| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/11/1996 | EP0730787A1 Electrical interconnects |
| 09/11/1996 | EP0730528A1 Alignment systems |
| 09/11/1996 | EP0730500A1 Ammonia-free deposition of copper by disproportionation |
| 09/11/1996 | CN1130958A 多芯片模块 A multi-chip module |
| 09/11/1996 | CN1130955A Electrical assembly |
| 09/11/1996 | CN1130807A Lead frame and manufacturing method thereof |
| 09/11/1996 | CN1130606A Method for reducing shrinkage during firing of ceramic bodies |
| 09/10/1996 | US5555488 Integrated circuit device having improved post for surface-mount package |
| 09/10/1996 | US5555316 Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component |
| 09/10/1996 | US5555116 Liquid crystal display having adjacent electrode terminals set equal in length |
| 09/10/1996 | US5554887 Plastic molded semiconductor package |
| 09/10/1996 | US5554821 For use with an electrical device |
| 09/10/1996 | US5554797 Enhance photosensitivity and/or rate of development of photoresists |
| 09/10/1996 | US5554664 And organometallic or organic onium cations; conductive adhesives; electronics |
| 09/10/1996 | US5554487 Resist formation made by applying, drying and reflowing a suspension of photocurable material |
| 09/10/1996 | US5554412 Tinning board in horizontal solder leveller: tinning with upward flow of molten solder spray or curtain through which board can pass to remove flux oil, applying molten solder, feeding board away with outfeed rollers, levelling solder |
| 09/10/1996 | US5554305 Applying and ablating specified material over a substrate |
| 09/10/1996 | US5554211 Aqueous electroless plating solutions |
| 09/10/1996 | US5553769 Interconnection of a carrier substrate and a semiconductor device |
| 09/10/1996 | US5553768 Heat-control process and apparatus for attachment/detachment of soldered components |
| 09/10/1996 | US5553700 Treatment method and apparatus for printed circuit boards and the like |
| 09/10/1996 | US5553633 Apparatus for treatment of printed circuit boards and the like |
| 09/10/1996 | US5553540 Method for screen printing of viscous materials |
| 09/10/1996 | US5553538 Method and apparatus for stencil printing printed circuit boards |
| 09/10/1996 | CA2171516A1 Resin composition for electroless metal deposition and method for electroless metal deposition |
| 09/08/1996 | CA2162941A1 Method and apparatus to contact plating bar without exposing contact copper or rework of the contact pad plating |
| 09/06/1996 | WO1996027282A1 A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
| 09/06/1996 | WO1996027279A1 Sealed packaging for environmental protection of electronics |
| 09/06/1996 | WO1996026808A1 Metallised under-layer for (soldering) filler materials |
| 09/06/1996 | CA2214576A1 Sealed packaging for environmental protection of electronics |
| 09/06/1996 | CA2189233A1 A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
| 09/05/1996 | DE19607974A1 Wiring arrangement switching body with associated circuit board and body |
| 09/05/1996 | DE19507207A1 Solder metal contact bump on multiple metal contact face formation method |
| 09/04/1996 | EP0730395A2 Method of transporting and applying a surface treatment liquid using gas bubbles |
| 09/04/1996 | EP0730394A1 Thermoformed three dimensional wiring module |
| 09/04/1996 | EP0730186A1 Circuit board connection structure and method, and liquid crystal device including the connection structure |
| 09/04/1996 | EP0729656A1 Shunt connector |
| 09/04/1996 | EP0729652A1 Contact structure for interconnections, interposer, semiconductor assembly and method |
| 09/04/1996 | EP0729650A1 Solderable connector for high density electronic assemblies |
| 09/04/1996 | EP0729645A1 A high density integrated circuit assembly combining leadframe leads with conductive traces |
| 09/04/1996 | EP0729585A1 A surface mount test point enabling hands free diagnostic testing of electronical circuits |
| 09/04/1996 | EP0729487A1 Ptfe reinforced compliant adhesive and method of fabricating same |
| 09/04/1996 | EP0729397A1 Fluxless soldering pretreating system and method using fluorine-containing plasma |
| 09/04/1996 | EP0638094B1 Concentration of fluoropolymer dispersions using acrylic polymers of high acid content |
| 09/04/1996 | EP0626125B1 Process and apparatus for printing a printed circuit board |
| 09/04/1996 | CN1130441A Integrated circuit device |
| 09/04/1996 | CN1130408A Copper etchant solution additives |
| 09/04/1996 | CN1130340A Comected plate body |
| 09/04/1996 | CN1130291A Method for producing rotary print conductor and method for producing raw sheet in laminate |
| 09/04/1996 | CN1032721C Resistance metal layers and method for making same |
