| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/01/1996 | US5560813 Solder electroplating solution containing gelatin |
| 10/01/1996 | US5560795 Process for manufacturing a printed circuit board and printed circuit board |
| 10/01/1996 | US5560785 Treating surface with solution of imidazole compound, copper compound, zinc compound, stabilizers |
| 10/01/1996 | US5560537 Automatic soldering |
| 10/01/1996 | US5560534 Soldering apparatus |
| 10/01/1996 | CA2102824C Localized surface glazing of ceramic articles |
| 09/26/1996 | WO1996029849A1 Method and device for manufacturing printed wiring board |
| 09/26/1996 | WO1996029848A1 A motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple integrated circuit packages |
| 09/26/1996 | WO1996029764A1 Cross-connect method and apparatus |
| 09/26/1996 | WO1996029737A1 A high density integrated circuit assembly combining leadframe leads with conductive traces |
| 09/26/1996 | WO1996029729A1 Process for applying a metallisation layer on an insulator and for piercing through-holes in said insulator by means of a single mask |
| 09/26/1996 | WO1996029634A1 Multi-rate positioner system having an improved profiling filter |
| 09/26/1996 | WO1996029202A1 A laminate for sealing capsules |
| 09/26/1996 | WO1996025263A3 Process for bonding a flexible substrate to a chip |
| 09/26/1996 | DE19611407A1 Semiconductor hybrid circuit is encapsulated as single in-line or dual in-line package |
| 09/26/1996 | DE19510227A1 Application of UV-curable coating compsn. to both sides of circuit board |
| 09/26/1996 | DE19510186A1 Connection method e.g. for flexible conductors joined to substrate contact surfaces |
| 09/26/1996 | CA2214890A1 Cross-connect method and apparatus |
| 09/25/1996 | EP0733952A1 Photoresist compositions |
| 09/25/1996 | EP0733910A1 Printed circuit board with built-in testing of connections to ICs |
| 09/25/1996 | EP0733906A1 Electronic die package assembly having a support and method |
| 09/25/1996 | EP0733683A1 Photosolder resist ink, printed circuit board, and process for producing the same |
| 09/25/1996 | EP0733264A1 Self centering coil |
| 09/25/1996 | EP0733261A1 Attenuator especially for audio-signals |
| 09/25/1996 | EP0733129A1 Process for producing and adhesive bond between copper layers and ceramics |
| 09/25/1996 | EP0652982B1 Process for the electrolytic processing especially of flat items and arrangement for implementing the process |
| 09/25/1996 | EP0583292B1 Solder leveller |
| 09/25/1996 | EP0542796B1 Azeotrope-like compositions of 1,1-dichloro-1-fluoroethane; ethanol; and nitromethane |
| 09/25/1996 | EP0460223B1 Board for surge absorbing device of communication line |
| 09/25/1996 | CN1131897A Circuit substrate having interconnection leads and fabrication process thereof |
| 09/25/1996 | CN1131751A Circuit assembly and process for production thereof |
| 09/24/1996 | US5559997 System and method for designing a printed-circuit board |
| 09/24/1996 | US5559676 Self-contained drop-in component |
| 09/24/1996 | US5559444 Method and apparatus for testing unpackaged semiconductor dice |
| 09/24/1996 | US5559388 High density interconnect for an ultrasonic phased array and method for making |
| 09/24/1996 | US5559365 Semiconductor device including a plurality of leads each having two end portions extending downward and upward |
| 09/24/1996 | US5558928 Multi-layer circuit structures, methods of making same and components for use therein |
| 09/24/1996 | US5558789 Method of applying a laser beam creating micro-scale surface structures prior to deposition of film for increased adhesion |
| 09/24/1996 | US5558757 Process for improving the coating of electrolytically treated work pieces, and arrngement for carrying out the process |
| 09/24/1996 | US5558679 Method for mounting a battery on a substrate |
| 09/24/1996 | US5558523 Pad on pad type contact interconnection technology for electronic apparatus |
| 09/24/1996 | US5558504 Magnetostrictive pump for applying pastes and adhesives |
| 09/24/1996 | US5558271 Shaped, self-aligning micro-bump structures |
| 09/24/1996 | US5558110 Apparatus for removing particulate matter |
| 09/24/1996 | US5558109 Printed circuits |
| 09/24/1996 | US5558015 Hot press with pressure vessels to uniformly distribute pressure to the work piece |
| 09/24/1996 | US5557844 Method of preparing a printed circuit board |
| 09/24/1996 | US5557843 Method of making a circuit board or layer thereof including semi-curing a second adhesive coated on a cured first adhesive |
| 09/24/1996 | CA2061646C Wave soldering in a protective atmosphere enclosure over a solder pot |
| 09/21/1996 | CA2145011A1 Automated perforation device for the production of printed circuit boards |
