Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1996
10/15/1996US5565261 Selective call radio having a ceramic substrate for circuit device interconnection
10/15/1996US5565235 Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate
10/15/1996US5565119 Method and apparatus for soldering with a multiple tip and associated optical fiber heating device
10/15/1996US5565040 Method for fluid treating a substrate
10/15/1996US5565033 Pressurized injection nozzle for screening paste
10/15/1996US5564932 Customizeable interconnect device for stacking electrical components of varying configuration
10/15/1996US5564617 Method and apparatus for assembling multichip modules
10/15/1996US5564183 Producing system of printed circuit board and method therefor
10/15/1996US5564182 Method for installing axial multiple
10/15/1996US5564159 Closed-loop multistage system for cleaning printed circuit boards
10/10/1996WO1996031998A1 Removable computer peripheral cards having a solid one-piece housing and method of manufacturing the same
10/10/1996WO1996031891A1 Method and apparatus for assembling polarized electrical devices on a printed circuit board and for testing the assembled combination
10/10/1996WO1996031806A1 Coating compositions
10/10/1996WO1996031574A1 Adhesive, adhesive film and adhesive-backed metal foil
10/10/1996DE19524593A1 Objects arrangement e.g. for components on suface of circuit board
10/10/1996DE19512838A1 Circuit board exposed to large temp. variations
10/09/1996EP0737027A2 Integrated circuit testing board having constrained thermal expansion characteristics
10/09/1996EP0737026A1 Circuit board electrical connector
10/09/1996EP0737025A1 Printed wiring board
10/09/1996EP0736568A1 Resin composition to be plated
10/09/1996EP0736555A2 Radiation-curable epoxy resin composition
10/09/1996EP0736354A2 Method for wave soldering electronic components
10/09/1996EP0736242A1 Method of surface mounting radio frequency components and the components
10/09/1996EP0735949A1 A press pad
10/09/1996EP0640041B1 Process for producing plastic laminates with metal laminae, especially for printed circuits
10/09/1996EP0627021B1 Process for metallizing non-conducting surfaces, and the use of hydroxymethyl sulphinic acid in that process
10/09/1996CN2237317Y Soldering groove device for improved automatic solding machine
10/09/1996CN1132931A Method of connecting terminals of one electronic part to terminals of another electronic part
10/09/1996CN1132688A Heat-resisting cushion material and producing the same
10/09/1996CN1132673A Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same
10/08/1996US5563773 Semiconductor module having multiple insulation and wiring layers
10/08/1996US5563619 Liquid crystal display with integrated electronics
10/08/1996US5563446 Surface mount peripheral leaded and ball grid array package
10/08/1996US5563442 For an electronic package
10/08/1996US5563380 Apparatus for mounting integrated circuit chips on a Mini-Board
10/08/1996US5562973 Ceramic multi-layer wiring board
10/08/1996US5562971 Multilayer printed wiring board
10/08/1996US5562970 Multilayer circuit structure having projecting via lead
10/08/1996US5562814 Includes a sulfonic acid and an alkali carbonate salt to reduce tin oxidation
10/08/1996US5562760 Copper on printed circuits
10/08/1996US5562496 Surface mount electrical connector with improved grounding element
10/08/1996US5562472 Contact-making device for connecting a conductor film which has a plurality of contact conductor tracks
10/08/1996US5562243 Method an apparatus for obtaining reflow oven settings for soldering a PCB
10/08/1996CA2171648A1 Circuit board electrical connector
10/03/1996WO1996031103A1 Printed circuit board arrangement
10/03/1996WO1996031102A1 Arrangement for the manufacture of multilayers
10/03/1996WO1996031100A1 Package of electronic device
10/03/1996WO1996030966A1 System and process for producing electrically conductive connecting structures and a process for producing circuits and printed circuits
10/03/1996WO1996030939A1 Process for surface contacting electronic components
10/03/1996WO1996030938A2 Process for fabricating layered superlattice materials and making electronic devices including same
