| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/29/1997 | EP0755618A1 Sealed electronic packaging for environmental protection of active electronics |
| 01/29/1997 | EP0755571A1 Process and device for chemically treating substrates |
| 01/29/1997 | EP0730500A4 Ammonia-free deposition of copper by disproportionation |
| 01/29/1997 | EP0655020B1 Process and device for metallizing a contact area |
| 01/29/1997 | CN1141574A Multi-layer printed circuit and method for mfg. same |
| 01/29/1997 | CN1141573A Terminal connecting structure of flexible board and printed circuit board |
| 01/29/1997 | CN1141572A Tech. for soldering copper foil for conducting heavy current of circuit board |
| 01/29/1997 | CN1141570A Multilayer print circuit board and production method of multilayer print circuit board |
| 01/29/1997 | CN1141507A Method for forming bumps on substrate |
| 01/29/1997 | CN1141239A Device for cleaning screen plate used in screen printing |
| 01/28/1997 | US5598307 Integrated gimbal suspension assembly |
| 01/28/1997 | US5598036 Ball grid array having reduced mechanical stress |
| 01/28/1997 | US5597982 Electrical connection structure |
| 01/28/1997 | US5597792 High water content, low viscosity, oil continuous microemulsions and emulsions, and their use in cleaning applications |
| 01/28/1997 | US5597644 Glass glaze |
| 01/28/1997 | US5597471 Solution for coating non-conductors with conductive polymers and their metallization process |
| 01/28/1997 | US5597470 Method for making a flexible lead for a microelectronic device |
| 01/28/1997 | US5597469 Process for selective application of solder to circuit packages |
| 01/28/1997 | US5597412 Apparatus for forcing plating solution into via openings |
| 01/28/1997 | US5597313 Electrical connectors |
| 01/28/1997 | US5597110 Method for forming a solder bump by solder-jetting or the like |
| 01/28/1997 | US5596804 Method of constructing an electromagnetically shielded microstrip circuit |
| 01/25/1997 | CA2181213A1 Electronic inductive device and method for manufacturing |
| 01/23/1997 | WO1997002728A1 Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil |
| 01/23/1997 | WO1997002727A1 Method of manufacturing a printed circuit board |
| 01/23/1997 | WO1997002726A1 System and apparatus for reducing arcing and localized heating during microwave processing |
| 01/23/1997 | WO1997002725A1 Process for assembling electronics using microwave irradiation |
| 01/23/1997 | WO1997002724A1 Procedure and device for the chemical and electrolytic treatment of printed circuit boards and films |
| 01/23/1997 | WO1997002723A1 Process and device for joining electric, heat source-bearing printed circuit boards to metallic heat dissipating plates |
| 01/23/1997 | WO1997002578A2 Surface-mountable electrical component |
| 01/23/1997 | WO1997002511A1 Electrodepositable photoimageable compositions with improved edge coverage |
| 01/23/1997 | DE19628264A1 Formation of finely-detailed printed circuits esp. for semiconductor component mounting plates |
| 01/23/1997 | DE19526791A1 Sepn. of e.g. light appliance and vehicle scrap to recover clean copper@ and aluminium@ |
| 01/23/1997 | DE19526413A1 Surface-mounted IC component contacting system |
| 01/23/1997 | CA2225829A1 Method and device for chemical and electrolytic treatment of printed circuit boards and conductor films |
| 01/22/1997 | EP0755165A1 Contacting of an electroacoustic transducer inside a telephone handset |
| 01/22/1997 | EP0755035A1 Resonant tag and method of manufacturing the same |
| 01/22/1997 | EP0754356A1 Electrical lead for surface mounting of substrates |
| 01/22/1997 | EP0754120A1 Holographic document and method for forming |
| 01/22/1997 | EP0599989B1 Infra-red direct write imaging media |
| 01/22/1997 | CN1141114A Method of surface mounting radio frequency components and the components |
| 01/22/1997 | CN1140973A Process for producing multilayer printed circuit boards |
| 01/22/1997 | CN1140864A Resonant tag and method of manufacturing the same |
| 01/22/1997 | CN1140843A Photosensitive resin composition for sandblast resist |
| 01/21/1997 | US5596431 Plasma addressed liquid crystal display with etched electrodes |
| 01/21/1997 | US5596227 Ball grid array type semiconductor device |
| 01/21/1997 | US5596224 Molded-in lead frames |
| 01/21/1997 | US5596178 single replacement pad with perforated shaft for the repair of printed circuit boards |
| 01/21/1997 | US5595943 Cathode reaction inhibitor |
