Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1996
11/20/1996EP0743812A1 Multilayer printed wiring board and process for producing the same
11/20/1996EP0743716A2 Electronic component for surface mounting (SMT)
11/20/1996EP0743704A2 Method and apparatus for mounting an electrical connector on a printed wiring board
11/20/1996EP0743681A2 Wiring board for electronic devices with high-density terminals and method for producing same
11/20/1996EP0743680A2 A conductor paste for plugging through-holes in ceramic circuit boards
11/20/1996EP0742744A1 Soldering apparatus
11/20/1996EP0598006B1 Solder plate reflow method for forming a solder bump on a circuit trace
11/20/1996EP0511281B1 High density and multiple insertion connector
11/20/1996CN1136324A Photosolder resist ink, printed circuit board, and process for producing the same
11/20/1996CN1136220A Chip carrier and method of manufacturing and mounting the same
11/20/1996CN1136042A Novel adhesion additives and curable organosiloxane compositions containing same background of invention
11/20/1996CN1033320C Saturated linear polyfluorohydrocarbons, process for their production, and their use in cleaning compositions
11/19/1996US5576934 Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board
11/19/1996US5576927 Electrolytic chip capacitor
11/19/1996US5576748 Recording head with through-hole wiring connection which is disposed within the liquid chamber
11/19/1996US5576676 Base plate module for an electromagnetic switching device specifically of a contactor
11/19/1996US5576519 Anisotropic interconnect methodology for cost effective manufacture of high density printed wiring boards
11/19/1996US5576518 Via-structure of a multilayer interconnection ceramic substrate
11/19/1996US5576517 Low Dielectric constant materials for high speed electronics
11/19/1996US5576148 Process for production of printed circuit board
11/19/1996US5576147 Formation of microstructures using a preformed photoresist sheet
11/19/1996US5576144 Vinyl polymer binder for laser ablative imaging
11/19/1996US5576135 Processing method based on resist pattern formation, and resist pattern forming apparatus
11/19/1996US5576074 Binder converted to supercooled liquid upon exposure to coherent radiation, absorbing radiation with dye to heat exposure to lasers, forming patterns with toners and heating to fuse
11/19/1996US5576073 Method for patterned metallization of a substrate surface
11/19/1996US5576053 Method for forming an electrode on an electronic part
11/19/1996US5576052 Method of metallizing high aspect ratio apertures
11/19/1996US5575932 Method of making densely-packed electrical conductors
11/19/1996US5575898 Applying a conductive layer of a polythiophene, then electrodepositing copper on the walls of holes
11/19/1996US5575857 Aqueous alkaline metal descaling concentrate and method of use
11/19/1996US5575705 Slurry blasting process
11/19/1996US5575686 Stacked printed circuit boards connected in series
11/19/1996US5575662 Methods for connecting flexible circuit substrates to contact objects and structures thereof
11/19/1996US5575661 Flexible film with circuitry thereon having improved local compliance and force distribution
11/19/1996CA2091504C Case for housing an electronic apparatus, and method and mold for molding the case
11/19/1996CA2034804C Printed wiring board connector
11/14/1996WO1996036090A1 Method and apparatus for surface-mounting multi-legged components
11/14/1996DE19517625A1 Laser printing esp. on glass or plastic substrate
11/14/1996DE19516918A1 Steuergerät, insbesondere zur Steuerung von Funktionen eines Kraftfahrzeugs Control unit, in particular for controlling functions of a motor vehicle
11/13/1996EP0742681A2 Circuit card having a large module strain relief and heat sink support
11/13/1996EP0742585A1 Method and compositions for diffusion patterning tape on substrate
11/13/1996EP0742487A1 Method for preparing high resolution polyimide images using non-photosensitive layers of poly(amic acid) or salts thereof
11/13/1996EP0742468A2 Contacting device
11/13/1996EP0742265A1 Resin composition and its use in production of multilayer printed circuit board
11/13/1996EP0741804A1 Process and device for the electrolytic metal coating or etching of articles
11/13/1996EP0741636A1 A method of making a composite laminate and a pwb substrate so made
11/13/1996EP0631713B1 Process for soldering printed circuit boards under low pressure
11/13/1996EP0543974B1 A circuit board having shielded regions as well as a method of manufacturing such a board