10/03/1996WO1996030932A2 Microcircuit via interconnect
10/03/1996WO1996030887A1 Plasma addressed liquid crystal display with etched electrodes
10/03/1996WO1996030452A1 Water-base photosensitive resin composition
10/03/1996WO1996030451A1 Water-base photosensitive resin composition
10/03/1996WO1996030262A1 Verification and loading of precision drill bits
10/03/1996CA2215420A1 Waterborne photosensitive resin composition
10/03/1996CA2215418A1 Waterborne photosensitive resin composition
10/03/1996CA2211913A1 Microcircuit via interconnect
10/03/1996CA2191338A1 Plasma addressed liquid crystal display with etched electrodes
10/02/1996EP0735809A2 Photodefinable dielectric composition useful in the manufacture of printed circuits
10/02/1996EP0735808A1 SMD correction for electronic control devices in vehicles
10/02/1996EP0735807A1 Electric-circuit board for a display apparatus
10/02/1996EP0735625A2 Board mounted connector
10/02/1996EP0735622A2 Connecting structure for connecting connector terminal unit with wiring board, and assembling method thereof
10/02/1996EP0735579A1 Structure and method of coupling substrates
10/02/1996EP0735578A1 Ablation patterning of multi-layered structures
10/02/1996EP0735559A2 Base for an electromagnetic switch device, particularly a protective switch
10/02/1996EP0735100A2 Curable organopolysiloxane composition
10/02/1996EP0734644A1 Device for automatically fitting upper and lower sides of printed circuit boards with smd components
10/02/1996EP0734642A1 Process and device for automatically fitting the top and bottom sides of printed circuit boards with smd components
10/02/1996EP0734576A1 Anisotropic, electrically conductive adhesive film
10/02/1996EP0734325A1 Ablative imaging by proximity lithography
10/02/1996EP0734303A1 Heat-transfer device for use in a convective-heat installation, in particular a convective-heat soldering installation
10/02/1996EP0593584B1 Electrical connection system
10/02/1996DE4446099A1 Hybrid, integrated, thick-film circuit e.g. for telecommunications equipment
10/02/1996DE19611240A1 Conductive printing paste contg. silver@-based powder
10/02/1996DE19611239A1 Conductive paste for connections in ceramic electronic devices
10/02/1996DE19512272A1 Mfg. method for multilayer circuit boards e.g. for entertainment electronics
10/02/1996DE19511898A1 Verfahren zur Flächenkontaktierung elektronischer Bauelemente A method for surface contact of electronic components
10/02/1996DE19511487A1 Verfahren zur Herstellung einer Leiterplattenanordnung A process for producing a circuit board assembly
10/02/1996DE19511486A1 Mfr. of laminated circuit boards e.g. for control units in motor vehicle engineering
10/02/1996DE19510469A1 Input-output unit for digital controller
10/02/1996CN1132570A Patterned array of uniform metal microbeads
10/02/1996CN1132530A Metal membrane and its products
10/02/1996CN1132463A Method of laminating and circuitizing substrates having opening therein
10/02/1996CN1132462A Multi-strand substrate for ball-grid array assemblies and method
10/02/1996CN1132413A Multi-layered mixed integrated thick-film circuit
10/02/1996CN1132142A Single side metal-clad laminate
10/02/1996CN1032944C Method and appts. for use in forming prepositioned solder bumps on a pad arrangement
10/01/1996US5561594 Circuit connection in an electrical assembly
10/01/1996US5561592 Hybrid integrated circuit module
10/01/1996US5561539 Color liquid crystal display having a bent tape carrier package
10/01/1996US5561328 Photo-definable template for semiconductor chip alignment
10/01/1996US5561322 Semiconductor chip package with enhanced thermal conductivity
10/01/1996US5561321 Ceramic-metal composite structure and process of producing same
10/01/1996US5561204 Particles of amine-epoxy adduct
10/01/1996US5561011 Method for manufacturing a substrate having window-shaped coating films and frame-shaped coating film on the surface thereof
10/01/1996US5560963 Plamsa polymerizating a coating on a tool
10/01/1996US5560870 Composition for forming an electrically conductive layer to be used in patterning
10/01/1996US5560840 Aqueous solution of ferric ammonium sulfsate and acid
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