| 09/19/1996 | WO1996028845A1 Process for making a z-axis adhesive and establishing electrical interconnection therewith |
| 09/19/1996 | WO1996028588A1 Currentless metallisation process for non electroconductive substrates |
| 09/19/1996 | WO1996028535A1 Cleaning process and apparatus |
| 09/19/1996 | WO1996028502A1 Process for preparing resin molding having fine recesses on the surface thereof |
| 09/19/1996 | DE19541334A1 Mfg. printed circuit assembly for construction of sub-assemblies in e.g. microwave electronic equipment |
| 09/19/1996 | DE19540570A1 High packing density circuit board |
| 09/19/1996 | DE19509786A1 Soldering electronic components to circuit board |
| 09/19/1996 | DE19509554A1 Multilayer circuit manufacturing method for ceramic capacitor |
| 09/19/1996 | DE19509231A1 Verfahren zum Aufbringen einer Metallisierung auf einem Isolator und zum Öffnen von Durchgangslöchern in diesem mittels derselben Maske A method of applying a metallization on an insulator, and for opening of through holes therein by means of the same mask |
| 09/18/1996 | EP0732871A1 Method and apparatus for continuously supplying a continuous film in a film applying apparatus |
| 09/18/1996 | EP0732735A2 Monolithic ceramic electronic device and method of manufacturing same |
| 09/18/1996 | EP0732713A2 Thin film capacitor and hybrid circuit board, and methods of producing same |
| 09/18/1996 | EP0732537A2 Lamp with a coloured silicone cap |
| 09/18/1996 | EP0732424A1 Method and apparatus for heating plate like articles, in particular printed circuit boards |
| 09/18/1996 | EP0732040A1 Method of making a printed circuit board |
| 09/18/1996 | EP0732039A1 Fabrication multilayer combined rigid/flex printed circuit board |
| 09/18/1996 | EP0643780B1 Multiple solvent cleaning system |
| 09/18/1996 | EP0640271B1 Method, apparatus and product for surface mount solder joints |
| 09/18/1996 | EP0536376B1 Process for preparation of a seed layer for selective metal deposition |
| 09/18/1996 | EP0513366B1 Device for soldering |
| 09/18/1996 | CN1131339A Method of manufacturing electric bulb for display |
| 09/18/1996 | CN1131303A Non-contact type IC card and method and apparatus for manufacturing the same |
| 09/18/1996 | CN1131253A Illuminating apparatus |
| 09/18/1996 | CN1131205A Organic rust-proof treating copper foil |
| 09/17/1996 | US5557508 High-density circuit module and method of producing the same |
| 09/17/1996 | US5557503 Circuit card having a large module strain relief and heat sink support |
| 09/17/1996 | US5557500 Heat dissipating arrangement in a portable computer |
| 09/17/1996 | US5557075 Parallel flexible transmission cable |
| 09/17/1996 | US5557064 Conformal shield and method for forming same |
| 09/17/1996 | US5556899 Fluorinated carbon polymer composites |
| 09/17/1996 | US5556812 Connection and build-up technique for multichip modules |
| 09/17/1996 | US5556735 Patterned solder resist on a printed circuit |
| 09/17/1996 | US5556532 Manufacture of a multilayer laminate |
| 09/17/1996 | US5556023 Method of forming solder film |
| 09/17/1996 | US5555798 Hot press for producing a multilayered substrate |
| 09/17/1996 | CA2053448C Multilayer printed wiring board and process for manufacturing the same |
| 09/12/1996 | WO1996027691A1 Palladium-containing precursor material and process for producing metallic microstructures on dielectric substrates with a palladium-containing precursor material |
| 09/12/1996 | WO1996027641A1 Polymeric composition |
| 09/12/1996 | WO1996027584A1 Energy-activatable salts with fluorocarbon anions |
| 09/12/1996 | DE19608484A1 Circuit substrate with highly reliable bonding |
| 09/12/1996 | DE19543894A1 Process for forming interconnections on circuit boards |
| 09/12/1996 | DE19535622C1 Solder bead application system for substrate termination surfaces |
| 09/12/1996 | DE19518512A1 Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial Palladium-containing precursor material and process for the production of metallic microstructures on dielectric substrates with a palladium-containing precursor material |
| 09/12/1996 | DE19508341A1 Verfahren zum stromlosen Metallisieren von elektrisch nicht leitenden Substraten A method for electroless plating of electrically non-conductive substrates |
| 09/12/1996 | CA2214893A1 Polymeric modifying agents |
| 09/12/1996 | CA2213465A1 Energy-activatable salts with fluorocarbon anions |
| 09/11/1996 | EP0731526A2 Pin-shaped contact element |
| 09/11/1996 | EP0731506A2 Package for semiconductor device |
| 09/11/1996 | EP0731192A1 Electroplating process and composition |
| 09/11/1996 | EP0730975A2 Compliant interconnect assembly for mounting removable print cartridges in a carriage |