11/13/1996CN1135794A A surface mount test point enabling hands free diagnostic testing of electronical circuits
11/13/1996CN1135658A method for jointing flat-plate displayer and integrated-circuit device
11/13/1996CN1135611A Polymer and application thereof in composition capable of optically imaging
11/12/1996US5574630 Laminated electronic package including a power/ground assembly
11/12/1996US5574629 Solderless printed wiring devices
11/12/1996US5574620 Electrical component resistant to damage by infrared radiation
11/12/1996US5574386 Apparatus and method for creating detachable solder connections
11/12/1996US5574310 Semiconductor package for surface mounting with reinforcing members on support legs
11/12/1996US5574002 Cleaning agent composition
11/12/1996US5573859 Auto-regulating solder composition
11/12/1996US5573845 Superficial coating layer having acicular structures for electrical conductors
11/12/1996US5573843 Fiber-reinforced plastic composite material for fastening pallets and process for producing the same
11/12/1996US5573815 Process for making improved metal stencil screens for screen printing
11/12/1996US5573808 Method for producing a multilayer circuit
11/12/1996US5573632 Multilayer printed-circuit substrate, wiring substrate and process of producing the same
11/12/1996US5573620 Method of manufacturing ceramic multilayer circuit component and handling apparatus for ceramic green sheet
11/12/1996US5573602 Solder paste
11/12/1996US5573409 Interconnector
11/12/1996US5573174 Automatic reflow soldering system
11/12/1996US5573172 Surface mount stress relief hidden lead package device and method
11/12/1996US5573171 Method of thin film patterning by reflow
11/12/1996US5572779 Method of making an electronic thick film component multiple terminal
11/12/1996CA2120320C Platinum catalyst and a curable organopolysiloxane composition containing said platinum catalyst
11/12/1996CA2022753C Photocurable resin laminate and method for producing printed circuit board by use thereof
11/07/1996WO1996035321A1 Method of processing printed circuit boards and device therefore
11/07/1996WO1996035129A1 Method and apparatus for testing semiconductor dice
11/07/1996WO1996034922A1 Ink varnish and composition and method of making the same
11/07/1996WO1996034744A1 Fabrication of leads on semiconductor connection components
11/07/1996WO1996025763A3 Organic chip carriers for wire bond-type chips
11/07/1996DE19516222A1 Contact soldering solder dispenser e.g. for SMD technique
11/06/1996EP0741505A2 Multilayer printed wiring board and process for manufacturing the same
11/06/1996EP0741504A2 Metal core circuit board and method of making
11/06/1996EP0741332A1 Photosensitive resin composition for sandblast resist
11/06/1996EP0740975A1 Lead free wave soldering
11/06/1996CN1135268A Contact structure for interconnections, interposer, semiconductor assembly and method
11/06/1996CN1135156A Printed circuit board having coordinate values of electronic components to be mounted thereon and method of numbering electronic components thereon
11/06/1996CN1134962A Aqueous silver composition
11/05/1996US5572451 Ordering of network line segments, in particular for calculation of interferences between lines in an electrical network
11/05/1996US5572409 Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board
11/05/1996US5572407 Apparatus for interconnecting an integrated circuit device to a multilayer printed wiring board
11/05/1996US5572346 Tape carrier for LCD driver package with anchor holes on either side of and spaced 0.2 mm to 10 mm from the chip mounting site
11/05/1996US5572175 Coaxial dielectric resonator apparatus having a plurality of side recesses located on a mount substrate
11/05/1996US5572069 Conductive epoxy grid array semiconductor packages
11/05/1996US5571852 Irradiation with uv excimer laser
11/05/1996US5571608 Apparatus and method of making laminate an embedded conductive layer
11/05/1996US5571593 Circuit carriers
11/05/1996US5571455 Comprising alloy powder, glass frit and organic vehicle; coating on photosensitive element
11/05/1996US5571429 Apparatus and process for high speed laminate processing with computer generated holograms
11/05/1996US5571365 Adhesive for printed circuit board
11/05/1996US5571340 Consisting of amine-free carboxylic acid activators and volatile alkylamines; printed circuits
11/05/1996US5570506 Polyimide with low thermal expansion
11/05/1996US5570505 Method of manufacturing a circuit module
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