| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/14/1997 | US5592736 Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads |
| 01/14/1997 | CA2149929C Devices using metallized magnetic substrates |
| 01/14/1997 | CA2090099C Method of forming a multilayer printed circuit board and product thereof |
| 01/14/1997 | CA2066947C Uniformity of copper etching in the fabrication of multilayer printed circuit boards |
| 01/14/1997 | CA2018526C Methods and apparatus for reducing the reactivity of articles destined for disposal |
| 01/09/1997 | WO1997001263A1 Part holder, substrate having same, and method of manufacturing same |
| 01/09/1997 | WO1997000923A1 Adhesive compositions, bonding films made therefrom and processes for making bonding films |
| 01/09/1997 | WO1997000753A1 Solder, and soldered electronic component and electronic circuit board |
| 01/09/1997 | WO1997000752A1 Gas knife cooling system |
| 01/09/1997 | DE19524523A1 Anwendung eines Verfahrens und einer Vorrichtung zum Behandeln von Fluiden in der Leiterplattentechnik Use of a method and an apparatus for treating fluids in the circuit board art |
| 01/09/1997 | CA2224809A1 Adhesive compositions, bonding films made therefrom and processes for making bonding films |
| 01/08/1997 | EP0752808A1 Thermal and shock resistant data recorder assembly |
| 01/08/1997 | EP0752807A1 Method for fluid transport |
| 01/08/1997 | EP0752277A2 Apparatus for heating flexible plate-foil like articles, in particular printed circuit boards |
| 01/08/1997 | EP0752154A1 Printed circuit board relay with insert connections |
| 01/08/1997 | EP0751847A1 A method for joining metals by soldering |
| 01/08/1997 | EP0607255B1 Additive compositions for high thermal cycled and aged adhesion |
| 01/08/1997 | CN1140008A Multilayer printed wiring board and process for producing the same |
| 01/08/1997 | CN1139902A Process and device for resin impregnation of porous web |
| 01/08/1997 | CN1139833A Battery electrode of miniature electronic equipment and structure for fixing same |
| 01/08/1997 | CN1139821A Method of manufacturing thick-film resistor |
| 01/08/1997 | CN1139709A Method for electroplating conducting-layer on a base chip |
| 01/08/1997 | CN1139708A Method for electroplating conducting-layer on source layer |
| 01/07/1997 | US5592562 Inspection system for cross-sectional imaging |
| 01/07/1997 | US5592391 Faraday cage for a printed circuit card |
| 01/07/1997 | US5592365 Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminals even when the electrode terminals have a fine pitch |
| 01/07/1997 | US5592199 Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same |
| 01/07/1997 | US5592025 Pad array semiconductor device |
| 01/07/1997 | US5592019 Semiconductor device and module |
| 01/07/1997 | US5591941 Solder ball interconnected assembly |
| 01/07/1997 | US5591562 Water and acid developable photoresist composition exhibiting improved adhesion |
| 01/07/1997 | US5591519 Can be separated after imaging |
| 01/07/1997 | US5591488 Pretreatment of polymer surfaces prior to metallization,aliphatic diols |
| 01/07/1997 | US5591480 Method for fabricating metallization patterns on an electronic substrate |
| 01/07/1997 | US5591354 Etching plastics with nitrosyls |
| 01/07/1997 | US5591353 Reduction of surface copper thickness on surface mount printed wire boards with copper plated through holes by the chemical planarization method |
| 01/07/1997 | US5591313 Apparatus and method for localized ion sputtering |
| 01/07/1997 | US5591285 Fluorinated carbon polymer composites |
| 01/07/1997 | US5591037 Method for interconnecting an electronic device using a removable solder carrying medium |
| 01/07/1997 | US5590596 Printer system for printing circuit patterns or like on base board |
| 01/07/1997 | US5590465 Method of manufacturing connection terminals of flexible wiring pattern substrates |
| 01/07/1997 | US5590462 Process for dissipating heat from a semiconductor package |
| 01/07/1997 | US5590461 Method of making multi-layer wiring board |
| 01/07/1997 | US5590460 Method of making multilayer circuit |
| 01/07/1997 | US5590455 Apparatus for manufacturing a printed circuit board |
| 01/06/1997 | CA2180403A1 Continuous molded electrical connector |
| 01/03/1997 | WO1997000599A1 Ground plane routing |
| 01/03/1997 | WO1997000598A1 Connection substrate |
