed board |
| 06/06/1996 | WO1996017503A1 Multilayer printed wiring board and process for producing the same |
| 06/06/1996 | WO1996017502A1 Single alloy solder clad substrate |
| 06/06/1996 | WO1996017501A1 Chemically grafted electrical devices |
| 06/06/1996 | WO1996017413A1 Electrical connector assembly with interleaved multilayer structure and fabrication method |
| 06/06/1996 | WO1996017378A1 Electrical contact structures from flexible wire |
| 06/06/1996 | WO1996016796A1 Electrical contact having a particulate surface |
| 06/06/1996 | WO1996016768A1 Process for bonding wires to oxidation-sensitive metal substrates which can be soldered |
| 06/06/1996 | CA2205966A1 Process for bonding wires to oxidation-sensitive metal substrates which can be soldered |
| 06/05/1996 | EP0715490A2 Method of preparing multilayer wiring board |
| 06/05/1996 | EP0715489A2 Printed circuit board assembly |
| 06/05/1996 | EP0715488A1 Metal-foil-clad composite ceramic board and process for the production thereof |
| 06/05/1996 | EP0715355A2 Cap to close off open via holes in PCBs |
| 06/05/1996 | EP0715201A2 Circuit assembly and process for production thereof |
| 06/05/1996 | EP0715162A1 Method for detecting a coating material on a substrate |
| 06/05/1996 | EP0714769A2 Reciprocally shuttled double sided screener with tiltable print squeegee |
| 06/05/1996 | EP0714591A1 Edge-connecting printed circuit board |
| 06/05/1996 | EP0714553A1 Method of forming electrically conductive polymer interconnects on electrical substrates |
| 06/05/1996 | EP0438535B1 Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces |
| 06/05/1996 | DE4444567A1 Mfg. circuit board based on core plate of aluminium or alloy |
| 06/05/1996 | CN1124030A Thermally cross-linkable heat-sealing adhesive |
| 06/05/1996 | CN1123965A Vibration-generating-motor mounting structure and its mounting method |
| 06/04/1996 | US5523921 Printed circuit assembly having improved reference plane isolation |
| 06/04/1996 | US5523920 Printed circuit board comprising elevated bond pads |
| 06/04/1996 | US5523873 LCD heater with flex circuit buss bars |
| 06/04/1996 | US5523697 Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof |
| 06/04/1996 | US5523443 Protective coatings |
| 06/04/1996 | US5523174 Printed circuit boards |
| 06/04/1996 | US5523137 Adhesive paper for tape automated bonding |
| 06/04/1996 | US5522963 Method for machining and depositing metallurgy on ceramic layers |
| 06/04/1996 | US5522962 Method of forming electrically conductive structured sheets |
| 06/04/1996 | US5522940 Process for cleaning electronic parts or precision parts |
| 06/04/1996 | US5522929 Apparatus for material deposition for circuit board manufacture |
| 06/04/1996 | US5522733 Electrical connectors |
| 06/04/1996 | US5522727 Electrical angle connector of a printed circuit board type having a plurality of connecting conductive strips of a common length |
| 06/04/1996 | US5522683 Drilling apparatus |
| 06/04/1996 | US5522132 Microwave surface mount package |
| 06/04/1996 | CA2091999C Surface mount assembly of devices using adcon interconnections |
| 05/30/1996 | WO1996016442A1 Core metal soldering knob for flip-chip technology |
| 05/30/1996 | WO1996016440A1 Interconnection elements for microelectronic components |
| 05/30/1996 | WO1996016158A1 Terpene and tetrahydrofurfuryl alcohol cleaning agent |
| 05/30/1996 | WO1996016134A1 Pressure sensitive adhesives and damping constructions |
| 05/30/1996 | DE4444388A1 Verfahren zum Bonden von Drähten auf oxidationsempfindlichen, lötbaren Metallsubstraten A method for bonding wires on oxidation-sensitive, solderable metal substrates |
| 05/30/1996 | CA2205223A1 Pressure sensitive adhesives and damping constructions |
| 05/30/1996 | CA2159252A1 Method for detecting a coating material on a substrate |
| 05/29/1996 | EP0714226A1 Method of mounting terminal to flexible printed circuit board |
| 05/29/1996 | EP0714124A2 Method for bonding a first substrate to a second substrate and application of the method to the fabrication of a three dimensional circuit device |
| 05/29/1996 | EP0714123A2 A semiconductor device, a semiconductor device-mounted apparatus, and a method for replacing the semiconductor device |
| 05/29/1996 | EP0713930A1 Aqueous silver composition |
| 05/29/1996 | EP0713743A1 Application of soldering fluxes |
| 05/29/1996 | EP0644809A4 Three-dimensional printing techniques. |
| 05/29/1996 | CN1123583A An electric fuse and protective circuit |
| 05/29/1996 | CN1123532A SMD-soldering installation |
| 05/29/1996 | CN1123515A Resin-molded electronic circuit device |
| 05/29/1996 | CN1123514A Laminar stackable circuit board structure and manufacture |
| 05/29/1996 | CN1123513A Laminar stackable circuit board structure with cap acitor |
| 05/29/1996 | CN1123512A Electronic component mounting apparatus |
| 05/29/1996 | CN1123431A Method and apparatus for providing a remotely located outrigger card electrically coupled to a control card |
| 05/29/1996 | CN1123210A Solder paste and method for producing |
| 05/28/1996 | US5521438 Having stress relief layer of soft metal |
| 05/28/1996 | US5521432 Semiconductor device having improved leads comprising palladium plated nickel |
| 05/28/1996 | US5521427 Printed wiring board mounted semiconductor device having leadframe with alignment feature |
| 05/28/1996 | US5521122 Process of manufacturing a multichip module using a temporary support base |
| 05/28/1996 | US5521053 Adduct of maleinized diene polymer and hydroxyalkyl acrylate |
| 05/28/1996 | US5520986 Diffusion patterning process and screen therefor |
| 05/28/1996 | US5520967 Solder application to a circuit board |
| 05/28/1996 | US5520863 Method of making IC card |
| 05/28/1996 | US5520763 Intelligent foil transfer |
| 05/28/1996 | US5520752 Composite solders |
| 05/28/1996 | US5520733 Deposition apparatus and profile-following device suitable for apparatuses such as those for deposition |
| 05/28/1996 | US5520320 Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere |
| 05/23/1996 | WO1996015651A1 Method of producing a feedthrough on a circuit board |
| 05/23/1996 | WO1996015551A1 Mounting electronic components to a circuit board |
| 05/23/1996 | WO1996015459A1 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 05/23/1996 | WO1996015458A1 Probe card assembly and kit, and methods of using same |
| 05/23/1996 | WO1996015294A1 Electrolytic treatment device for plate-like workpieces, in particular printed circuit boards |