| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/16/1997 | EP0683716B1 Process for the production of plastic laminates with metal laminae especially for printed circuits made from endless bands |
| 07/16/1997 | EP0591174B1 Reworkable adhesive for electronic applications |
| 07/16/1997 | EP0549791B1 Multilayer printed circuit board and method of manufacture |
| 07/16/1997 | CN1154645A Multi-layered printed wiring board |
| 07/16/1997 | CN1154558A Static memory device having compatibility with disk drive installed as externals torage unit in electronic apparatus |
| 07/16/1997 | CN1154487A Liquid crystal display device with reduced frame portion surrounding display area |
| 07/15/1997 | US5649121 Computer system |
| 07/15/1997 | US5648893 Upgradable multi-chip module |
| 07/15/1997 | US5648682 Resin-sealed semiconductor device and lead frame used in a resin-sealed semiconductor device |
| 07/15/1997 | US5648679 Tape ball lead integrated circuit package |
| 07/15/1997 | US5648201 Photodegradation |
| 07/15/1997 | US5648200 Process for creating circuitry on the surface of a photoimageable dielectric |
| 07/15/1997 | US5648159 Dry resist |
| 07/15/1997 | US5648125 Electroless plating process for the manufacture of printed circuit boards |
| 07/15/1997 | US5648123 Process for producing a strong bond between copper layers and ceramic |
| 07/15/1997 | US5647966 Method for producing a conductive pattern and method for producing a greensheet lamination body including the same |
| 07/15/1997 | US5647942 Removal nickel (oxide or hydroxide) thin surface layer of electrode |
| 07/15/1997 | US5647940 Process for automatically connecting a source of electric current and a pile of packages to make plastic laminates with endothermic heating |
| 07/15/1997 | US5647544 Method and apparatus for dividing and separating self-adhesive composite plastic materials |
| 07/15/1997 | US5647529 Method of controlling the temperature of a portion of an electronic part during solder reflow |
| 07/15/1997 | US5647124 Method of attachment of a semiconductor slotted lead to a substrate |
| 07/15/1997 | US5647123 Method for improving distribution of underfill between a flip chip die and a circuit board |
| 07/15/1997 | US5647121 Method of assembling electronic component |
| 07/12/1997 | CA2194825A1 Flex circuit head module within a tape drive |
| 07/10/1997 | WO1997024709A2 End-wall frame for led alphanumeric display |
| 07/10/1997 | WO1997024229A1 Metal film bonded body, bonding agent layer and bonding agent |
| 07/10/1997 | WO1997015704A3 Electroplating plant |
| 07/10/1997 | DE19607179C1 Electrical position measuring device |
| 07/10/1997 | DE19600481A1 Chip- or intelligent-card design |
| 07/09/1997 | EP0783177A1 Method for the production of a microcapsule type conductive filler |
| 07/09/1997 | EP0782817A1 Planar cable array |
| 07/09/1997 | EP0782766A2 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 07/09/1997 | EP0782765A1 Polymer stud grid array |
| 07/09/1997 | EP0782500A1 Foiled ud-prepreg and pwb laminate prepared therefrom |
| 07/09/1997 | EP0699375B1 Laser etching method |
| 07/09/1997 | EP0655183B1 Method of manufacturing a multilayer printed wire board |
| 07/09/1997 | EP0615678B1 A process and an apparatus for wave soldering |
| 07/09/1997 | EP0480038B1 Ceramic circuit board |
| 07/09/1997 | CN1154178A Variable voltage protection structures and methods for making same |
| 07/09/1997 | CN1035393C Catalytic, water-solution on polymeric film by metal non-electrolytic deposition |
| 07/09/1997 | CN1035363C Solder powder coated with parylene and solder paste |
| 07/08/1997 | US5646826 Printed circuit board and heat sink arrangement |
| 07/08/1997 | US5646441 TCP TAB design with radial outer leads |
| 07/08/1997 | US5646373 Apparatus for improving the power dissipation of a semiconductor device |
| 07/08/1997 | US5646068 Forming regions on substrate for connection of electrical components to substrate using first metallurgy, form pattern of bumps using second metallurgy on coupon, applying bumps to substrate |
| 07/08/1997 | US5645932 Circuit-like metallic foil sheet and the like and process for producing them |
| 07/08/1997 | US5645927 Heat-resisting cushion material and method for producing the same |
| 07/08/1997 | US5645735 Gimbal flexure and electrical interconnect assembly |
| 07/08/1997 | US5645707 Bonding method for chip-type electronic parts |
| 07/08/1997 | US5645673 Lamination process for producing non-planar substrates |
| 07/08/1997 | US5645123 Semiconductor device having temperature regulation means formed in circuit board |
