| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 08/27/1996 | CA2051606C Multi-layer wiring board |
| 08/22/1996 | WO1996025838A1 Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit |
| 08/22/1996 | WO1996025837A1 Device and method for forming and attaching an array of conductive balls |
| 08/22/1996 | WO1996025763A2 Organic chip carriers for wire bond-type chips |
| 08/22/1996 | WO1996025690A1 3-d laser patterning process |
| 08/22/1996 | WO1996025264A1 Surface mount device removal tool |
| 08/22/1996 | WO1996025263A2 Process for bonding a flexible substrate to a chip |
| 08/22/1996 | DE19505555A1 Base material for high packing density circuit boards, esp. SMD boards |
| 08/22/1996 | DE19504967A1 Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip A method of connecting a flexible substrate having a chip |
| 08/21/1996 | EP0727931A2 Electronic control module |
| 08/21/1996 | EP0727926A2 Multilayer printed writing board and method of manufacturing such a board |
| 08/21/1996 | EP0727925A1 Process for structured metallizing of the surface of substrates |
| 08/21/1996 | EP0727851A2 Electrical connection construction between electrical connection box and electronic circuit unit |
| 08/21/1996 | EP0727841A2 Branch junction box |
| 08/21/1996 | EP0726925A1 Electrically conductive adhesives |
| 08/21/1996 | CN1129423A Multiple layer printed circuit boards and method of manufacture |
| 08/21/1996 | CN1129365A Thin-film circuit with patch-clip |
| 08/21/1996 | CN1129357A Method and apparatus for retention of a fragile conductive trace with a protective clamp |
| 08/21/1996 | CN1129340A Thick film conductor compositions with improved adhesion |
| 08/21/1996 | CN1129339A Electrically conductive paste materials and applications |
| 08/21/1996 | CN1129171A Chushioning material for forming press |
| 08/21/1996 | CN1129170A Single side copper-clad laminate |
| 08/21/1996 | CN1032614C Method for making single or multiple layer circuit parttern |
| 08/20/1996 | US5548488 Electrical componet mounting system |
| 08/20/1996 | US5548487 Flat circuit module mounting using an elastic pad in a depression of a circuit board |
| 08/20/1996 | US5548486 Pinned module |
| 08/20/1996 | US5548372 PCB tooling apparatus for forming patterns on both sides of a substrate |
| 08/20/1996 | US5548087 Molded plastic packaging of electronic devices |
| 08/20/1996 | US5548058 Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation |
| 08/20/1996 | US5547896 Direct etch for thin film resistor using a hard mask |
| 08/20/1996 | US5547730 Device having a mounting board and method for applying a passivating gel |
| 08/20/1996 | US5547601 CFC-free solvent for solvating solder flux |
| 08/20/1996 | US5547559 Activation; cathodic electrocleaning; no smut layer formation |
| 08/20/1996 | US5547558 Applying dispersion of specific graphite or carbon black particles and inorganic binder on the surface of printed circuit to deposit carbon layer, dipping in acid, removing carbon layer and etching metal layer, electroplating |
| 08/20/1996 | US5547557 Indium-nickel alloy |
| 08/20/1996 | US5547535 Process for producing plastic laminates from continuously fed bands |
| 08/20/1996 | US5547530 Method of manufacturing a ceramic substrate |
| 08/20/1996 | US5546655 Method of applying flex tape protective coating onto a flex product |
| 08/20/1996 | US5546654 Vacuum fixture and method for fabricating electronic assemblies |
| 08/20/1996 | CA1338536C Uv curable polymer formulation |
| 08/15/1996 | WO1996024944A1 Methods of mechanical and electrical substrate connection |
| 08/15/1996 | WO1996024707A1 Method and device for galvanizing plate-shaped products in horizontal continuous plants |
| 08/15/1996 | WO1996024459A1 Method of re-melting the metal coating on a contact surface |
| 08/14/1996 | EP0726698A2 Process for selective application of solder to circuit packages |
| 08/14/1996 | EP0726697A2 Improved printed wiring board and method for preparing the same |
| 08/14/1996 | EP0726621A2 Anisotropically conductive composite medium and devices interconnected thereby |
| 08/14/1996 | EP0726597A2 Direct etch for thin film resistor using a hard mask |
| 08/14/1996 | EP0726499A1 Polymers and use in photoimageable compositions |
| 08/14/1996 | EP0726337A1 Process for preparing a non-conductive substrate for electroplating |
| 08/14/1996 | EP0726334A1 Coating preparation for pretreating metal surfaces, and method employing said preparation |
| 08/14/1996 | DE19504608A1 Process to produce position sensor |
| 08/14/1996 | DE19504378A1 Multiple layer ceramic substrate for electronic circuit |
