| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/23/1996 | US5537738 Methods of mechanical and electrical substrate connection |
| 07/23/1996 | CA2051836C Personal data card construction |
| 07/18/1996 | WO1996022008A1 Low-emi electronic apparatus, low-emi circuit board, and method of manufacturing the low-emi circuit board |
| 07/18/1996 | DE19502044A1 Manufacturing multiple layer two=dimensional and three=dimensional circuit boards |
| 07/18/1996 | DE19500685A1 Circuit board with connector clamp |
| 07/17/1996 | EP0722264A2 Circuit board & circuit board assembly |
| 07/17/1996 | EP0722186A2 Laminated electronic part |
| 07/17/1996 | EP0722123A1 Apparatus and method for exposing of workpiece |
| 07/17/1996 | EP0721952A2 Adhesion additives and curable organosiloxane compositions containing same |
| 07/17/1996 | EP0721682A1 Connector device for electrically interconnecting printed circuit board like members |
| 07/17/1996 | EP0721676A1 Microwave circuit |
| 07/17/1996 | EP0721660A1 Method for assembling an electronic package |
| 07/17/1996 | EP0721659A1 Patterned array of uniform metal microbeads |
| 07/17/1996 | EP0606334B1 Azeotropic compositions of 1,1,1,2,3,4,4,5,5,5-decafluoropentane and trans-1,2-dichloroethylene, cis-1,2-dichloroethylene or 1,1-dichloroethane |
| 07/17/1996 | EP0587644B1 Printed wire boards and method of making same |
| 07/17/1996 | EP0572445B1 Piston-based ventilator design and operation |
| 07/17/1996 | EP0521982B1 Method for producing a printed circuit board |
| 07/17/1996 | CN2231474Y Tin groove device for improved automatic tin soldering furnace |
| 07/17/1996 | CN1127017A Multiple solvent cleaning system |
| 07/17/1996 | CN1126940A Semiconductor unit heat discharging device for start of motor |
| 07/17/1996 | CN1126833A Device and method for detection |
| 07/17/1996 | CN1126660A Screen printer, screen printing method, method for manufacturing image formation apparatus using such screen printing method, and image formation |
| 07/17/1996 | CN1126647A Solder paste for ball grid array |
| 07/16/1996 | US5537295 Universal reconfigurable printed circuit board |
| 07/16/1996 | US5537108 Method and structure for programming fuses |
| 07/16/1996 | US5536909 Semiconductor connection components and methods with releasable lead support |
| 07/16/1996 | US5536908 Lead-free printed circuit assembly |
| 07/16/1996 | US5536907 Semiconductor package |
| 07/16/1996 | US5536765 Method of sealing a soldered joint between a semiconductor device and a substrate |
| 07/16/1996 | US5536620 Acrylic, polyurethane acrylate |
| 07/16/1996 | US5536579 Design of high density structures with laser etch stop |
| 07/16/1996 | US5536467 Method and apparatus for producing a three-dimensional object |
| 07/16/1996 | US5536466 Process for manufacturing transparent conductive film wiring board |
| 07/16/1996 | US5536386 Modified carbon particles |
| 07/16/1996 | US5536362 Wire interconnect structures for connecting an integrated circuit to a substrate |
| 07/16/1996 | US5536175 Backplate assembly and method of making same |
| 07/16/1996 | US5535936 Fine pitch solder formation on printed circuit board process and product |
| 07/16/1996 | US5535903 Method for breaking conducting path formed on or in printed-circuit board and laser system for using the method |
| 07/16/1996 | US5535526 Apparatus for surface mounting flip chip carrier modules |
| 07/16/1996 | CA2059028C Method for cleaning electrical connectors |
| 07/11/1996 | WO1996021341A1 Method and device for the treatment of plate-shaped workpieces having small holes |
| 07/11/1996 | WO1996021340A1 Dual air knife for hot air solder levelling |
| 07/11/1996 | WO1996021245A1 Electrical circuit suspension system |
| 07/11/1996 | WO1996020983A1 Pressure-sensitive adhesive tapes for electronics applications |
| 07/11/1996 | CA2211545A1 Method and device for the treatment of plate-shaped workpieces having small holes |
| 07/10/1996 | EP0720755A1 Method for preparing negative-working wash-off relief images and non-photosensitive elements for use therein |
| 07/10/1996 | EP0632825B1 Method of cleaning epoxy articles |
| 07/10/1996 | CN1126488A Cleaning agent, cleaning method and cleaning apparatus |
| 07/10/1996 | CN1126369A Production of semiconductor units |
