| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/10/1997 | CA2046202C Method for fabricating printed circuits |
| 06/05/1997 | WO1997020330A1 Flexible coil winding structure of flyback transformer and manufacturing process thereof |
| 06/05/1997 | WO1997020254A1 Photosensitive composition |
| 06/05/1997 | WO1997020252A1 Donor elements and processes for thermal dye transfer by laser |
| 06/05/1997 | WO1997020084A1 Process for producing metal-coated materials |
| 06/05/1997 | DE19649893A1 Conductive adhesive for bonding e.g. semiconductors to circuit boards |
| 06/05/1997 | DE19546140A1 Photoempfindliche Zusammensetzung A photosensitive composition |
| 06/05/1997 | DE19544929A1 Verfahren und Vorrichtung zum flußmittelfreien Aufbringen eines Lötmittels auf ein Substrat oder einen Chip Method and apparatus for fluxless applying a solder to a substrate or a chip |
| 06/05/1997 | DE19544733A1 Pressure injection moulding of mechanically complex circuit modules |
| 06/05/1997 | CA2238833A1 Photosensitive composition |
| 06/04/1997 | EP0777291A2 Signal isolating microwave splitters/combiners |
| 06/04/1997 | EP0776945A2 Radiation-curable coating composition useful for protecting electronic circuitry and method of curing the same |
| 06/04/1997 | EP0776726A1 Solid sphere manufacturing device |
| 06/04/1997 | EP0776596A1 Rigid flex printed circuit board |
| 06/04/1997 | EP0776538A1 Electric power distribution system |
| 06/04/1997 | EP0776385A2 High fatigue ductility electrodeposited copper foil |
| 06/04/1997 | EP0776262A1 Rosin-free, low voc, no-clean soldering flux and method using the same |
| 06/04/1997 | EP0748473A4 Flexible wearable computer |
| 06/04/1997 | EP0699353B1 Electrical interconnect assembly |
| 06/04/1997 | EP0554246B1 Cvd of metal films from beta-diketonate complexes |
| 06/04/1997 | EP0528027B1 Method and apparatus for forming contacts |
| 06/04/1997 | CN2255711Y Tapping machine head ofr circuitboard welding machine |
| 06/04/1997 | CN2255656Y Inductance coil |
| 06/03/1997 | US5636104 Printed circuit board having solder ball mounting groove pads and a ball grid array package using such a board |
| 06/03/1997 | US5635775 Printed circuit board mount electro-magnetic interference suppressor |
| 06/03/1997 | US5635760 Surface mount semiconductor device |
| 06/03/1997 | US5635758 Film IC with connection terminals |
| 06/03/1997 | US5635670 Multilayer electronic component |
| 06/03/1997 | US5635669 Multilayer electronic component |
| 06/03/1997 | US5635115 Filling circuit board cavities containing functionl element with molten sealing resin, curing |
| 06/03/1997 | US5635089 Ceramic, metal and composite materials having increased surface area |
| 06/03/1997 | US5635000 Method for screening using electrostatic adhesion |
| 06/03/1997 | US5634268 Method for making direct chip attach circuit card |
| 06/03/1997 | US5634267 Method and apparatus for manufacturing known good semiconductor die |
| 06/03/1997 | US5634265 Electrical interconnect using particle enhanced joining of metal surfaces |
| 05/29/1997 | WO1997019580A1 Method of selectively removing a metallic layer from a non-metallic substrate |
| 05/29/1997 | WO1997019579A1 Multilayered wiring board, prefabricated material for multilayered wiring board, process of manufacturing multilayered wiring board, electronic parts package, and method for forming conductive pillar |
| 05/29/1997 | WO1997019491A1 An electrically conductive wire |
| 05/29/1997 | WO1997019466A1 Method and apparatus for forming solder bumps on a substrate |
| 05/29/1997 | WO1997019206A1 Process for the electrolytic deposition of metal layers |
| 05/29/1997 | WO1997019204A1 Method and apparatus for surface treatment |
| 05/29/1997 | WO1997018944A1 Patterned conducting polymer surfaces and process for preparing the same and devices containing the same |
| 05/29/1997 | WO1997008655A3 Screen printing method and screen printing apparatus |
| 05/28/1997 | EP0776150A1 Printed wiring board |
| 05/28/1997 | EP0776064A2 Solder terminal, in particular for an application in a coil bobbin |
| 05/28/1997 | EP0776042A2 Power semiconductor module with a plurality of submodules |
| 05/28/1997 | DE4042448C2 Thermal printing head esp. for facsimile machine |
| 05/28/1997 | DE19543765A1 Electric component with axially brought out terminal pins |
| 05/28/1997 | DE19539606A1 Treatment of plate-shaped objects, particularly electronic circuit boards |
| 05/28/1997 | CN1150843A Method of cleaning probe tips of probe cards and apparatus for impelementing method |
| 05/28/1997 | CN1150648A Foreign matter checking method and device |
| 05/27/1997 | US5634093 Method and CAD system for designing wiring patterns using predetermined rules |
