| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/25/1997 | US5614076 Tool and method for electroetching |
| 03/25/1997 | US5614056 Apparatus for chemically etching substrates |
| 03/25/1997 | US5614043 Method for fabricating electronic components incorporating ceramic-metal composites |
| 03/25/1997 | US5614032 Terpene-based method for removing flux residues from electronic devices |
| 03/25/1997 | US5614024 Apparatus for applying paste |
| 03/25/1997 | US5613862 Anisotropic electrical connection |
| 03/25/1997 | US5613861 Photolithographically patterned spring contact |
| 03/25/1997 | US5613858 Compact circuit board switching apparatus and associated methods |
| 03/25/1997 | US5613633 Solder apparatus and method |
| 03/25/1997 | US5613632 Manufacturing solder-preform holders for a pick-and-place machine |
| 03/25/1997 | CA2110892C Electrical interconnection method and apparatus utilizing raised connecting means |
| 03/25/1997 | CA2110891C Electrical interconnects having a bulge configuration |
| 03/25/1997 | CA2080094C Multilayer circuit board with repaired i/o pin and process for repairing i/o pin on multilayer circuit board |
| 03/25/1997 | CA2066125C Electronic circuits and their fabrication |
| 03/20/1997 | WO1997010689A1 Copper alloy foils for flexible circuits |
| 03/20/1997 | WO1996038858A3 Method and probe card for testing semiconductor devices |
| 03/20/1997 | DE19637886A1 Substrate for printed circuits |
| 03/20/1997 | DE19534515A1 Identification of faulty parts in a complete layout of components |
| 03/20/1997 | DE19534313A1 Verfahren zur Erfassung von Position und Versatz von Lagen an Multilayerplatinen A method for sensing the position and displacement of documents to multilayer boards |
| 03/20/1997 | DE19534019A1 Plug-in contact lug with mfg. method |
| 03/20/1997 | DE19529380C1 Telecommunications network connection box with manufacturing method |
| 03/20/1997 | CA2232041A1 Copper alloy foils for flexible circuits |
| 03/19/1997 | EP0763967A2 Multi-layered printed wiring board |
| 03/19/1997 | EP0763843A2 Electrical element, preferably relay, and method for mounting the same on a printed circuit board |
| 03/19/1997 | EP0763269A1 Surface-mounted plug-in connector |
| 03/19/1997 | EP0763261A1 Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof |
| 03/19/1997 | EP0763228A1 Plasma addressed liquid crystal display with etched electrodes |
| 03/19/1997 | EP0763150A1 Catalytic, crosslinked polymeric films for electroless deposition of metal |
| 03/19/1997 | EP0714591B1 Edge-connecting printed circuit board |
| 03/19/1997 | EP0497896B1 Non-photographic method for patterning organic polymer films |
| 03/19/1997 | EP0487640B1 Capacitor laminate for printed circuit board |
| 03/19/1997 | EP0425703B1 Photo-curable resin laminate and method of producing printed wiring board using the same |
| 03/19/1997 | CN1145691A Process and device for chemically treating substrates |
| 03/19/1997 | CN1145480A Epoxy-containing waterborne photoimageable composition |
| 03/19/1997 | CN1145350A Method for reducing shrinkage during firing of ceramic bodies |
| 03/19/1997 | CN1145302A Screen printing method and apparatus therefor |
| 03/18/1997 | US5612855 Adapter for mounting on a circuit board |
| 03/18/1997 | US5612804 Liquid crystal display with an electrode connector |
| 03/18/1997 | US5612660 Formed in a multilayer printed circuit board |
| 03/18/1997 | US5612657 Electrical device |
| 03/18/1997 | US5612577 Symmetrical circuit connection board for vehicle application |
| 03/18/1997 | US5612573 Electronic package with multilevel connections |
| 03/18/1997 | US5612569 Semiconductor device |
| 03/18/1997 | US5612513 Article and method of manufacturing an enclosed electrical circuit using an encapsulant |
| 03/18/1997 | US5612512 High frequency electronic component having base substrate formed of bismaleimide-triazine resin and resistant film formed on base substrate |
| 03/18/1997 | US5612511 Double-sided electrical interconnect flexible circuit for ink-jet hard copy systems |
| 03/18/1997 | US5612121 Copper conductive particles with silver particles |
| 03/18/1997 | US5611905 Metallization |
| 03/18/1997 | US5611884 Flip chip silicone pressure sensitive conductive adhesive |
| 03/18/1997 | US5611481 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
| 03/18/1997 | US5611480 Soldering process |
| 03/18/1997 | US5611274 Apparatus for screen printing of viscous materials |
