| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/25/1997 | EP0780225A1 Plastic mask unit for paste printing and method of fabricating such plastic mask unit |
| 06/25/1997 | EP0780028A1 Ball grid array socket |
| 06/25/1997 | EP0780021A1 Process for contacting power current connection elements of an electric component and component produced using this process |
| 06/25/1997 | EP0780006A1 Process for producing a smart card module for contactless smart cards |
| 06/25/1997 | EP0780005A1 Support element |
| 06/25/1997 | EP0779891A1 Novel acylphosphine oxides |
| 06/25/1997 | EP0619846B1 Method of improving the coating of electrolytically treated workpieces, and equipment for carrying out the method |
| 06/25/1997 | EP0473795B1 Method of cleaning |
| 06/25/1997 | CN1152972A Assembly of shielded conenctors and a board having plated holes |
| 06/25/1997 | CN1152797A Elements with resin shell capsulation and making method |
| 06/25/1997 | CN1152721A Liquid crystal display and making method |
| 06/25/1997 | CN1152628A Catalytic water-soluble polymeric films for metal coatings |
| 06/24/1997 | US5642266 Apparatus for maintaining an electrical component in a fixed position |
| 06/24/1997 | US5642265 Ball grid array package with detachable module |
| 06/24/1997 | US5642261 Ball-grid-array integrated circuit package with solder-connected thermal conductor |
| 06/24/1997 | US5642055 Electrical interconnect using particle enhanced joining of metal surfaces |
| 06/24/1997 | US5641995 Electronic circuit device |
| 06/24/1997 | US5641990 Laminated solder column |
| 06/24/1997 | US5641946 Method and circuit board structure for leveling solder balls in ball grid array semiconductor packages |
| 06/24/1997 | US5641839 Heat resistance, moldability, reduced stress |
| 06/24/1997 | US5641608 Direct imaging process for forming resist pattern on a surface and use thereof in fabricating printing plates |
| 06/24/1997 | US5641604 Photoresist composition with improved differential solubility through hydroxyl group blocking via reaction with vinyl ethers |
| 06/24/1997 | US5641597 Circuit forming method and apparatus therefor |
| 06/24/1997 | US5641577 Lead-frame forming material |
| 06/24/1997 | US5641113 Method for fabricating an electronic device having solder joints |
| 06/24/1997 | US5641112 Plate assembly and soldering device for changing screens of circuit boards using soldering and method of application thereof |
| 06/24/1997 | US5640907 Ink supplier in a printer system for printing circuit patterns or like on base board |
| 06/24/1997 | US5640763 Method for depanelizing electrical circuitry |
| 06/24/1997 | US5640762 Method and apparatus for manufacturing known good semiconductor die |
| 06/24/1997 | US5640761 Method of making multi-layer circuit |
| 06/24/1997 | US5640760 Method for the 3D interconnection of packages of electronic components using printed circuit boards |
| 06/24/1997 | US5640759 Method of connecting two strips provided with conductor patterns |
| 06/23/1997 | CA2192864A1 Inert atmosphere soldering apparatus |
| 06/19/1997 | WO1997022730A1 Thermoplastic resin molding with metallic layer formed on the surface thereof |
| 06/19/1997 | WO1997022235A2 Solder mask for manufacture of printed circuit boards |
| 06/19/1997 | WO1997022130A1 Power resistor combinations and method |
| 06/19/1997 | WO1997021563A1 Integrated interior trim and electrical assembly for an automotive vehicle |
| 06/19/1997 | WO1997016866A3 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices |
| 06/19/1997 | WO1997015703A3 Conveyor device for vertically guiding plate-like objects for chemical or electrolytic surface-treatment |
| 06/19/1997 | DE19651751A1 Scraper for screen printing |
| 06/19/1997 | DE19546285A1 Electronic module with circuit on substrate surface |
| 06/19/1997 | CA2239031A1 Solder mask for manufacture of printed circuit boards |
| 06/19/1997 | CA2203130A1 Thermoplastic resin molding having metal layer formed on surface thereof |
| 06/18/1997 | EP0779775A1 Electronic assembly with heat transfer, particularly for high voltage transformer of a discharge head lamp of a vehicle |
| 06/18/1997 | EP0779774A1 Method for monitoring solder paste printing process |
| 06/18/1997 | EP0779772A1 Printed wiring board, method of producing the same and electronic devices |
| 06/18/1997 | EP0779708A2 Surface acoustic wave apparatus |
| 06/18/1997 | EP0779657A2 Surface-mounted semiconductor package and its manufacturing method |
| 06/18/1997 | EP0779653A2 Flip chip silicone pressure sensitive conductive adhesive |