| 08/14/1996 | DE19504350A1 Verfahren zum Umschmelzen einer Kontaktflächenmetallisierung Process of refining a Kontaktflächenmetallisierung |
| 08/14/1996 | CN2233150Y Circuit board inserted with large current conducting copper foil |
| 08/14/1996 | CN1128782A High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof |
| 08/14/1996 | CN1128703A Method and device for placing film |
| 08/13/1996 | US5546321 Method and apparatus for the cross-sectional design of multi-layer printed circuit boards |
| 08/13/1996 | US5546297 Apparatus for modifying an electrical signal |
| 08/13/1996 | US5546280 Electronic component with soldering-less terminal structure |
| 08/13/1996 | US5546279 Flexible wiring board having a terminal array extending along a whole edge of its substrate and a connection structure of the flexible wiring board with a circuit board |
| 08/13/1996 | US5546275 Electrical module mounting apparatus |
| 08/13/1996 | US5545927 Seed layers of chromium and copper |
| 08/13/1996 | US5545924 Three dimensional package for monolithic microwave/millimeterwave integrated circuits |
| 08/13/1996 | US5545598 Consists of atleast one of molybdenum and tungsten and 1 or more weight percent ceramic; used for integrated circuits |
| 08/13/1996 | US5545511 Millimeter wave device and method of making |
| 08/13/1996 | US5545510 Photodefinable dielectric composition useful in the manufacture of printed circuits |
| 08/13/1996 | US5545466 Electrolytic copper foil having matte surface roughness |
| 08/13/1996 | US5545465 Using a permanent mask with cavity openings around conductive pads on a carrier |
| 08/13/1996 | US5545452 Using gold, silver, platinum or palladium metal thionate containing atleast one functional group capable of salt formation with alkyamines or hydroxyethylamines |
| 08/13/1996 | US5545430 Method and reduction solution for metallizing a surface |
| 08/13/1996 | US5545429 Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess |
| 08/13/1996 | US5545308 Method of using conductive polymers to manufacture printed circuit boards |
| 08/13/1996 | US5545281 Forming metal bumps on surface; covering with radiation curable resin; patterning; thermocompression |
| 08/13/1996 | US5545057 Interconnection system with I/O connector module board |
| 08/13/1996 | US5544776 Using 4-methoxy-1-butanol, 3-methoxy-1-butanol and propylene carbonate; rinsing |
| 08/13/1996 | US5544773 Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method |
| 08/08/1996 | WO1996024234A1 Upgradeable voltage regulator modules |
| 08/08/1996 | WO1996024175A1 Press-fit connecting pin and electronic device using the same |
| 08/08/1996 | WO1996024069A1 Test device for flat electronic assemblies |
| 08/08/1996 | DE19504517C1 Verfahren zum Galvanisieren von plattenförmigem Behandlungsgut in horizontalen Durchlaufanlagen sowie Vorrichtung zur Durchführung des Verfahrens A method for electroplating plate-shaped material to be treated in horizontal flow systems and apparatus for carrying out the method |
| 08/08/1996 | DE19503983A1 Laser-perforated metal mask prodn. esp. for SMD technology |
| 08/08/1996 | DE19503329A1 Testvorrichtung für elektronische Flachbaugruppen Testing apparatus for electronic printed circuit boards |
| 08/08/1996 | DE19502988A1 Galvanically coating polymer surfaces |
| 08/07/1996 | EP0725438A2 Capacitor built-in type substrate |
| 08/07/1996 | EP0725434A2 Microchip module assemblies |
| 08/07/1996 | EP0725409A2 Chip-type electrolytic capacitor |
| 08/07/1996 | EP0724946A2 Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products |
| 08/07/1996 | EP0724930A1 Device comprising solder bumps formed on a substrate and process for producing these solder bumps |
| 08/07/1996 | EP0724824A1 Treatment of substrates |
| 08/07/1996 | EP0724778A1 Anodized aluminum electronic package components |
| 08/07/1996 | EP0553208B1 Method and composition for cleaning articles |
| 08/07/1996 | CN2232657Y Quick soldering machine for circuit board |
| 08/07/1996 | CN1128608A Edge-connecting printed circuit board |
| 08/07/1996 | CN1128487A Non-annular lands |
| 08/07/1996 | CN1128486A Method for forming solder bump in IC mounted board |
| 08/07/1996 | CN1128397A Core shaped aluminium electrolys capasitor |
| 08/06/1996 | US5544069 Structure having different levels of programmable integrated circuits interconnected through bus lines for interconnecting electronic components |
| 08/06/1996 | US5544018 Electrical interconnect device with customizeable surface layer and interwoven signal lines |
| 08/06/1996 | US5543663 Semiconductor device and BGA package |
| 08/06/1996 | US5543659 Package for power semiconductor device with snubber circuit |