| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/15/1997 | DE19629521A1 Matrix circuit board for selective telephone line connections |
| 05/15/1997 | DE19542165A1 Electrical flexible circuit board |
| 05/15/1997 | DE19541340A1 Continuous selective soldering of components onto circuit boards |
| 05/14/1997 | EP0773710A1 Flexible printed wiring board |
| 05/14/1997 | EP0773709A2 Two-layer solderable gold for thick film circuits |
| 05/14/1997 | EP0773600A2 Electrical circuit |
| 05/14/1997 | EP0773584A2 Device having resin package and method of producing the same |
| 05/14/1997 | EP0773309A1 Electroless/electrolytic methods for the preparation of metallized ceramic substrates |
| 05/14/1997 | EP0772888A1 Method of manufacturing a composite structure for use in electronic devices and structure, manufactured by said method |
| 05/14/1997 | EP0772883A1 Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom |
| 05/14/1997 | EP0772700A1 Palladium colloid solution and use thereof |
| 05/14/1997 | EP0772636A1 Radiation- and/or moisture-curable silicone compositions |
| 05/14/1997 | EP0575426B1 Resist formation |
| 05/14/1997 | CN1149814A Method for soldering parts on carrier sheet |
| 05/14/1997 | CN1149807A Matrix patch board, wiring plug and its producing method |
| 05/14/1997 | CN1149774A 层结构 Layer structure |
| 05/14/1997 | CN1149750A Monolithic ceramic electronic element and its producing method |
| 05/13/1997 | US5629839 Module interconnect adapter for reduced parasitic inductance |
| 05/13/1997 | US5629837 Button contact for surface mounting an IC device to a circuit board |
| 05/13/1997 | US5629564 Electroplated solder terminal |
| 05/13/1997 | US5629497 Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay |
| 05/13/1997 | US5629241 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 05/13/1997 | US5629098 Epoxy adhesives and copper foils and copper clad laminates using same |
| 05/13/1997 | US5628926 Exposing preferential part of insulation film to a laser beam, while raising the temperature until the exposed parts are transformed or decomposed, dispersing transformed or decomposed parts, by exposing the film to ultrasonic waves |
| 05/13/1997 | US5628921 Demetallizing procedure |
| 05/13/1997 | US5628919 Forming via holes in unsintered green sheets, burying a portion of an internal conductor in via holes, obtaining a multilayr structure, pressing, and sintering to form a carrier body, and concave portions on lower face of carrier |
| 05/13/1997 | US5628881 High temperature reaction method |
| 05/13/1997 | US5628852 Method for manufacturing a polyimide multilayer wiring substrate |
| 05/13/1997 | US5628850 Method for producing input/output connections in a ceramic device |
| 05/13/1997 | CA2122868C Process for the patterned metallisation of structured printed circuit boards |
| 05/09/1997 | WO1997016948A1 Multilayer printed circuit board and process for producing the same |
| 05/09/1997 | WO1997016913A1 A method and device to fasten a loudspeaker to a circuit board |
| 05/09/1997 | WO1997016870A1 Solder-holding clips for applying solder to connectors |
| 05/09/1997 | WO1997016866A2 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices |
| 05/09/1997 | WO1997016848A1 Electronic part module and process for manufacturing the same |
| 05/09/1997 | WO1997016500A1 Reactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive |
| 05/09/1997 | CA2235819A1 Multilayer printed circuit board and process for producing the same |
| 05/07/1997 | EP0772195A2 Carriage structure for a disk drive |
| 05/07/1997 | EP0771890A1 Electroplating process |
| 05/07/1997 | EP0771865A1 Cleaning composition based on 1,1,1,2,2,4,4-heptafluorobutane and alcohols |
| 05/07/1997 | EP0771472A1 Process for connecting an electric connection of an unpacked ic component to a conductive track on a substrate |
| 05/07/1997 | EP0771423A1 Three axis packaging |
| 05/07/1997 | EP0771243A1 Ultraviolet laser system and method for forming vias in multi-layered targets |
| 05/07/1997 | EP0771181A1 Sheets with high temperature stable protective coating |
| 05/07/1997 | EP0729656A4 Shunt connector |
| 05/07/1997 | DE19645034A1 Manufacture of end section for connection to planar circuit element such as ribbon cable printed circuit body |
| 05/07/1997 | DE19644796A1 Elektrische Verbinderanordnung An electrical connector assembly |
| 05/07/1997 | DE19644121A1 Bonding together connection leads in a printed circuit board |
| 05/07/1997 | DE19643670A1 Over-voltage protection material curing at low temperature to avoid damage |
| 05/07/1997 | DE19541191A1 Plasma etching of semiconductor plates |