| 03/18/1997 | US5611140 Method of forming electrically conductive polymer interconnects on electrical substrates |
| 03/18/1997 | CA2104224C Piston-based ventilator design and operation |
| 03/13/1997 | WO1997009739A1 Solder deposit support |
| 03/13/1997 | WO1997009630A1 A method for determining the relative positions of a plurality of layers of a multilayer circuit board, a device suitable for carrying out such a method and also a measuring pin and a circuit board suitable for being used with such a method |
| 03/13/1997 | DE19636735A1 Prodn. of multilayered circuit substrate |
| 03/13/1997 | DE19533299A1 Multi-pole variable SMD-type connector arrangement for vehicle control modules |
| 03/13/1997 | DE19533169A1 Lotdepotträger Solder deposit |
| 03/13/1997 | DE19532992A1 Single sided electronic component mounting conductor plate device, e.g. surface mounted device |
| 03/13/1997 | DE19532911A1 Hot dip coating of continuous or individual workpieces |
| 03/13/1997 | DE19530989C1 Verfahren zum Filmstrippen A method of film stripping |
| 03/12/1997 | EP0762820A2 Method of manufacturing a circuit assembly |
| 03/12/1997 | EP0762817A1 Shielding for flat assemblies |
| 03/12/1997 | EP0762814A1 Method for the manufacture of printed circuit boards |
| 03/12/1997 | EP0762813A1 Method for the manufacture of printed circuit boards |
| 03/12/1997 | EP0762812A2 Method of improved oven reflow soldering |
| 03/12/1997 | EP0762811A1 Encapsulated electronic circuit having micro components and process for dismounting such a circuit |
| 03/12/1997 | EP0762559A2 Electric connector terminal having a round soldering tail |
| 03/12/1997 | EP0762537A2 Chip antenna |
| 03/12/1997 | EP0762536A2 Chip antenna |
| 03/12/1997 | EP0762533A2 Antenna apparatus |
| 03/12/1997 | EP0762497A1 Tape carrier package structure with reinforced outer leads |
| 03/12/1997 | EP0762209A1 Epoxy-containing waterborne photoimageable composition |
| 03/12/1997 | EP0761361A1 Apparatus for cooling printed circuit boards in wave soldering |
| 03/12/1997 | EP0761075A1 Printed circuit board socket |
| 03/12/1997 | EP0761027A1 Surface mount electrical connector with improved grounding element |
| 03/12/1997 | EP0760873A1 Electrolytic method and device for the continuous and uniform metallization or etching of metal surfaces |
| 03/12/1997 | EP0760809A1 Omega-hydrofluoroalkyl ethers, precursor carboxylic acids and derivatives thereof, and their preparation and application |
| 03/12/1997 | EP0594644B1 Anisotropic conductive adhesive film |
| 03/12/1997 | CN2249484Y Film-separation technical regenerated etching agent and electrolyzation etching machine without discharged waste liquid |
| 03/12/1997 | CN1145018A Chip aligenment/fees apparatus |
| 03/12/1997 | CN1144720A Binder coating method and its device |
| 03/11/1997 | US5610801 Motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple integrated circuit packages |
| 03/11/1997 | US5610799 Power module device |
| 03/11/1997 | US5610642 Flex circuit with multiple trace configurations and method of manufacture |
| 03/11/1997 | US5610436 Surface mount device with compensation for thermal expansion effects |
| 03/11/1997 | US5610371 Electrical connecting device and method for making same |
| 03/11/1997 | US5610132 Of two different propylene glycol alkyl ethers and water |
| 03/11/1997 | US5609991 Photoimageable composition having improved alkaline process resistance and tack-free surface for contact imaging |
| 03/11/1997 | US5609914 Method for preparing high resolution polyimide images using non-photosensitive layers of poly(amic acid) or salts thereof |
| 03/11/1997 | US5609773 Method for manufacture of multilayer wiring board and the multilayer wiring board |
| 03/11/1997 | US5609746 Laser ablation, holes |
| 03/11/1997 | US5609704 Method for fabricating an electronic part by intaglio printing |
| 03/11/1997 | US5609490 Method and apparatus for attachment of edge connector to substrate |
| 03/11/1997 | US5609292 Manufacturing circuit boards using a pick and place machine |
| 03/11/1997 | US5609290 Fluxless soldering method |
| 03/06/1997 | WO1997008925A1 Method of establishing a connection between at least two electrical conductors, one of which is mounted on a supporting substrate |
| 03/06/1997 | WO1997008924A1 Laser write process for making a conductive metal circuit |
| 03/06/1997 | WO1997008779A1 Right angle electrical connector |