Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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12/27/1996 | EP0749594A1 Stable, ionomeric photoresist emulsion and process of preparation and use thereof |
12/27/1996 | EP0696411B1 Improvements relating to component mounting arrangements |
12/27/1996 | EP0677090A4 Ink composition and method of making, using and recovering such composition. |
12/27/1996 | EP0663108B1 Contacting device for a film with several conductor tracks |
12/27/1996 | EP0660762A4 Oil based composition clean up method and composition for use therein. |
12/27/1996 | EP0629148B1 Transport device and process for a vapour-phase soldering installation |
12/25/1996 | CN1033672C Thin film electrical component |
12/24/1996 | US5587920 Computer including a Faraday cage on printed circuit board |
12/24/1996 | US5587890 Vehicle electric power distribution system |
12/24/1996 | US5587885 Mechanical printed circuit board/laminated multi chip module interconnect apparatus |
12/24/1996 | US5587557 Printed circuit board and liquid crystal display |
12/24/1996 | US5587450 Process for producing aromatic polyamide film |
12/24/1996 | US5587341 Process for manufacturing a stacked integrated circuit package |
12/24/1996 | US5587275 Photosensitive resin composition and a process for forming a patterned polyimide film using the same |
12/24/1996 | US5587119 Method for manufacturing a coaxial interconnect |
12/24/1996 | US5586892 Electrically connecting structure |
12/24/1996 | US5586715 Method of making solder balls by contained paste deposition |
12/19/1996 | WO1996041509A1 Method for making a debossed conductive film composite |
12/19/1996 | WO1996041508A1 Method for making a conductive film composite |
12/19/1996 | WO1996041507A1 Low profile semiconductor die carrier |
12/19/1996 | WO1996041506A1 Photolithographically patterned spring contact |
12/19/1996 | WO1996041377A1 High performance semiconductor die carrier |
12/19/1996 | WO1996041327A1 Tesselated electroluminescent display having a multilayer ceramic substrate |
12/19/1996 | WO1996041030A1 Method for producing metal matrix composites incorporating partially sintered preforms |
12/19/1996 | WO1996040522A1 Apparatus and process for directly printing an electrical circuit component onto a substrate |
12/19/1996 | WO1996040509A1 Debossable films |
12/19/1996 | WO1996040507A1 Conductive film composite |
12/19/1996 | WO1996040443A1 A press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid and a method for making such a press |
12/19/1996 | DE19521750A1 Oxide film removal from metal, used e.g. metal-polymer contact prodn. |
12/19/1996 | CA2224147A1 Apparatus and process for directly printing an electrical circuit component onto a substrate |
12/19/1996 | CA2224091A1 A press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid and a method for making such a press |
12/19/1996 | CA2223544A1 Debossable films |
12/19/1996 | CA2223538A1 Conductive film composite |
12/19/1996 | CA2223304A1 Method for making a debossed conductive film composite |
12/18/1996 | EP0749155A2 Composite electronic coatings |
12/18/1996 | EP0749009A1 Solder wettability measuring instrument |
12/18/1996 | EP0748511A1 Thermistor |
12/18/1996 | EP0748507A1 Anisotropically conducting adhesive |
12/18/1996 | EP0748473A1 Flexible wearable computer |
12/18/1996 | EP0748261A1 Layered chip structure |
12/18/1996 | EP0748176A1 Method for increasing the gloss of a surface |
12/18/1996 | EP0656171B1 A multiple layer printed circuit board |
12/18/1996 | CN1138286A Wiring construction body, method of manufacturing same, and circuit board using wiring construction body |
12/18/1996 | CN1138229A Board mounted connector |
12/17/1996 | US5586009 Bus communication system for stacked high density integrated circuit packages |
12/17/1996 | US5586008 Gravity latch for surface mount components |
12/17/1996 | US5586007 Circuit board having improved thermal radiation |
12/17/1996 | US5586006 Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together |
12/17/1996 | US5585670 Semiconductor device package |
12/17/1996 | US5585602 Structure for providing conductive paths |
12/17/1996 | US5585421 Composition dispensable at high speed for bonding electric parts to printed wiring boards |
12/17/1996 | US5585282 Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor |
12/17/1996 | US5585162 Ground plane routing |
12/17/1996 | US5584956 Method for producing conductive or insulating feedthroughs in a substrate |
