Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/1996
12/27/1996EP0749594A1 Stable, ionomeric photoresist emulsion and process of preparation and use thereof
12/27/1996EP0696411B1 Improvements relating to component mounting arrangements
12/27/1996EP0677090A4 Ink composition and method of making, using and recovering such composition.
12/27/1996EP0663108B1 Contacting device for a film with several conductor tracks
12/27/1996EP0660762A4 Oil based composition clean up method and composition for use therein.
12/27/1996EP0629148B1 Transport device and process for a vapour-phase soldering installation
12/25/1996CN1033672C Thin film electrical component
12/24/1996US5587920 Computer including a Faraday cage on printed circuit board
12/24/1996US5587890 Vehicle electric power distribution system
12/24/1996US5587885 Mechanical printed circuit board/laminated multi chip module interconnect apparatus
12/24/1996US5587557 Printed circuit board and liquid crystal display
12/24/1996US5587450 Process for producing aromatic polyamide film
12/24/1996US5587341 Process for manufacturing a stacked integrated circuit package
12/24/1996US5587275 Photosensitive resin composition and a process for forming a patterned polyimide film using the same
12/24/1996US5587119 Method for manufacturing a coaxial interconnect
12/24/1996US5586892 Electrically connecting structure
12/24/1996US5586715 Method of making solder balls by contained paste deposition
12/19/1996WO1996041509A1 Method for making a debossed conductive film composite
12/19/1996WO1996041508A1 Method for making a conductive film composite
12/19/1996WO1996041507A1 Low profile semiconductor die carrier
12/19/1996WO1996041506A1 Photolithographically patterned spring contact
12/19/1996WO1996041377A1 High performance semiconductor die carrier
12/19/1996WO1996041327A1 Tesselated electroluminescent display having a multilayer ceramic substrate
12/19/1996WO1996041030A1 Method for producing metal matrix composites incorporating partially sintered preforms
12/19/1996WO1996040522A1 Apparatus and process for directly printing an electrical circuit component onto a substrate
12/19/1996WO1996040509A1 Debossable films
12/19/1996WO1996040507A1 Conductive film composite
12/19/1996WO1996040443A1 A press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid and a method for making such a press
12/19/1996DE19521750A1 Oxide film removal from metal, used e.g. metal-polymer contact prodn.
12/19/1996CA2224147A1 Apparatus and process for directly printing an electrical circuit component onto a substrate
12/19/1996CA2224091A1 A press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid and a method for making such a press
12/19/1996CA2223544A1 Debossable films
12/19/1996CA2223538A1 Conductive film composite
12/19/1996CA2223304A1 Method for making a debossed conductive film composite
12/18/1996EP0749155A2 Composite electronic coatings
12/18/1996EP0749009A1 Solder wettability measuring instrument
12/18/1996EP0748511A1 Thermistor
12/18/1996EP0748507A1 Anisotropically conducting adhesive
12/18/1996EP0748473A1 Flexible wearable computer
12/18/1996EP0748261A1 Layered chip structure
12/18/1996EP0748176A1 Method for increasing the gloss of a surface
12/18/1996EP0656171B1 A multiple layer printed circuit board
12/18/1996CN1138286A Wiring construction body, method of manufacturing same, and circuit board using wiring construction body
12/18/1996CN1138229A Board mounted connector
12/17/1996US5586009 Bus communication system for stacked high density integrated circuit packages
12/17/1996US5586008 Gravity latch for surface mount components
12/17/1996US5586007 Circuit board having improved thermal radiation
12/17/1996US5586006 Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together
12/17/1996US5585670 Semiconductor device package
12/17/1996US5585602 Structure for providing conductive paths
12/17/1996US5585421 Composition dispensable at high speed for bonding electric parts to printed wiring boards
12/17/1996US5585282 Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor
12/17/1996US5585162 Ground plane routing
12/17/1996US5584956 Method for producing conductive or insulating feedthroughs in a substrate