| 07/08/1997 | US5644979 Die cutting and stamping press having simultaneous X, Y, and .O slashed. axes die registration mechanism and method |
| 07/08/1997 | US5644839 Surface mountable substrate edge terminal |
| 07/08/1997 | US5644837 Process for assembling electronics using microwave irradiation |
| 07/03/1997 | WO1997024021A1 Substrate for mounting electronic part and process for manufacturing the same |
| 07/03/1997 | WO1997023903A1 Method of placing contacts onto a substrate |
| 07/03/1997 | WO1997023809A1 Photosensitive resin composition |
| 07/03/1997 | WO1997023550A1 Automatic control of the degree of cure of prepregs |
| 07/03/1997 | WO1997011590A3 Method of detecting the position and displacement of layers on multilayered circuit boards |
| 07/03/1997 | DE19653621A1 Production of multilayer laminated polymer substrates e.g. smart cards avoiding distortion |
| 07/03/1997 | DE19601055A1 Soldering area elements |
| 07/03/1997 | DE19548557A1 Flexible circuit board esp for UV-flex and heat-seal contacting with LCD glass modules |
| 07/02/1997 | EP0782377A2 Board center registration for solder paste deposition |
| 07/02/1997 | EP0781635A1 Sheet punching apparatus |
| 07/02/1997 | EP0781634A1 Apparatus for progressively feeding and punching sheet material |
| 07/02/1997 | EP0781501A1 Monolithic lcp polymer microelectronic wiring modules |
| 07/02/1997 | EP0781233A1 Mechanical connection of printed circuit boards for building three-dimensional structures from flat printed circuit board waste |
| 07/02/1997 | EP0781186A1 Method of applying solder to connection surfaces, and method of producing a solder alloy |
| 07/02/1997 | EP0682587B1 Wave-soldering using a shroud for a gas |
| 07/02/1997 | CN1153449A Wave soldering machine and method of adjusting and automatically controlling height of solder wave |
| 07/02/1997 | CN1153400A Conductive ball carring device |
| 07/01/1997 | USRE35549 Solderable lead |
| 07/01/1997 | US5644476 Flexible fastening member and object provided with such a fastening member, and support provided with both |
| 07/01/1997 | US5644475 Solder mask for a finger connector on a single in-line package module |
| 07/01/1997 | US5644452 Apparatus connecting a flexible circuit to an actuator arm of a disc drive |
| 07/01/1997 | US5644327 Tessellated electroluminescent display having a multilayer ceramic substrate |
| 07/01/1997 | US5644161 Ultra-high density warp-resistant memory module |
| 07/01/1997 | US5644107 Method of manufacturing a multilayer electronic component |
| 07/01/1997 | US5644103 Packaging electrical components having a scallop formed in an edge of a circuit board |
| 07/01/1997 | US5644102 Integrated circuit packages with distinctive coloration |
| 07/01/1997 | US5643835 Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs |
| 07/01/1997 | US5643831 Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device |
| 07/01/1997 | US5643699 Method and device for the mutual alignment of a film and a printed circuit board |
| 07/01/1997 | US5643678 Holographic film and method for forming |
| 07/01/1997 | US5643657 Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits |
| 07/01/1997 | US5643433 Photoresists patterns formed by electrodeposition |
| 07/01/1997 | US5642850 Modular soldering nozzle |
| 06/27/1997 | CA2190547A1 Multilayer structures and process for fabricating the same |
| 06/26/1997 | WO1997023123A1 A ball grid array integrated circuit package that has vias located within the solder pads |
| 06/26/1997 | WO1997023121A1 Spheres useful in a detachable connective medium for ball grid array assemblies |
| 06/26/1997 | WO1997022911A1 Electrodepositable photoimageable composition containing a microgel comprising crosslinked organic particles |
| 06/26/1997 | WO1997022910A1 Solder mask compositions |
| 06/26/1997 | WO1997022737A1 Conveyorized spray plating machine |
| 06/26/1997 | DE4447701C2 Automatic mounting of electronic SMD components on both sides of circuit board |
| 06/26/1997 | DE19653499A1 Solder application method for solder bump manufacture in e.g. ball grid array |
| 06/26/1997 | DE19548213A1 Recycling of electronic circuit boards with circuit tracks |
| 06/26/1997 | DE19547680A1 Solder paste containing solder powder and spacers |
| 06/25/1997 | EP0781085A1 Method and arrangement for electromagnetically shielding an electronic means |
| 06/25/1997 | EP0781079A1 Method of fabricating electronic circuit |
| 06/25/1997 | EP0780890A1 Support for electrochemical deposition |