| 01/03/1997 | WO1997000537A1 Flexible leads for tape ball grid array circuit |
| 01/03/1997 | WO1997000338A2 High fatigue ductility electrodeposited copper foil |
| 01/03/1997 | CA2221756A1 Ground plane routing |
| 01/03/1997 | CA2221750A1 Flexible leads for tape ball grid array circuit |
| 01/02/1997 | EP0751700A2 Copper-clad laminate, process for producing the same, printed wiring board, and process for producing the same |
| 01/02/1997 | EP0751569A2 Hybrid power circuit |
| 01/02/1997 | EP0751563A2 Apparatus holding an electric device to a supporting part |
| 01/02/1997 | EP0751561A1 Semiconductor package manufacturing method and semiconductor package |
| 01/02/1997 | EP0751556A1 Fabrication process for an interconnection substrate allowing to connect a die to a carrier substrate |
| 01/02/1997 | EP0750791A1 Electric connections arranged in a high-density grid |
| 01/02/1997 | EP0750549A1 Bismuth coating protection for copper |
| 01/02/1997 | EP0750532A1 Cleaning process |
| 01/02/1997 | EP0710177A4 Circuit board material with barrier layer |
| 01/02/1997 | EP0662878B1 A screen printing stencil |
| 01/02/1997 | DE19620203A1 Printed circuit board |
| 01/02/1997 | DE19522838A1 Multiple circuit boards assembly method |
| 01/02/1997 | DE19522733A1 Transport for circuit boards providing simple linkage |
| 01/02/1997 | DE19522338A1 Deformable substrate through-contact production method for chip carrier |
| 01/02/1997 | CA2180075A1 Thermal and shock resistant data recorder assembly |
| 01/01/1997 | CN1139499A Electrically conductive tructured sheets |
| 01/01/1997 | CN1139399A Process and apparatus for resin impregnation of a porous web |
| 01/01/1997 | CN1139398A Process and apparatus for resin impregnation of a porous web |
| 01/01/1997 | CN1139370A Production process of flexible IC card connecting block |
| 01/01/1997 | CN1139369A Circuit board and fabricating method thereof |
| 01/01/1997 | CN1139343A Double superheterodyne tuner |
| 01/01/1997 | CN1139297A Structure and method of coupling substrates |
| 01/01/1997 | CN1139152A Saturated linear polyfluorohydrocarbons, process for their production, and their use in cleaning compositions |
| 01/01/1997 | CN1139033A Method of wave-solding assembled units |
| 12/31/1996 | US5590030 Circuit board capable of efficiently conducting heat through an inside thereof using thermal lands surrounding through-hole connections |
| 12/31/1996 | US5590029 Circuit board SMT device mounting apparatus |
| 12/31/1996 | US5590017 Alumina multilayer wiring substrate provided with high dielectric material layer |
| 12/31/1996 | US5589709 Lead frame capacitor and capacitively-coupled isolator circuit using same |
| 12/31/1996 | US5589669 Electrical contact for printed circuit boards |
| 12/31/1996 | US5589668 Multi-metal layer wiring tab tape carrier and process for fabricating the same |
| 12/31/1996 | US5589446 Process for removal of ionic salt deposits |
| 12/31/1996 | US5589280 Metal on plastic films with adhesion-promoting layer |
| 12/31/1996 | US5589255 Adhesive for electroless plating, printed circuit boards and method of producing the same |
| 12/31/1996 | US5589251 Resonant tag and method of manufacturing the same |
| 12/31/1996 | US5589250 Resin compositions and printed circuit boards using the same |
| 12/31/1996 | US5588996 Apparatus for spray coating flat surfaces |
| 12/31/1996 | US5588848 Low inductance surface-mount connectors for interconnecting circuit devices and method for using same |
| 12/31/1996 | US5588846 Right angle electrical connector |
| 12/31/1996 | US5588207 Method of manufacturing two-sided and multi-layered printed circuit boards |
| 12/31/1996 | US5588202 Method for manufacturing an overmolded sensor |
| 12/27/1996 | WO1996041699A1 Solid sphere manufacturing device |
| 12/27/1996 | EP0750370A2 Filter insert for connectors and cable |
| 12/27/1996 | EP0750325A1 Infrared shielded capacitor |
| 12/27/1996 | EP0749674A1 Apparatus having inner layers supporting surface-mount components |
| 12/27/1996 | EP0749673A1 Fabrication multilayer combined rigid/flex printed circuit board |
| 12/27/1996 | EP0749640A1 Semiconductor chip affording a high-density external interface |
| 12/27/1996 | EP0749634A1 Technique for producing interconnecting conductive links |
| 12/27/1996 | EP0749633A1 Prefabricated semiconductor chip carrier |