| 05/27/1997 | US5633804 Method for automatically producing printed wiring board fabrication drawings |
| 05/27/1997 | US5633535 Spacing control in electronic device assemblies |
| 05/27/1997 | US5633532 Semiconductor device interconnection |
| 05/27/1997 | US5633480 Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuits |
| 05/27/1997 | US5633479 Multilayer wiring structure for attaining high-speed signal propagation |
| 05/27/1997 | US5633123 System for ablative imaging by proximity lithography |
| 05/27/1997 | US5633121 Method for examining surface of copper layer in circuit board and process for producing circuit board |
| 05/27/1997 | US5633105 Precision radome made using conformal photolithography to pattern curved surfaces |
| 05/27/1997 | US5633072 Lamination bonding reinforced hard base substrate comprising conductive traces, intermediate substrate comprising hard core layer with flowable adhesive layer |
| 05/27/1997 | US5633069 Multilayer printed-circuit substrate, wiring substrate and process of producing the same |
| 05/27/1997 | US5632927 Carbon particles surface treated with a dye |
| 05/27/1997 | US5632828 Coating preparation for pretreating metal surfaces, and method employing said preparation |
| 05/27/1997 | US5632650 Connector break-off locator tab |
| 05/27/1997 | US5632631 Microelectronic contacts with asperities and methods of making same |
| 05/27/1997 | US5632630 Optical module with tolerant wave soldered joints |
| 05/27/1997 | CA2108868C Printed circuit board with electric elements mounted thereon |
| 05/22/1997 | WO1997018695A1 Process for making multi-layer foil printed circuit boards |
| 05/22/1997 | WO1997018584A1 Method for forming bump of semiconductor device |
| 05/22/1997 | WO1997018054A1 Method and apparatus for dispensing small amounts of liquid material |
| 05/22/1997 | DE19616854C1 Semiconductor component mfr. for integrated semiconductor power module |
| 05/22/1997 | DE19545231A1 Verfahren zur elektrolytischen Abscheidung von Metallschichten A method for the electrolytic deposition of metal layers |
| 05/22/1997 | DE19544974C1 Steuergerät, insbesondere zur Auslösung eines Rückhaltemittels in einem Fahrzeug Control unit, in particular for triggering a restraint device in a vehicle |
| 05/21/1997 | EP0774889A1 Photoelectrochemical fabrication of electronic circuits |
| 05/21/1997 | EP0774888A2 Printing wiring board and assembly of the same |
| 05/21/1997 | EP0774808A1 Right-angle board to board connector with anti-wicking characteristics and terminal for same |
| 05/21/1997 | EP0774799A1 Method for making flexible printed circuit boards, in particular for motor vehicles, and printed circuit board made thereby |
| 05/21/1997 | EP0774694A2 Resist removing apparatus |
| 05/21/1997 | EP0774534A1 Aqueous electroless plating solutions |
| 05/21/1997 | EP0774321A1 Printed-circuit board holding device |
| 05/20/1997 | US5631806 Lead with slits for reducing solder overflow and eliminating air gaps in the execution of solder joints |
| 05/20/1997 | US5631498 Thin film metallization process for improved metal to substrate adhesion |
| 05/20/1997 | US5631447 Uses of uniaxially electrically conductive articles |
| 05/20/1997 | US5631446 Microstrip flexible printed wiring board interconnect line |
| 05/20/1997 | US5631120 Method of forming a pattern with step features in a photopolymer |
| 05/20/1997 | US5631091 Immersion plating for coating bismuth on copper using bismuth salt and iodide |
| 05/20/1997 | US5631079 Microparticles bearing a conductive material formed from a polymer electrolyte base polymer and at least one ionic salt; primer for adhesion |
| 05/20/1997 | US5630948 Method for the fabrication of integrated conductor suspensions and product |
| 05/20/1997 | US5630874 Apparatus for resin impregnation of a fibrous substrate |
| 05/20/1997 | US5630542 Soldering apparatus with abrupt separation of solder streams |
| 05/20/1997 | US5630272 Method of forming contacts through bores in multi-layer circuit boards |
| 05/20/1997 | US5630271 Method of forming a wiring pattern for an electronic circuit on a general-purpose circuit board |
| 05/20/1997 | CA2017860C Photoimageable compositions |
| 05/18/1997 | CA2183312A1 Photoelectrochemical fabrication of electronic circuits |
| 05/15/1997 | WO1997017824A1 Multilayered printed wiring board and its manufacture |
| 05/15/1997 | WO1997017823A1 Connector break-off locator tab |
| 05/15/1997 | WO1997017822A1 Method for producing contact pads on pattern boards and adapter board for testing pattern boards |
| 05/15/1997 | WO1997017142A1 Rotation system for circuit board screener |
| 05/15/1997 | WO1997017141A1 Circuit board screener spot suppressor |