Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/1996
05/23/1996WO1996015289A1 Method for directly depositing metal containing patterned films
05/23/1996DE4441477A1 Light diode unit with terminals for soldering to SMT circuit boards
05/23/1996DE19543021A1 Verfahren und Mittel zur Behandlung von Durchkontaktlöchern in mit Tauchvergoldung beschichteten Leiterplatten Methods and compositions for treatment of vias in coated with immersion gold plating PCB
05/23/1996DE19524739A1 Inhomogeneous composition bump contact for surface mounted device flip-chip technology
05/22/1996EP0713359A1 Printed circuit boards with selectively filled plated through holes
05/22/1996EP0713358A2 Circuit board
05/22/1996EP0713357A1 Thick film paste
05/22/1996EP0713356A1 Electrical circuit boards
05/22/1996EP0713252A2 Circuit elements mounting
05/22/1996EP0713229A1 Planar transformer and method of manufacture
05/22/1996EP0713146A1 Photoresist processing for improved resolution
05/22/1996EP0712534A1 Three dimensional package for monolithic microwave/millimeterwave integrated circuits
05/22/1996EP0669857A4 Method and apparatus for soldering circuit boards.
05/22/1996EP0651684B1 Apparatus and process for soldering component onto boards
05/22/1996EP0559855B1 Flat module
05/22/1996EP0506859B1 Flip chip technology using electrically conductive polymers and dielectrics
05/22/1996CN1122998A Printed board retaining structure
05/22/1996CN1122846A Cleaning agent comprising plural components and cleaning method using the same
05/22/1996CN1122738A Flux composition and corresponding soldering method
05/22/1996CN1122737A Excimer laser beam irradiation apparatus for optically processing workpiece
05/22/1996CA2161462A1 Solvent-less vapor deposition apparatus and process for application of soldering fluxes
05/21/1996US5519633 Method and apparatus for the cross-sectional design of multi-layer printed circuit boards
05/21/1996US5519586 Fuse holder assembly having improved fuse clips for mounting on a printed circuit board
05/21/1996US5519580 Electronic package
05/21/1996US5519579 Method and apparatus for replacing directly attached chip
05/21/1996US5519578 Folded printed wiring board structure with electromagnetic shield
05/21/1996US5519366 Strip line filter
05/21/1996US5519332 Carrier for testing an unpackaged semiconductor die
05/21/1996US5519251 Semiconductor device and method of producing the same
05/21/1996US5519234 Ferroelectric dielectric memory cell can switch at least giga cycles and has low fatigue - has high dielectric constant and low leakage current
05/21/1996US5519201 Smart card
05/21/1996US5519177 Dispersion of a cured heat resistant resin powder soluble in an oxidizing agent into an uncured heat resistant resin matrix hardly soluble in oxidizing agent after curing
05/21/1996US5518964 Microelectronic mounting with multiple lead deformation and bonding
05/21/1996US5518956 Method of isolating vertical shorts in an electronic array using laser ablation
05/21/1996US5518936 Forming metal layer on dielectric substrate, doping surface of metal, then oxidizing surface of metal yields new dielectric layer having greater surface resistance
05/21/1996US5518779 Forming copper clad laminates
05/21/1996US5518760 Composition and method for selective plating
05/21/1996US5518663 Thick film conductor compositions with improved adhesion
05/21/1996US5518165 Soldering techniques employing a snap bar
05/21/1996US5517758 Plating method and method for producing a multi-layered printed wiring board using the same
05/21/1996US5517756 Method of making substrate member having electrical lines and apertured insulating film
05/21/1996US5517752 Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate
05/21/1996US5517751 Multilayer microelectronic wiring module and method for forming the same
05/17/1996WO1996014660A1 Method for fabricating a self-limiting silicon based interconnect for testing bare semiconductor dice
05/17/1996WO1996014659A1 Method for forming contact pins for semiconductor dice and interconnects
05/17/1996WO1996014210A1 Stencil holder
05/15/1996EP0712266A2 Packaging electrical components
05/15/1996EP0712265A1 Electronic assembly
05/15/1996EP0712160A2 Improvements in or relating to semiconductor devices
05/15/1996EP0712157A2 Semiconductor chip package with enhanced thermal conductivity
05/15/1996EP0712153A2 Packaging electrical circuits
05/15/1996EP0712142A2 Electronic thick film component multiple terminal and method of making the same
05/15/1996EP0711802A2 Method of indicating a cure point for ultraviolet radiation curing compositions by color change
05/15/1996EP0711801A2 Method of indicating a cure point for ultraviolet radiation curing compositions by color change
05/15/1996EP0711671A1 Method for transferring ink for printing process
05/15/1996EP0711448A1 Conductive microparticles and pressure-sensitive adhesive tapes made therefrom
05/15/1996EP0672333A4 Compliant stacking connector for printed circuit boards.
