Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/1996
07/02/1996US5532094 Composition for treating copper or copper alloy surfaces
07/02/1996US5532070 Tin, lead
07/02/1996US5532031 Input/output, bonding strength
07/02/1996US5531945 Process for the production of base board for printed wiring
07/02/1996US5531942 Spheres
07/02/1996US5531916 1,1,1,3,4,4,5,5,5-nonafluoro-2-trifluoromethylpentane mixed with methanol or ethanol cosolvent
07/02/1996US5531874 Electroetching tool using localized application of channelized flow of electrolyte
07/02/1996US5531860 Structure and method for providing a lead frame with enhanced solder wetting leads
07/02/1996US5531838 Flux composition and corresponding soldering method
07/02/1996US5531021 Method of making solder shape array package
07/02/1996US5531020 Method of making subsurface electronic circuits
07/02/1996CA2073911C Stepped multilayer interconnection apparatus and method of making the same
07/02/1996CA2073211C Method of manufacturing a rigid-flex printed wiring board
07/02/1996CA2055413C Printed circuit board having electromagnetic wave shield layer and self-contained printed resistor
07/02/1996CA2054407C Method and apparatus for solder leveling of printed circuit boards
07/02/1996CA2047621C Resin composition for image formation
06/1996
06/27/1996WO1996019913A1 Soldering process
06/27/1996WO1996019912A1 An environmentally desirable method of manufacturing printed circuits, printed circuits made thereby and associated apparatus
06/27/1996WO1996019911A2 Process for preparing an insulated multilayer structure
06/27/1996WO1996019829A1 Device for superheating steam
06/27/1996WO1996019814A1 Electric component, in particular a coil, preferably for an smd assembly technique
06/27/1996WO1996019314A1 Solder and its use for making a soldered joint between two objects
06/27/1996DE4446618A1 Electronic waste metal processing method for esp. circuit board
06/27/1996DE4446289A1 Contact elements on micro-chip boards are connected together by heating a joining element between the contact element
06/27/1996DE4445129A1 PCB-based electrical device e.g. for switching motor vehicle heated rear window on and off
06/27/1996CA2207305A1 Process for preparing an insulated multilayer structure
06/27/1996CA2181357A1 Soldering process
06/26/1996EP0719079A1 Printed circuit board
06/26/1996EP0719078A2 Printed circuit assembly having improved reference plane isolation
06/26/1996EP0718905A1 Surface mountable microwave IC package
06/26/1996EP0718878A2 Manufacturing process of conductors on a substrate with depressions
06/26/1996EP0718429A1 Heat-resisting cushion material and method for producing the same
06/26/1996EP0718317A2 Photoresist compositions
06/26/1996EP0718316A2 Crosslinked polymers
06/26/1996EP0584356B1 Method of soldering
06/26/1996CN1125356A Process for surface mounting flip chip carrier modules
06/25/1996US5530623 High speed memory packaging scheme
06/25/1996US5530291 Electronic package assembly and connector for use therewith
06/25/1996US5530288 Passive interposer including at least one passive electronic component
06/25/1996US5530286 Semiconductor device
06/25/1996US5530285 Low-impedance surface-mount device
06/25/1996US5530204 Electronic-parts mounting board and electronic-parts mounting board frame
06/25/1996US5530036 Storage stable thermosetting resin compositions
06/25/1996US5529957 Method for blocking contamination and stabilizing chip capacitor during attachment using a tape strip
06/25/1996US5529829 Array of conductive pathways
06/25/1996US5529670 Collimating, heating the integrated circuit for sputtering titanium or titanium nitride
06/25/1996US5529535 Lamp socket and backplate assembly and method of making same
06/25/1996US5529514 Scissor pin retention legs
06/25/1996US5529504 Electrically anisotropic elastomeric structure with mechanical compliance and scrub
06/25/1996US5529502 Solderless flexible circuit carrier to printed circuit board interconnection
06/25/1996US5529441 Drill coordinate optimization for multi-layer printed circuit board
06/25/1996US5529081 Apparatus for the treatment of board-like articles
