| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 03/06/1997 | WO1997008751A1 Imaging system and method |
| 03/06/1997 | WO1997008655A2 Screen printing method and screen printing apparatus |
| 03/06/1997 | WO1997008589A1 Film-stripping process |
| 03/06/1997 | DE19634016A1 Insulating resin compsn. for quick, easy and cost-effective PCB prodn. |
| 03/06/1997 | DE19629303A1 Textile machine with time-saving preformed lead and connector parts |
| 03/06/1997 | DE19531970A1 Verfahren zur Herstellung einer Verbindung zwischen zumindest zwei elektrischen Leitern, von denen einer auf einem Trägersubstrat angeordnet ist A method for producing a connection between at least two electrical conductors, one of which is arranged on a carrier substrate |
| 03/06/1997 | CA2226520A1 Method for film stripping |
| 03/06/1997 | CA2184435A1 Reflow soldering to mounting pads with vent channels to avoid skewing |
| 03/05/1997 | EP0760164A1 A high density integrated circuit assembly combining leadframe leads with conductive traces |
| 03/05/1997 | EP0760161A1 Process for applying a metallisation layer on an insulator and for piercing through-holes in said insulator by means of a single mask |
| 03/05/1997 | EP0760104A1 Process and system for testing the correct position of printed circuit boards having contact islands and conductor paths in a testing device |
| 03/05/1997 | EP0760023A1 Device for processing flat workpieces, in particular printed circuit boards |
| 03/05/1997 | EP0759893A1 Coating of substrates |
| 03/05/1997 | EP0705183B1 Built-on control device |
| 03/05/1997 | EP0695249B1 Electro-hydraulic pressure regulating device |
| 03/05/1997 | EP0680660B1 Conductive lacquer contact surface |
| 03/04/1997 | US5608559 Display board having wiring with three-layered structure and a display device including the display board |
| 03/04/1997 | US5608453 Automatic optical inspection system having a weighted transition database |
| 03/04/1997 | US5608434 Inklet printer |
| 03/04/1997 | US5608265 Encapsulated semiconductor device package having holes for electrically conductive material |
| 03/04/1997 | US5608262 Packaging multi-chip modules without wire-bond interconnection |
| 03/04/1997 | US5608192 Multilayer thin-film wiring board |
| 03/04/1997 | US5607818 Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition |
| 03/04/1997 | US5607795 Battery terminals of miniature electronic apparatus and structure for retaining the same |
| 03/04/1997 | US5607793 Flexible welding board for battery pack |
| 03/04/1997 | US5607609 Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering |
| 03/04/1997 | US5607538 Method of manufacturing a circuit assembly |
| 03/04/1997 | US5607313 Surface mounted holes for printed circuit boards |
| 03/04/1997 | US5607099 Solder bump transfer device for flip chip integrated circuit devices |
| 03/04/1997 | US5607097 Component-mounted circuit board production system |
| 03/04/1997 | US5606912 Screen printing tensioning device |
| 03/04/1997 | US5606911 Screen printing stencil |
| 03/04/1997 | CA2112299C Method for screen printing of paste |
| 02/27/1997 | WO1997007542A1 Epoxy resin based solder paste |
| 02/27/1997 | WO1997007541A1 Encapsulant with fluxing properties and method of use |
| 02/27/1997 | WO1997006977A1 Symmetrical circuit connection board for vehicle application |
| 02/27/1997 | WO1997006957A1 Stretching frame for use in silkscreening |
| 02/27/1997 | WO1997006911A1 Multi-spindle cnc lathe |
| 02/27/1997 | WO1997006895A1 Fluid delivery apparatus and method |
| 02/27/1997 | WO1997006853A1 Hermetically sealed electrical feedthrough for use with implantable electronic devices |
| 02/27/1997 | WO1997002578A3 Surface-mountable electrical component |
| 02/27/1997 | DE19634129A1 Flexible printed circuit with composite circuit board |
| 02/27/1997 | DE19541970C1 Surface mount switch for circuit board |
| 02/27/1997 | CA2228132A1 Multi-spindle cnc lathe |
| 02/27/1997 | CA2218883A1 Fluid delivery apparatus and method |
| 02/26/1997 | EP0759482A1 Electroplating process |
| 02/26/1997 | EP0759329A2 Cyanate ester films that promote plating adhesion to cyanate ester graphite composites |
| 02/26/1997 | EP0759208A1 Self-aligning light directing surface mountable miniature incandescent lamp |
| 02/26/1997 | EP0759100A1 Device for processing printed circuit boards |
| 02/26/1997 | EP0689504B1 Process for automatically connecting a source of electric current to laminates in a press |