12/17/1996 | US5584788 Machine for mechanically machining boards, in particular printed circuit boards |
12/17/1996 | US5584704 Device for the common electrical contacting of a plurality of electrically excitable aggregates of internal combustion engines |
12/17/1996 | US5584617 Single flute drill for drilling holes in printed circuit boards and method of drilling holes in a printed circuit board |
12/17/1996 | US5584121 Epoxy resin blend adhesive |
12/17/1996 | US5584120 Method of manufacturing printed circuits |
12/12/1996 | WO1996039796A1 Printed wiring board |
12/12/1996 | WO1996039469A1 Cyanacrylate adhesive |
12/12/1996 | WO1996039294A1 Vacuum lamination device and vacuum lamination method |
12/12/1996 | DE19622971A1 Semiconductor device for SMT and mfg. method |
12/12/1996 | DE19622464A1 Licht- und wärmehärtbare Zusammensetzung, die mit einer wässerigen Alkalilösung entwickelbar ist Photocurable and thermosetting composition which is developable with an aqueous alkali solution |
12/12/1996 | DE19615982C1 Plastics bobbin e.g. for SMD choke or transformer |
12/12/1996 | DE19536275C1 Circuit board mounted display device for telecommunication terminal |
12/12/1996 | DE19528315A1 Method of soldering insulated wire with uninsulated end into circuit board soldering hole |
12/11/1996 | EP0748152A2 Method for mounting an electronic component on a wiring substrate and an illuminated switch unit using this mounting method |
12/11/1996 | EP0748151A1 Method of metal-plating electrode portions of printed-wiring board |
12/11/1996 | EP0748150A2 Precision fluid head transport |
12/11/1996 | EP0747997A2 Microstrip flexible printed wiring board interconnect line |
12/11/1996 | EP0747955A2 Hybrid circuit and method of fabrication |
12/11/1996 | EP0747954A2 Reflowed solder ball with low melting point metal cap |
12/11/1996 | EP0747911A1 Method of manufacturing thick-film resistor |
12/11/1996 | EP0747770A2 One-package type photosolder resist composition developable with aqueous alkali solution and method for production of printed circuit board by use thereof |
12/11/1996 | EP0747769A2 Process for producing photoimageable films prepared from aqueous photoimageable liquid emulsions |
12/11/1996 | EP0747507A1 Pretreatment solution for electroless plating, electroless plating bath and electroless plating method |
12/11/1996 | EP0747160A2 Process and device for wave soldering integrating a dry reflow operation |
12/11/1996 | EP0747159A1 Dry fluxing process of metallic surfaces before brazing, using an atmosphere comprising steam |
12/11/1996 | EP0746884A1 Spring biased tapered contact element |
12/11/1996 | EP0746640A1 Method of electrolytically depositing metals from electrolytes containing organic additives |
12/11/1996 | EP0746638A1 Surface treatment of an object |
12/11/1996 | EP0746482A1 Sensor unit for the control of a vehicle-occupant protection system |
12/11/1996 | EP0608221B1 Interconnector |
12/11/1996 | EP0326577B1 Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products |
12/11/1996 | CN1137734A Thermoformed three dimensional wiring module |
12/11/1996 | CN1137733A Cleaning device for contact surface on PCB |
12/11/1996 | CN1137641A Method and compositions for diffusion patierning tape on substrate |
12/10/1996 | US5583747 Thermoplastic interconnect for electronic device and method for making |
12/10/1996 | US5583546 Streak-detector for ink jet printer |
12/10/1996 | US5583377 Pad array semiconductor device having a heat sink with die receiving cavity |
12/10/1996 | US5583321 Multi-layer circuit construction methods and structures with customization features and components for use therein |
12/10/1996 | US5583320 Reinforcement for flexible printed circuit board and reinforced flexible printed circuit board |
12/10/1996 | US5583285 Method for detecting a coating material on a substrate |
12/10/1996 | US5582954 Process for preparing photohardenable elastomeric element having increased exposure latitude |
12/10/1996 | US5582858 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier |
12/10/1996 | US5582753 Method of heating a strip-shaped carrier in an oven and device for fastening at least one component on a strip-shaped carrier |
12/10/1996 | US5582745 Method of making circuit boards with locally enhanced wiring density |
12/10/1996 | US5582104 Apparatus and process for screen printing |
12/10/1996 | US5582024 Copper article with protective coating |