Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/1996
12/10/1996US5581877 Method of fabrication of a circuit board adapted to receive a single in-line module
12/10/1996US5581876 Method of adhering green tape to a metal support substrate with a bonding glass
12/10/1996US5581875 Method of manufacturing circuit module
12/05/1996WO1996039012A1 Electrical connection
12/05/1996WO1996038860A1 Base plate for an integrated electric circuit component
12/05/1996WO1996038858A2 Method and probe card for testing semiconductor devices
12/05/1996WO1996038253A1 Device for checking the presence of soldering paste during application to printed circuit boards which can be reflow-soldered
12/05/1996WO1996030938A3 Process for fabricating layered superlattice materials and making electronic devices including same
12/05/1996DE19520336A1 Laser soldering installation for soldering electronic components to circuit carriers
12/05/1996DE19519834A1 Measuring system contact design for simultaneous contacting and fixing system
12/04/1996EP0746189A1 Process for producing multilayer printed circuit boards
12/04/1996EP0746188A1 Use of micromodule as surface mount package and corresponding method
12/04/1996EP0746187A2 Printed-circuit board for use with card-edge connector and method therfor
12/04/1996EP0746053A1 Microwave vertical interconnect through circuit with compressible conductor
12/04/1996EP0745490A2 Method for preparation of an imaging element
12/04/1996EP0745315A1 Soldering process
12/04/1996CN1137339A Bonding inner layers in printed circuit board manufacture
12/04/1996CN1137324A Anisotropic, electrically conductive adhesive film
12/04/1996CN1137159A Thin-film capacitor and its manufacturing method, and hybrid circuit substrate and its assembling method
12/04/1996CN1136989A Vibration finishing method and apparatus for same
12/03/1996US5581492 Flexible wearable computer
12/03/1996US5581445 Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
12/03/1996US5581121 Warp-resistant ultra-thin integrated circuit package
12/03/1996US5581118 Electronic surface mount device
12/03/1996US5580668 Aluminum-palladium alloy for initiation of electroless plating
12/03/1996US5580616 Method for surface modifying a fluorocarbonpolymer
12/03/1996US5580511 Method of forming thick film pattern and material for forming thick film pattern
12/03/1996US5580466 Metal plate processing method, lead frame processing method, lead frame, semiconductor device manufacturing method, and semiconductor device
12/03/1996US5580271 SCSI cable with termination circuit and method of making
12/03/1996US5579987 Semiconductor package vertical mounting device and mounting method
12/03/1996US5579981 Reflow apparatus
12/03/1996US5579979 Heating nozzle for soldering or unsoldering integrated circuits
12/03/1996US5579690 Printer system for printing circuit patterns or like on base board
12/03/1996US5579574 Method of fabricating flat flexible circuits
12/03/1996CA1338759C Process and apparatus for electrolytically removing protective layers from sheet metal substrate
11/1996
11/28/1996WO1996038031A2 Chip socket assembly and chip file assembly for semiconductor chips
11/28/1996WO1996038029A1 Flexible printed wiring board
11/28/1996WO1996038028A1 Process for treating objects, especially electronic printed circuit boards, and device for implementing it
11/28/1996WO1996038027A1 Process for treating objects, especially electronic printed circuit boards, and device for implementing it
11/28/1996WO1996038026A1 Rigid-flex printed circuit boards
11/28/1996WO1996038025A1 Composite materials
11/28/1996WO1996037931A1 Spring element electrical contact and methods
11/28/1996WO1996037917A1 Semiconductor assembly
11/28/1996WO1996037915A1 Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink
11/28/1996WO1996037913A1 Semiconductor device having a semiconductor chip electrically connected to a wiring substrate
11/28/1996WO1996037336A1 Epoxy-based, voc-free soldering flux
11/28/1996WO1996037334A1 Method and apparatus for shaping spring elements
11/28/1996WO1996037333A1 Ribbon-like core interconnection elements
11/28/1996WO1996037332A1 Fabricating interconnects and tips using sacrificial substrates
11/28/1996WO1996037331A1 Wire bonding, severing, and ball forming
11/28/1996WO1996037330A1 Process and device for the wave or vapour-phase soldering of electronic units
11/28/1996WO1996034361A3 Laminating device for joining a metal strip and an insulating material strip
11/28/1996WO1996033419A3 Method of cleaning probe tips of probe cards and apparatus for implementing the method