| 02/26/1997 | CN1144016A Semiconductor package manufacturing method and semiconductor package |
| 02/26/1997 | CN1143919A Cleaning process |
| 02/26/1997 | CN1143892A Method and device for wave soldering incorporating dry fluxing operation |
| 02/26/1997 | CN1143554A Method for dry fluxing of metallic surface, before soldering or tinning, using atmosphere which includes water vapour |
| 02/26/1997 | CN1034112C Method and device for processing using multi pulse laser beam |
| 02/26/1997 | CA2184030A1 Method of and apparatus for providing welded joints |
| 02/25/1997 | US5606473 Unitary rigid and flexible circuit package for disk drives |
| 02/25/1997 | US5606440 Assembling method of flat type display device |
| 02/25/1997 | US5606298 Electrical relay |
| 02/25/1997 | US5606172 Exposing apparatus and exposing method of works |
| 02/25/1997 | US5605763 Electrically conductive bonding films |
| 02/25/1997 | US5605719 Presoldering |
| 02/25/1997 | US5605715 Securing electrically conductive masking element to portion of electrically conductive base, coating by electrophoresis other portions with fusible particles, heating to sintering temperature to fuse particles into dielectric layer |
| 02/25/1997 | US5605592 Method of manufacturing a bus communication system for stacked high density integrated circuit packages |
| 02/25/1997 | US5605477 Flexible etched circuit assembly |
| 02/25/1997 | US5605276 Soldering method and soldering apparatus |
| 02/25/1997 | US5605223 Conductive lacquer contact surface |
| 02/25/1997 | CA1338935C Imide prepolymer composition comprising unsaturated bis imide, diamine and an inhibitor |
| 02/20/1997 | WO1997006658A1 Controller with a housing made of at least two parts |
| 02/20/1997 | WO1997006656A2 Method of manufacturing devices comprising a base with a conductor pattern of electrical conductors |
| 02/20/1997 | WO1997006462A1 Rotating optical system for laser machining apparatus |
| 02/20/1997 | WO1997006011A1 Thermal print head |
| 02/20/1997 | DE19632866A1 Touch contact coordinate input pad |
| 02/20/1997 | DE19541316C1 Appts. for processing strip material |
| 02/20/1997 | DE19539868C1 Transport device for transport plate-like objects, esp. circuit boards for electroplating |
| 02/20/1997 | DE19530353A1 Soldering of conductor paths of flexible printed circuit to respective mounting surfaces |
| 02/20/1997 | DE19529888A1 Sequential soldering of multi-pole microelectronic surface mount devices (SMD) |
| 02/19/1997 | EP0758840A1 Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit |
| 02/19/1997 | EP0758366A1 High temperature resistant antistatic pressure-sensitive adhesive tape |
| 02/19/1997 | EP0758351A1 Energy polymerizable compositions, homopolymers and copolymers of oxazolines |
| 02/19/1997 | EP0758282A1 Process for wave-soldering printed circuit boards |
| 02/19/1997 | EP0599843B1 Reciprocally shuttled double sided screener with tiltable print squeegee |
| 02/19/1997 | CN1143418A Stable ionomeric photoresist emulsion and process of preparation and use thereof |
| 02/19/1997 | CN1143304A Method for preparing base for semiconductor assembling |
| 02/19/1997 | CN1143086A Epoxy propenoic acid resin and its use |
| 02/18/1997 | US5604831 Optical module with fluxless laser reflow soldered joints |
| 02/18/1997 | US5604667 Mounting structure for mounting a piezoelectric element |
| 02/18/1997 | US5604333 Process and structure for a solder thief on circuit boards |
| 02/18/1997 | US5604330 Staggered land pad pattern on substrate for tab interconnection |
| 02/18/1997 | US5604328 Multilayer electronic component |
| 02/18/1997 | US5604191 Composition for removal of ionic salt deposits |
| 02/18/1997 | US5604080 Also containing photocurable resin, photoinitiator, diluent, epoxy compound; storage stability |
| 02/18/1997 | US5604073 Ortho-hydroxy substituted 4-phenylazo compounds; exhibits no loss of adhesion at prebake temperature |
| 02/18/1997 | US5604026 Used to electrically connect two metal surfaces |
| 02/18/1997 | US5604018 Ceramic oxide circuit board |
| 02/18/1997 | US5603985 Block copolymer adhesion promoters via ring-opening metathesis polymerization |
| 02/18/1997 | US5603981 Forming low melting alloy of indium and gallium |
| 02/18/1997 | US5603847 Annular circuit components coupled with printed circuit board through-hole |
| 02/18/1997 | US5603795 Joining of thermoplastic substrates by microwaves |
| 02/18/1997 | US5603619 Scalable test interface port |