| 09/04/1996 | CA2168285A1 Thermoformed three dimensional wiring module |
| 09/04/1996 | CA2154415A1 Method of transporting and applying a surface treatment liquid using gas bubbles |
| 09/03/1996 | US5552964 Switch mounted on circuit board and method of mounting switch on circuit board |
| 09/03/1996 | US5552963 Bus communication system for stacked high density integrated circuit packages |
| 09/03/1996 | US5552951 Semiconductor package electrostatic discharge damage protection |
| 09/03/1996 | US5552752 Microwave vertical interconnect through circuit with compressible conductor |
| 09/03/1996 | US5552675 High temperature reaction apparatus |
| 09/03/1996 | US5552638 Semiconductors |
| 09/03/1996 | US5552249 Method for making a mask useful in the conformal photolithographic manufacture of patterned curved surfaces |
| 09/03/1996 | US5552234 Copper with zinc-nickel or zinc-cobalt alloy plating layer on foils and chromium or chromate films |
| 09/03/1996 | US5552232 Aluminum nitride body having graded metallurgy |
| 09/03/1996 | US5552107 Aluminum nitride body having graded metallurgy |
| 09/03/1996 | US5552031 Palladium alloy plating compositions |
| 09/03/1996 | US5551979 Apparatus for applying termination paste to electronic components |
| 09/03/1996 | US5551628 Solder-coating method, and solder paste suitable for use therein |
| 09/03/1996 | US5551627 Alloy solder connect assembly and method of connection |
| 09/03/1996 | US5551626 Providing conductive paste between metal foils containing metal oxide remover |
| 09/03/1996 | US5551148 Method for forming conductive bumps |
| 09/03/1996 | CA2056740C Via capacitors within multi-layer 3-dimensional structures/substrates |
| 09/02/1996 | CA2417989A1 Screen printing method and apparatus therefor |
| 08/29/1996 | WO1996026630A1 Board matched nested support fixture |
| 08/29/1996 | WO1996026039A1 Method and apparatus for making holes in an insulating film on a carrier strip for electronic card modules |
| 08/29/1996 | WO1996019911A3 Process for preparing an insulated multilayer structure |
| 08/29/1996 | DE19606862A1 Printed circuit board with mfg. method |
| 08/29/1996 | DE19606636A1 Resist compsn. for electroless plating of printed circuit board |
| 08/29/1996 | DE19605255A1 Monitoring circuit wiring patterns of PCBs |
| 08/29/1996 | DE19506763A1 Continuous plasma-assisted soldering e.g. of circuit boards |
| 08/28/1996 | EP0729293A1 Selective metallization process |
| 08/28/1996 | EP0729182A2 Chip carrier and method of manufacturing and mounting the same |
| 08/28/1996 | EP0729180A2 Packaging multi-chip modules without wirebond interconnection |
| 08/28/1996 | EP0729178A1 Rework process for semiconductor chips mounted on an organic substrate |
| 08/28/1996 | EP0729068A2 Photosensitive resin composition and method of forming conductive pattern |
| 08/28/1996 | EP0728838A2 Composition for cleaning and process for cleaning |
| 08/28/1996 | EP0728792A2 Heat-resistant adhesive and method of adhesion by using adhesive |
| 08/28/1996 | EP0728788A1 Process for producing photosensitive resin and liquid photosensitive resin composition |
| 08/28/1996 | EP0728166A1 Pressure sensitive adhesives |
| 08/28/1996 | EP0728053A1 Device for moving an object by means of thermal change in shape or volume |
| 08/28/1996 | EP0646290A4 Face-mount connector. |
| 08/28/1996 | CN1129891A Miniature speeching body |
| 08/28/1996 | CN1129843A Manufacturing method and manufacturing apparatus for ceramic electronic components |
| 08/28/1996 | CN1129734A Composition for cleaning and process for cleaning |
| 08/27/1996 | US5550402 Electronic module of extra-thin construction |
| 08/27/1996 | US5550325 Printed-circuit board including circuit pattern having location to be cut if necessary |
| 08/27/1996 | US5550083 Process of wirebond pad repair and reuse |
| 08/27/1996 | US5550006 Contacting metal surface with aqueous solution containing phosphoric acid and vanadium, niobium, tungsten and/or tantalum compound for time to produce phosphate conversion coating |
| 08/27/1996 | US5549808 Covering connectors with protective metal layer before etching |
| 08/27/1996 | US5549778 Lamination of low-softening glass-ceramic green sheets having conductor paste printed on surface to connect filled vias; bonding strength |
| 08/27/1996 | US5549761 Method for removing rosin soldering flux from a printed wiring board |
| 08/27/1996 | US5549741 Water insoluble low volatile organic compound-containing lithographic ink varnish including hard resin having specified acid number, oil, nonvolatile solvent |
| 08/27/1996 | US5549240 Surface mount device removal tool |