11/28/1996DE3891340C2 Heat and chemical resistant photosensitive resin for printed circuits
11/28/1996DE19527056C1 Prodn. of through-contacted printed circuit boards
11/28/1996DE19519499A1 Low temp. activated hot melt adhesive films for bonding integrated circuit modules into chip or smart cards
11/28/1996DE19519211A1 Verfahren zur Behandlung von Gegenständen, insbesondere von elektronischen Leiterplatten, sowie Vorrichtung zur Durchführung dieses Verfahrens A method for treating objects, in particular of electronic circuit boards, as well as apparatus for carrying out this method
11/28/1996DE19519210A1 Verfahren zur Behandlung von Gegenständen, insbesondere von elektronischen Leiterplatten, sowie Vorrichtung zur Durchführung dieses Verfahrens A method for treating objects, in particular of electronic circuit boards, as well as apparatus for carrying out this method
11/28/1996DE19519188A1 Verfahren und Vorrichtung zum Wellen- und/oder Dampfphasenlöten elektronischer Baugruppen Method and apparatus for wave and / or vapor phase soldering of electronic components
11/28/1996DE19518706A1 Protecting opto-electronic semiconductor components mounted on circuit board
11/28/1996CA2221931A1 Semiconductor assembly
11/28/1996CA2195788A1 Flexible printed wiring board
11/27/1996EP0744885A2 Multilayer busbar construction
11/27/1996EP0744884A2 Process for producing multilayer printed circuit board
11/27/1996EP0744789A1 Electrical connection of locally divided parts
11/27/1996EP0744699A1 Neural network solder paste inspection system
11/27/1996EP0744286A2 Film applying method and apparatus for carrying out the same
11/27/1996EP0692149A4 Electrical connector
11/27/1996CN1136792A Ablative imaging by proximity lithography
11/27/1996CN1136758A Method for producing multi-layer printing circuit board
11/27/1996CN1136757A Circuit board and circuit board module
11/26/1996US5579213 Electronic component with soldering-less terminal structure
11/26/1996US5579212 Protective cover for a silicon chip device and method relating thereto
11/26/1996US5579206 Enhanced low profile sockets and module systems
11/26/1996US5578934 Method and apparatus for testing unpackaged semiconductor dice
11/26/1996US5578874 Hermetically self-sealing flip chip
11/26/1996US5578796 Apparatus for laminating and circuitizing substrates having openings therein
11/26/1996US5578696 Heat resistant adhesive film, an adhesion structure, and method of adhesion
11/26/1996US5578527 Connection construction and method of manufacturing the same
11/26/1996US5578413 Temporary substrates
11/26/1996US5578341 Roughening
11/26/1996US5578261 Method of encapsulating large substrate devices using reservoir cavities for balanced mold filling
11/26/1996US5578257 Binder removal from multilayer ceramic structures
11/26/1996US5578186 Method for forming an acrylic resist on a substrate and a fabrication process of an electronic apparatus
11/26/1996US5578159 Hot press for producing multilayer circuit board
11/26/1996US5578151 Manufacture of a multi-layer interconnect structure
11/26/1996US5577658 For a reflow soldering apparatus
11/26/1996US5577657 Method of improved oven reflow soldering
11/26/1996US5577312 Method of separating micro-joint processed products
11/21/1996WO1996037089A1 A connective medium and a process for connecting electrical devices to circuit boards
11/21/1996WO1996036991A1 Process for connecting an electric connection of an unpacked ic component to a conductive track on a substrate
11/21/1996WO1996036747A1 Composition and process for treating the surface of copper-containing metals
11/21/1996WO1996036689A1 Azeotrope-like compositions and their use
11/21/1996WO1996036450A2 Fabricating metal matrix composites containing electrical insulators
11/21/1996WO1996030932A3 Microcircuit via interconnect
11/21/1996DE19619965A1 Recovering and sepg. material from used circuit boards
11/21/1996DE19534521C1 Treating holes or recesses in workpieces esp. through holes in PCBs
11/21/1996DE19518659A1 Verfahren zum Verbinden eines elektrischen Anschlußes eines unverpackten IC-Bauelements mit einer Leiterbahn auf einem Substrat A method of connecting an electrical terminal of an unpacked IC component to a conductor track on a substrate
11/21/1996CA2219233A1 Azeotrope-like compositions and their use
11/20/1996EP0743816A1 Shocks protected electronic device by encapsulation
1 ... 944 945 946 947 948 949 950 951 952 953 954 955 956 957 958 959 960 961 962 963 964 ... 1185