| 06/18/1997 | CN1152371A 陶瓷电路基板 A ceramic circuit substrate |
| 06/18/1997 | CN1152190A Systems interconneted by bumps of joining material |
| 06/17/1997 | US5640306 Contactless smart card the electronic circuit of which comprises a module |
| 06/17/1997 | US5640216 Liquid crystal display device having video signal driving circuit mounted on one side and housing |
| 06/17/1997 | US5640052 Interconnection structure of electronic parts |
| 06/17/1997 | US5640051 Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex |
| 06/17/1997 | US5640048 Ball grid array package for a integrated circuit |
| 06/17/1997 | US5640047 Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function |
| 06/17/1997 | US5639994 For an optical instrument such as a camera |
| 06/17/1997 | US5639992 Splice gel enclosure |
| 06/17/1997 | US5639990 Solid printed substrate and electronic circuit package using the same |
| 06/17/1997 | US5639989 Shielded electronic component assembly and method for making the same |
| 06/17/1997 | US5639696 Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array |
| 06/17/1997 | US5639695 Low-profile ball-grid array semiconductor package and method |
| 06/17/1997 | US5639555 Adhered with organosilane mixture containing a coupling agent and tris(silylorgano)-amine or -alkane; nontoxic, bonding strength |
| 06/17/1997 | US5639389 Process for the production of structures |
| 06/17/1997 | US5639013 Optimally shaped solder joints for improved reliability and space savings |
| 06/17/1997 | US5639010 Simultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devices |
| 06/17/1997 | US5638598 Laminating a metal foil on dielectric substrate; pressing; heating; drilling holes for connecting circuits |
| 06/17/1997 | US5638597 Manufacturing flexible circuit board assemblies with common heat spreaders |
| 06/17/1997 | CA2125040C A process and an apparatus for wave soldering |
| 06/17/1997 | CA2016716C Shield gas wave soldering |
| 06/12/1997 | WO1997021229A2 Electrically conducting reaction resin mixture |
| 06/12/1997 | WO1997020898A1 Adhesive, process for the preparation thereof, and process for mounting components |
| 06/12/1997 | WO1997020673A1 Process for manufacturing resin-encapsulated electronic product |
| 06/12/1997 | WO1997020654A1 Process and device for applying a solder to a substrate or chip without flux |
| 06/12/1997 | DE19650492A1 Multi-layer circuit board with connectors for plating or metallisation of contacts and terminals |
| 06/12/1997 | DE19602312A1 Joining objects incorporating metal materials |
| 06/12/1997 | DE19545676A1 Activation of computer circuit boards prior to plasma soldering |
| 06/11/1997 | EP0778723A1 Assembling electronic cards, and process for manufacturing such an assembly |
| 06/11/1997 | EP0778618A2 Lead frame and method for manufacturing it |
| 06/11/1997 | EP0778308A1 Aromatic polyamide film, process for producing the same, and magnetic recording medium and solar cell produced by using the same |
| 06/11/1997 | EP0777955A1 Device with an electric circuit |
| 06/11/1997 | EP0777873A1 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit |
| 06/11/1997 | EP0527980B1 Method of manufacture of a composite body consisting of microsieves |
| 06/11/1997 | CN1151676A Device and method for perforating printed circuit board |
| 06/11/1997 | CN1151624A Electronic integration in service boxes |
| 06/11/1997 | CN1151612A High thermal conductivity silicon nitride circuit substrat, and semiconductor device using the same |
| 06/10/1997 | US5637925 Uses of uniaxially electrically conductive articles |
| 06/10/1997 | US5637916 Carrier based IC packaging arrangement |
| 06/10/1997 | US5637835 Automatic test detection of unsoldered thru-hole connector leads |
| 06/10/1997 | US5637834 Multilayer circuit substrate and method for forming same |
| 06/10/1997 | US5637833 Solder application to a circuit board |
| 06/10/1997 | US5637832 Solder ball array and method of preparation |
| 06/10/1997 | US5637426 Method and apparatus for forming resist pattern, and printed wiring board fabricated thereby |
| 06/10/1997 | US5637406 Heat conductivity |
| 06/10/1997 | US5637177 Laminating apparatus having a reciprocating press roller |
| 06/10/1997 | US5637176 Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials |
| 06/10/1997 | US5637149 Apparatus for application to a circuit board |
| 06/10/1997 | US5637148 Apparatus for coating board-shaped piece material on both sides |
| 06/10/1997 | US5636996 Anisotropic interposer pad |