12/17/1996US5584788 Machine for mechanically machining boards, in particular printed circuit boards
12/17/1996US5584704 Device for the common electrical contacting of a plurality of electrically excitable aggregates of internal combustion engines
12/17/1996US5584617 Single flute drill for drilling holes in printed circuit boards and method of drilling holes in a printed circuit board
12/17/1996US5584121 Epoxy resin blend adhesive
12/17/1996US5584120 Method of manufacturing printed circuits
12/12/1996WO1996039796A1 Printed wiring board
12/12/1996WO1996039469A1 Cyanacrylate adhesive
12/12/1996WO1996039294A1 Vacuum lamination device and vacuum lamination method
12/12/1996DE19622971A1 Semiconductor device for SMT and mfg. method
12/12/1996DE19622464A1 Licht- und wärmehärtbare Zusammensetzung, die mit einer wässerigen Alkalilösung entwickelbar ist Photocurable and thermosetting composition which is developable with an aqueous alkali solution
12/12/1996DE19615982C1 Plastics bobbin e.g. for SMD choke or transformer
12/12/1996DE19536275C1 Circuit board mounted display device for telecommunication terminal
12/12/1996DE19528315A1 Method of soldering insulated wire with uninsulated end into circuit board soldering hole
12/11/1996EP0748152A2 Method for mounting an electronic component on a wiring substrate and an illuminated switch unit using this mounting method
12/11/1996EP0748151A1 Method of metal-plating electrode portions of printed-wiring board
12/11/1996EP0748150A2 Precision fluid head transport
12/11/1996EP0747997A2 Microstrip flexible printed wiring board interconnect line
12/11/1996EP0747955A2 Hybrid circuit and method of fabrication
12/11/1996EP0747954A2 Reflowed solder ball with low melting point metal cap
12/11/1996EP0747911A1 Method of manufacturing thick-film resistor
12/11/1996EP0747770A2 One-package type photosolder resist composition developable with aqueous alkali solution and method for production of printed circuit board by use thereof
12/11/1996EP0747769A2 Process for producing photoimageable films prepared from aqueous photoimageable liquid emulsions
12/11/1996EP0747507A1 Pretreatment solution for electroless plating, electroless plating bath and electroless plating method
12/11/1996EP0747160A2 Process and device for wave soldering integrating a dry reflow operation
12/11/1996EP0747159A1 Dry fluxing process of metallic surfaces before brazing, using an atmosphere comprising steam
12/11/1996EP0746884A1 Spring biased tapered contact element
12/11/1996EP0746640A1 Method of electrolytically depositing metals from electrolytes containing organic additives
12/11/1996EP0746638A1 Surface treatment of an object
12/11/1996EP0746482A1 Sensor unit for the control of a vehicle-occupant protection system
12/11/1996EP0608221B1 Interconnector
12/11/1996EP0326577B1 Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products
12/11/1996CN1137734A Thermoformed three dimensional wiring module
12/11/1996CN1137733A Cleaning device for contact surface on PCB
12/11/1996CN1137641A Method and compositions for diffusion patierning tape on substrate
12/10/1996US5583747 Thermoplastic interconnect for electronic device and method for making
12/10/1996US5583546 Streak-detector for ink jet printer
12/10/1996US5583377 Pad array semiconductor device having a heat sink with die receiving cavity
12/10/1996US5583321 Multi-layer circuit construction methods and structures with customization features and components for use therein
12/10/1996US5583320 Reinforcement for flexible printed circuit board and reinforced flexible printed circuit board
12/10/1996US5583285 Method for detecting a coating material on a substrate
12/10/1996US5582954 Process for preparing photohardenable elastomeric element having increased exposure latitude
12/10/1996US5582858 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
12/10/1996US5582753 Method of heating a strip-shaped carrier in an oven and device for fastening at least one component on a strip-shaped carrier
12/10/1996US5582745 Method of making circuit boards with locally enhanced wiring density
12/10/1996US5582104 Apparatus and process for screen printing
12/10/1996US5582024 Copper article with protective coating