| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/06/1996 | US5543586 Apparatus having inner layers supporting surface-mount components |
| 08/06/1996 | US5543584 Substrate having active or passive electrical components on surface with protective coating; printed circuits |
| 08/06/1996 | US5543583 Conductive solder pad for bonding an electronic device to a ceramic substrate |
| 08/06/1996 | US5543222 Metallized polyimide film containing a hydrocarbyl tin compound |
| 08/06/1996 | US5543182 Self-accelerating and replenishing non-formaldehyde immersion coating method |
| 08/06/1996 | US5543008 Method of manufacture of a protective coating on an electronic assembly |
| 08/06/1996 | US5542987 Method for cleaning the surfaces of a motor vehicle |
| 08/06/1996 | US5542602 Alloying the deposited, compressed metal coatings with dispersed metal particles |
| 08/06/1996 | US5542601 Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate |
| 08/06/1996 | US5542595 Hot air circulation apparatus and method for wave soldering machines |
| 08/06/1996 | US5542175 Method of laminating and circuitizing substrates having openings therein |
| 08/06/1996 | US5542174 Method and apparatus for forming solder balls and solder columns |
| 08/06/1996 | CA2077286C Electrical connecting method |
| 08/02/1996 | CA2168506A1 Method for applying bonding pads on a substrate and apparatus comprising said pads |
| 08/01/1996 | WO1996023397A1 Printed circuit board and heat sink arrangement |
| 08/01/1996 | WO1996023321A1 Glass bonding layer for a ceramic circuit board support substrate |
| 08/01/1996 | WO1996023320A1 High performance integrated circuit package |
| 08/01/1996 | WO1996022949A1 Low dielectric loss glasses |
| 08/01/1996 | WO1996022882A1 Conductive via fill inks for ceramic multilayer circuit boards on support substrates |
| 08/01/1996 | WO1996022881A1 Electrical feedthroughs for ceramic circuit board support substrates |
| 08/01/1996 | WO1996022864A1 Laser-machineable articles |
| 08/01/1996 | WO1996022842A1 Roughening of metal surfaces |
| 08/01/1996 | DE19542043A1 Bleifreie Niedertemperaturlegierung und Verfahren zur Bildung einer mechanisch überlegenen Verbindung unter Verwendung dieser Legierung A lead-free low-temperature alloy and method of forming a mechanically superior compound using this alloy |
| 08/01/1996 | DE19502896A1 Appts. with rolling blade for sepn. of pre-scored circuit boards |
| 08/01/1996 | DE19502408A1 Printed circuit board edge connector |
| 07/31/1996 | EP0724304A2 Battery terminal of miniature electronic apparatus and structure for retaining the same |
| 07/31/1996 | EP0723737A1 Removable computer peripheral cards having a solid one-piece housing and method of manufacturing the same |
| 07/31/1996 | EP0723736A1 Bonding inner layers in printed circuit board manufacture |
| 07/31/1996 | EP0723472A1 Cleaning method |
| 07/31/1996 | EP0671041B1 Detection tag |
| 07/31/1996 | EP0605431A4 Contact having a mass of reflowable solderable material thereon. |
| 07/31/1996 | EP0581823B1 Means for the selective formation of a thin oxidising layer |
| 07/31/1996 | EP0497925B1 Method for printed circuit board pattern making using selectively etchable metal layers |
| 07/31/1996 | CN1128040A Electrically conductive adhesive compositions |
| 07/31/1996 | CN1127980A Fixing end structure of electronic unit |
| 07/30/1996 | US5541813 Portable telephone apparatus having case with wiring member embedded in a molded plastic hinge |
| 07/30/1996 | US5541812 Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame |
| 07/30/1996 | US5541731 Interferometric measurement and alignment technique for laser scanners |
| 07/30/1996 | US5541687 Electronic flash assemblage with reflector to circuit board connection |
| 07/30/1996 | US5541567 Coaxial vias in an electronic substrate |
| 07/30/1996 | US5541565 High frequency microelectronic circuit enclosure |
| 07/30/1996 | US5541525 Carrier for testing an unpackaged semiconductor die |
| 07/30/1996 | US5541450 Low-profile ball-grid array semiconductor package |
| 07/30/1996 | US5541449 Semiconductor chip carrier affording a high-density external interface |
| 07/30/1996 | US5541368 Laminated multi chip module interconnect apparatus |
| 07/30/1996 | US5541367 Printed circuit board having a land with an inwardly facing surface and method for manufacturing same |
| 07/30/1996 | US5541366 Foam printed circuit substrates |
| 07/30/1996 | US5541005 Semiconductor substrate |
| 07/30/1996 | US5540951 Supplying liquid dispersion of fine particles to substrate, reducing thickness of medium to diameter of particles, controlling thickness to assemble two-dimensional array by action of lateral capillary force and laminar flow |