| 01/21/1997 | US5595859 Process for preparing an article having deposited thereon a photoimageable electrodepositable photoresist composition |
| 01/21/1997 | US5595858 Manufacturing method for double-sided wiring board |
| 01/21/1997 | US5595668 Protective coatingsprotective coatings |
| 01/21/1997 | US5595637 Photoelectrochemical fabrication of electronic circuits |
| 01/21/1997 | US5595583 Apparatus for localized surface glazing of ceramic articles |
| 01/16/1997 | WO1997001866A1 Ball grid array package utilizing solder coated spheres |
| 01/16/1997 | WO1997001865A1 Semiconductor device and method of manufacturing the same |
| 01/16/1997 | WO1997001437A1 Circuit board laminates and method of making |
| 01/16/1997 | WO1997001414A1 Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors |
| 01/16/1997 | WO1997001393A1 Method of and arrangement for applying a fluid to a surface |
| 01/16/1997 | WO1996036450A3 Fabricating metal matrix composites containing electrical insulators |
| 01/15/1997 | EP0753990A1 Connection device and process |
| 01/15/1997 | EP0753989A1 Coatings and methods, especially for circuit boards |
| 01/15/1997 | EP0753988A2 Method for forming bumps on a substrate |
| 01/15/1997 | EP0753901A2 Continuous molded electrical connector |
| 01/15/1997 | EP0753842A2 Thin film magnetic head including vias formed in alumina layer and process for making the same |
| 01/15/1997 | EP0753374A1 Low-melting alloy and cream solder using a powder of the alloy |
| 01/15/1997 | EP0753180A1 Method of manufacturing a chip card, and chip card thus produced |
| 01/15/1997 | EP0729650A4 Solderable connector for high density electronic assemblies |
| 01/15/1997 | EP0706724B1 Hold-down element for electrical and/or electronic components |
| 01/15/1997 | EP0600925B1 Component of printed circuit boards |
| 01/15/1997 | EP0556185B1 System for controlling the clamp means in a tree harvesting machine, especially grapple harvester |
| 01/15/1997 | EP0552286B1 Ternary azeotropic compositions of 43-10mee (cf 3?chfchfcf 2?cf 3?) and trans 1,2-dichloroethylene with methanol or ethanol |
| 01/15/1997 | EP0552225B1 Binary azeotropic compositions of (cf3chfchfcf2cf3) with methanol or ethanol or isopropanol |
| 01/15/1997 | CN1140430A Method of making composite laminate and PWB substrate so made |
| 01/15/1997 | CN1140389A Method for making electronic circuit |
| 01/15/1997 | CN1033820C Composition based on 1,1-dichloro-1-fluoroethane, 1,1,1,3,3-pentafluorobutane and methanol for cleaning and/or drying solid surface |
| 01/15/1997 | CN1033819C Composition based on 1,1,1,3,3-pentafluorobatane and methanol for cleaning and/or drying solid surface |
| 01/14/1997 | USRE35423 Method and apparatus for performing automated circuit board solder quality inspections |
| 01/14/1997 | US5594652 Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data |
| 01/14/1997 | US5594234 Downset exposed die mount pad leadframe and package |
| 01/14/1997 | US5594214 Signal transmission flat cable |
| 01/14/1997 | US5594204 Overmolded PC board with ESD protection and EMI suppression |
| 01/14/1997 | US5593774 Polyimide base film; thermoplastic or thermosetting adhesive layers; tear strength; semiconductors |
| 01/14/1997 | US5593739 Method of patterned metallization of substrate surfaces |
| 01/14/1997 | US5593722 Method of producing thick multi-layer substrates |
| 01/14/1997 | US5593606 Ultraviolet laser system and method for forming vias in multi-layered targets |
| 01/14/1997 | US5593604 Method of resistance welding thin elements |
| 01/14/1997 | US5593526 Ceramic coated glass spheres |
| 01/14/1997 | US5593508 Moist, absorbent material for cleaning articles and surfaces |
| 01/14/1997 | US5593507 Cleaning method and cleaning apparatus |
| 01/14/1997 | US5593504 Method of cleaning solder pastes from a substrate with an aqueous cleaner |
| 01/14/1997 | US5593499 Dual air knife for hot air solder levelling |
| 01/14/1997 | US5593339 Slurry cleaning process |
| 01/14/1997 | US5593322 Leadless high density connector |
| 01/14/1997 | US5593223 Illumination device |
| 01/14/1997 | US5593083 Castellated nozzle and method of use therof |
| 01/14/1997 | US5593080 Mask for printing solder paste |
| 01/14/1997 | US5593040 For holding a circuit board |
| 01/14/1997 | US5592958 Apparatus for processing a circuit board substrate |
| 01/14/1997 | US5592737 Method of manufacturing a multilayer printed wire board |