06/25/1996US5528826 Method of constructing high yield, fine line, multilayer printed wiring board panel
06/25/1996CA2166037A1 Method of forming conductive paths on a substrate having depressions
06/25/1996CA2070308C Process of producing multiple-layer glass-ceramic circuit board
06/20/1996WO1996019097A1 Copper coating
06/20/1996WO1996019013A1 Method and support for connecting an integrated circuit to another support via balls
06/19/1996EP0717587A2 Multilayer printed circuit board
06/19/1996EP0717586A1 Process to decrease the strength of an electric field produced by a high voltage conductive path on a printed circuit board
06/19/1996EP0717443A1 Integrated circuit device
06/19/1996EP0717442A1 Process and integrated circuit connection support to another support by means of bumps
06/19/1996EP0717441A2 Method of solder bonding a body, e.g. a silicon chip, to another body
06/19/1996EP0717418A2 Composition containing a polymer and conductive filler and use thereof
06/19/1996EP0717129A2 Cleaning method
06/19/1996EP0717128A2 Cleaning method and cleaning apparatus
06/19/1996EP0587634B1 Method of manufacturing a multilayer printed wire board
06/19/1996EP0552252B1 Saturated linear polyfluorohydrocarbons, processes for their production, and their use in cleaning compositions
06/19/1996EP0476065B1 Method for improving the insulation resistance of printed circuits
06/19/1996CN1124912A Photosensitive resin composition and method for using the same in manufacture of circuit boards
06/18/1996USRE35278 Polypyrrole
06/18/1996US5528512 Method of obtaining mask data for manufacturing multiple metal-interconnection layers on a substrate
06/18/1996US5528466 Assembly for mounting and cooling a plurality of integrated circuit chips using elastomeric connectors and a lid
06/18/1996US5528463 Low profile sockets and modules for surface mountable applications
06/18/1996US5528461 Printed circuit assembly having component locating features
06/18/1996US5528460 Battery holder for a printed circuit board
06/18/1996US5528457 Method and structure for balancing encapsulation stresses in a hybrid circuit assembly
06/18/1996US5528403 Flat type display device having flexible wiring board and common wiring board bonded to display panel
06/18/1996US5528001 Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths
06/18/1996US5528000 Electroplating process and composition
06/18/1996US5527999 Multilayer conductor for printed circuits
06/18/1996US5527998 Flexible multilayer printed circuit boards and methods of manufacture
06/18/1996US5527997 Conductor for a flat cable, and manufacturing method and equipment therefor
06/18/1996US5527741 Fabrication and structures of circuit modules with flexible interconnect layers
06/18/1996US5527621 Method for surface treatment of polyimide resin molded articles
06/18/1996US5527591 Electrical contact having a particulate surface
06/18/1996US5527586 Printed circuit boards; machinable, moldable
06/18/1996US5527566 Exposure to oxygen-contining plasma, then to reducing gases(containing hydrogen) with heating to regenerate surface electrical properties
06/18/1996US5527561 Method for filing substrate recesses using elevated temperature and pressure
06/18/1996US5527187 Compliant electrical interconnect
06/18/1996US5526974 Fine pitch electronic component placement method and apparatus
06/18/1996US5526565 High density self-aligning conductive networks and contact clusters and method and apparatus for making same
06/18/1996US5526564 Method of manufacturing a multilayered printed wiring board
06/18/1996US5526563 Method for manufacturing an electronic component
06/18/1996CA2069813C Optical processing apparatus
06/13/1996WO1996018285A1 Direct and selective process for applying protective layers
06/13/1996WO1996018284A1 Fabrication multilayer combined rigid/flex printed circuit board
06/13/1996WO1996017975A1 Printed circuit board manufacture
06/13/1996WO1996017974A1 Silver plating
06/13/1996DE19506551A1 Catalysing process of non-electrolyte plating process
06/13/1996CA2204532A1 Fabrication multilayer combined rigid/flex printed circuit board
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