| 05/07/1997 | DE19541030A1 Coating circuit boards, electric modules, hybrid circuits etc |
| 05/07/1997 | DE19540814A1 Board for printed circuit with surface mount technology (SMT) components |
| 05/07/1997 | DE19540513A1 Control- and/or regulating-module with electronics components e.g. for motor vehicle engine bay |
| 05/07/1997 | CN1149378A Sealed electronic packaging for environmental protection of active |
| 05/07/1997 | CN1149175A Objective actuator and manufacturing method thereof |
| 05/06/1997 | US5627730 Printed circuit board assembly for high speed data transfer |
| 05/06/1997 | US5627406 Inverted chip bonded module with high packaging efficiency |
| 05/06/1997 | US5627378 Die set for automatic UV exposure system |
| 05/06/1997 | US5627344 Multilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrate |
| 05/06/1997 | US5627108 Solder paste and glue dot-based methods of securing components to a printed circuit board |
| 05/06/1997 | US5627010 Photoimageable resist compositions containing photobase generator |
| 05/06/1997 | US5626914 Ceramic body with copper metal infiltration |
| 05/06/1997 | US5626784 In-situ sizing of photolithographic mask or the like, and frame therefore |
| 05/06/1997 | US5626778 Multi-wavelength programmable laser processing mechanisms and apparatus utilizing spectrometer verification |
| 05/06/1997 | US5626777 Process for producing dividable plates of brittle material with high accuracy and apparatus for receiving and precision-grinding the end faces of a plate |
| 05/06/1997 | US5626774 Copper foil carrier |
| 05/06/1997 | US5626771 Multilayer electronic circuit packages |
| 05/06/1997 | US5626736 Copper-clad printed circuit boards |
| 05/06/1997 | US5626713 Method for manufacturing multi-layer printed board |
| 05/06/1997 | US5626280 Infrared transparent soldering tool and infrared soldering method |
| 05/06/1997 | US5626279 Gallium is selectively deposited on surface of electroconductive substrate; forming intermetallic |
| 05/06/1997 | US5626278 Solder delivery and array apparatus |
| 05/06/1997 | US5626277 Mounting apparatus of solder-balls |
| 05/06/1997 | US5625944 Methods for interconnecting integrated circuits |
| 05/06/1997 | US5625935 Method of manufacturing a multilayer electronic component |
| 05/02/1997 | EP0771045A1 Microstrip line dielectric filter |
| 05/02/1997 | EP0770711A1 Sn-Bi alloy-plating bath and method for forming plated Sn-Bi alloy film |
| 05/02/1997 | EP0770652A2 Tamper-proof electronic coatings |
| 05/02/1997 | EP0770260A2 Variable voltage protection structures and methods for making same |
| 05/02/1997 | EP0770006A1 Stencil for depositing and portioning variously thick spot layers of a viscous material |
| 05/02/1997 | EP0710431A4 Space-saving memory module |
| 05/01/1997 | WO1997016056A1 Resin filler and multilayer printed wiring board |
| 05/01/1997 | WO1997016055A1 Method for depositing a protective coating on the components of an electronic board |
| 05/01/1997 | WO1997015966A1 Electrical connector with stress isolating solder tail |
| 05/01/1997 | WO1997015704A2 Electroplating plant |
| 05/01/1997 | WO1997015703A2 Conveyor device for vertically guiding plate-like objects for chemical or electrolytic surface-treatment |
| 05/01/1997 | WO1997015702A2 Device for chemical or electrolytic surface treatment of plate-like objects |
| 05/01/1997 | WO1997015446A1 Method of protecting the surface of a foil, releasably adhering protective film and film-coated foil |
| 05/01/1997 | CA2189061A1 1,1,1,2,2,4,4-heptafluorobutane and alcohol cleaning compositions |
| 05/01/1997 | CA2187495A1 Electronic component assembly and method fhereof |
| 04/30/1997 | DE19643129A1 Composite plate comprising plastic resin films sandwiching metallic electrical circuit |
| 04/30/1997 | DE19539866A1 Apparatus for electrolytic or chemical coating flat objects |
| 04/30/1997 | DE19539865A1 Durchlauf-Galvanikanlage Pass electroplating plant |
| 04/30/1997 | DE19539584A1 Electric component contact connection to conductor path e.g. for motor vehicle drive-train electric circuit |
| 04/30/1997 | DE19539582A1 Electronic circuit component coating device |
| 04/30/1997 | CN1148896A Plasma addressed liquid crystal display with etched electrodes |
| 04/30/1997 | CN1148830A Stencil for depositing and portioning variously thick spot layers of a viscous material |
| 04/30/1997 | CN1148732A Out-fitted type semiconductor device, semiconductor fitting component, and production method thereof |
| 04/30/1997 | CN1148723A Infrared shield of capacitor |
| 04/30/1997 | CN1148637A Figure forming method |