05/15/1996EP0605689B1 Anisotropic electrical connection
05/15/1996EP0583426B1 Improved process for preparing a nonconductive substrate for electroplating
05/15/1996EP0555407B1 Stacked configuration for integrated circuit devices
05/15/1996EP0502120B1 Method for directly electroplating a dielectric substrate
05/15/1996EP0438504B1 High density and high signal integrity connector
05/15/1996DE19541495A1 Method for producing through contacts on a circuit board
05/15/1996DE19534165A1 Method and appts. for irradiating a workpiece surface using laser light
05/15/1996CN1122383A Method for plating insulating base material and plated attacher
05/15/1996CA2135731A1 Process for manufacturing a plastic support, apparatus for producing said support and use of said process for the production of integrated circuit boards
05/14/1996US5517234 Automatic optical inspection system having a weighted transition database
05/14/1996US5517208 Liquid crystal apparatus
05/14/1996US5517162 Dielectric resonator including a plurality of solder bumps and method of mounting dielectric resonator
05/14/1996US5516989 Structure of the flexing section of a multilayer flexible circuit board
05/14/1996US5516812 UV-moisture dual cure silicone conformal coating compositions with improved surface tack
05/14/1996US5516545 Coating processes and apparatus
05/14/1996US5516418 Thin film magnetic head
05/14/1996US5516297 Surface mount electrical devices
05/14/1996US5516032 Method for forming bump electrode
05/14/1996US5516031 Soldering method and apparatus for use in connecting electronic circuit devices
05/14/1996US5516030 Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement
05/14/1996US5515605 Apparatus and process for soldering component onto boards
05/14/1996US5515604 Methods for making high-density/long-via laminated connectors
05/09/1996WO1996013966A1 Current supply module for mounting on a component-carrying printed circuit board
05/09/1996WO1996013965A1 Method of surface mounting radio frequency components and the components
05/09/1996WO1996013866A1 Led holder
05/09/1996WO1996013728A1 Probe structure
05/09/1996WO1996013376A1 A press pad
05/09/1996WO1996013353A1 A method for joining metals by soldering
05/09/1996DE4439600A1 Continuous distribution of flowable materials with uniform thickness
05/09/1996DE4439239A1 Circuit board carrier with double-sided laminated foil system e.g. for signals transmission applications
05/09/1996DE19530373A1 Template holder for use in screen printing of printed wiring boards
05/08/1996EP0711106A1 Process for making through-hole connections in multilayer printed circuit boards
05/08/1996EP0711105A2 Method of forming solder mask
05/08/1996EP0711104A1 Packaged semiconductor, semiconductor device made therewith and method for making same
05/08/1996EP0711103A1 Surface mount assembly of devices using AdCon interconnections
05/08/1996EP0711102A1 Method for forming conductive circuit on surface of molded product, and component having conduction circuit
05/08/1996EP0710861A1 Optical module circuit board having flexible structure
05/08/1996EP0710433A1 Electrical circuits with very high conductivity and great fineness, methods of manufacture and devices comprising same
05/08/1996EP0710432A1 Process for manufacturing printed circuit foils or semifinished products for printed circuit foils, and thus manufactured printed circuit foils and semifinished products
05/08/1996EP0710431A1 Space-saving memory module
05/08/1996EP0710430A1 Processing low dielectric constant materials for high speed electronics
05/08/1996EP0710177A1 Circuit board material with barrier layer
05/08/1996EP0710161A1 Post treatment of a coated substrate with a gas containing excited halogen to remove residues
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