| 07/09/1996 | US5534969 Alignment method and apparatus in an exposing process |
| 07/09/1996 | US5534667 Printed circuit board having zig-zag contact arrangement |
| 07/09/1996 | US5534666 Multi-layer wiring board having a base block and a stacking block connected by an adhesive layer |
| 07/09/1996 | US5534466 Depositing release dielectric layer on carrier |
| 07/09/1996 | US5534312 Method for directly depositing metal containing patterned films |
| 07/09/1996 | US5534290 Surround print process for the manufacture of electrode embedded dielectric green sheets |
| 07/09/1996 | US5534128 Non-cyanide copper-zinc electroplating bath, method of surface treatment of copper foil for printed wiring board using the same and copper foil for printed wiring board |
| 07/09/1996 | US5534127 Melting a solder layer to form sphere, cooling then adding a second layer and fusion |
| 07/09/1996 | US5534094 Method for fabricating multi-layer thin film structure having a separation layer |
| 07/09/1996 | US5534078 Gradual reduction of solvent concentration in aqueous fluid |
| 07/09/1996 | US5534067 Spraying system for spraying printed circuit boards |
| 07/09/1996 | US5533904 For an inkjet printer |
| 07/09/1996 | US5533889 Apparatus for in-situ green sheet slitting |
| 07/09/1996 | US5533841 Apparatus and method of drilling |
| 07/09/1996 | US5533675 Apparatus for applying discrete coatings |
| 07/09/1996 | US5533665 Method of making a printed circuit board with adaptor pins |
| 07/09/1996 | US5533663 Solder wave measurement device |
| 07/09/1996 | US5533445 Automated printing machine and process |
| 07/09/1996 | US5533398 Method and apparatus for testing lead connections of electronic components |
| 07/09/1996 | CA2042823C Multilayer interconnection substrate |
| 07/04/1996 | WO1996020580A1 Optimally shaped solder joints |
| 07/04/1996 | WO1996020398A1 Solder wettability measuring instrument |
| 07/04/1996 | WO1996020295A1 Process for the corrosion protection of copper or copper alloys |
| 07/04/1996 | WO1996020294A1 Pretreatment solution for electroless plating, electroless plating bath and electroless plating method |
| 07/04/1996 | WO1996020252A1 Mouldings made of polyurethane hot-melt-type adhesives |
| 07/04/1996 | WO1996020242A1 Curable resin compositions |
| 07/04/1996 | WO1996020088A1 Method and apparatus for dispensing viscous material |
| 07/04/1996 | DE4446027A1 Formteile aus PU-Schmelzklebstoffen Molded polyurethane hot melt adhesives |
| 07/04/1996 | DE4438449A1 Direct contacting method for component to carrier |
| 07/04/1996 | CA2213818A1 Method and apparatus for dispensing viscous material |
| 07/03/1996 | EP0720419A1 A circuit board for liquid crystal display, a circuit module, a liquid crystal display device using them, and a method for producing the same |
| 07/03/1996 | EP0720232A1 Multi-chip module |
| 07/03/1996 | EP0720123A2 Non-contact type IC card and method and apparatus for manufacturing the same |
| 07/03/1996 | EP0719638A2 Method of fabricating plastic mask for paste printing, plastic mask for paste printing, and paste printing method |
| 07/03/1996 | EP0719451A1 Filling holes and the like in substrates |
| 07/03/1996 | EP0719442A1 Electrical assembly comprising a ptc resistive element |
| 07/03/1996 | EP0719182A1 Apparatus for spray coating |
| 07/03/1996 | EP0694220A4 Solder-bearing lead |
| 07/03/1996 | CN2230497Y Automatic tin-soldering machine |
| 07/03/1996 | CN1125998A Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
| 07/02/1996 | US5532954 Single in-line memory module |
| 07/02/1996 | US5532910 Hybrid integrated circuit and process for producing same |
| 07/02/1996 | US5532906 Wiring substrate |
| 07/02/1996 | US5532667 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
| 07/02/1996 | US5532658 Mounting structure for electronic component |
| 07/02/1996 | US5532608 Ceramic probe card and method for reducing leakage current |
| 07/02/1996 | US5532517 Hybrid integrated circuit device with heat suppression means provided in the vicinity of solder bonding areas |
| 07/02/1996 | US5532516 Semiconductor device |
| 07/02/1996 | US5532186 Process for manufacturing bumped tab tape |
| 07/02/1996 | US5532109 Low temperature prebake resistant |
| 07/02/1996 | US5532105 Having good adhesion to plated copper |