| 07/30/1996 | US5540884 Ceramic green sheet from aluminum nitride with aluminum oxide and metal oxide or metal halides, forming patterns of metal pastes, lamination and heat treatment for sintering |
| 07/30/1996 | US5540809 Apparatus for removing protective films |
| 07/30/1996 | US5540779 Apparatus for manufacture of multi-layer ceramic interconnect structures |
| 07/30/1996 | US5540772 Misted deposition apparatus for fabricating an integrated circuit |
| 07/30/1996 | US5540379 Soldering process |
| 07/30/1996 | US5540378 Method for the assembly of an electronic package |
| 07/30/1996 | US5540376 Angled pallets for wave soldering |
| 07/30/1996 | US5540222 Piston-based ventilator design and operation |
| 07/30/1996 | US5539966 Machining head for machining boards |
| 07/25/1996 | WO1996022670A1 Production of electrical circuit boards |
| 07/25/1996 | WO1996022622A1 Silicon segment programming method and apparatus |
| 07/25/1996 | WO1996022620A1 Conductive epoxy flip-chip |
| 07/25/1996 | WO1996022597A1 Laminate |
| 07/25/1996 | WO1996002922A3 Variable voltage protection structures and methods for making same |
| 07/25/1996 | DE4345316A1 Outer rotor motor or outer armature motor |
| 07/25/1996 | DE19502750A1 Circuit board cleaning brush with anti-electrostatic-charge feature |
| 07/24/1996 | EP0723388A1 Printed circuit board |
| 07/24/1996 | EP0723387A1 Soldermask gasketing of printed wiring board surface mount pads |
| 07/24/1996 | EP0723201A1 Phenolic-resins with acid-labile protecting groups |
| 07/24/1996 | EP0723007A1 Azeotrope and azeotrope-like compositions of octamethyltrisiloxane |
| 07/24/1996 | EP0722969A1 Aromatic polyimides derived from aromatic dianhydrides and chlorinated aromatic diamines |
| 07/24/1996 | EP0722653A1 Metal-cored printed circuit board for insertion into the casing of an electronic device |
| 07/24/1996 | EP0722512A1 Copper etchant solution additives |
| 07/24/1996 | CN1127567A Conductive microparticles and pressure-sensitive adhesive tapes made therefrom |
| 07/24/1996 | CN1127293A Cleaning composition |
| 07/24/1996 | CN1127193A Net plate printing apparatus and method |
| 07/24/1996 | CN1127191A Adhesion method capable of controlling effectively thickness of adhibited layer |
| 07/23/1996 | US5539619 Branch joint box |
| 07/23/1996 | US5539618 Electrical device, in particular switching or controlling device for motor vehicle |
| 07/23/1996 | US5539611 Interface connection through an insulating part |
| 07/23/1996 | US5539324 Universal wafer carrier for wafer level die burn-in |
| 07/23/1996 | US5539224 Semiconductor device having unit circuit-blocks in a common chip as a first layer with electrical interconnections therebetween provided exclusively in a second, upper, interconnection layer formed on the first layer |
| 07/23/1996 | US5539218 Epoxy resin, acid anhydride, catalyst and filler |
| 07/23/1996 | US5539186 Temperature controlled multi-layer module |
| 07/23/1996 | US5539181 Interconnect structure |
| 07/23/1996 | US5539174 Clean laser cutting of metal lines on microelectronic circuit substrates using reactive gases |
| 07/23/1996 | US5539156 Circuit board |
| 07/23/1996 | US5539153 Method of bumping substrates by contained paste deposition |
| 07/23/1996 | US5539064 Applying resist film to substrate surface of printed circuit board to generate pre cured resist film, selectively exposing pre cured film to ultraviolet radiation by using photo tool artwork, developing, and curing |
| 07/23/1996 | US5538832 Developing solution for producing printed circuit boards and a process for producing printed circuit boards wherein the developing solution comprises a quaternary ammonium hydroxide and a quaternary ammonium carbonate |
| 07/23/1996 | US5538821 Solder resist, resist for electroless deposition of gold, epoxy novalak resin reacted with hydroxyl compound and polybasic unsaturated carboxylic acid |
| 07/23/1996 | US5538789 Adherent layer of thermosetting resin capable of b-stage curing |
| 07/23/1996 | US5538754 Process for applying fluid on discrete substrates |
| 07/23/1996 | US5538686 Article comprising a PB-free solder having improved mechanical properties |
| 07/23/1996 | US5538616 Process for copper plating a wiring board |
| 07/23/1996 | US5538582 Method for forming cavities without using an insert |
| 07/23/1996 | US5538433 Electrical connector comprising multilayer base board assembly |
| 07/23/1996 | US5538175 Adjustment of a solder wave process in real-time |
| 07/23/1996 | US5538024 Cleaning method and cleaning apparatus |
| 07/23/1996 | US5537740 Method of making printed circuit board |
| 07/23/1996 | US5537739 Method for electoconductively connecting contacts |