| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/31/1997 | DE19702492A1 Lens barrel with linear guiding mechanism |
| 07/31/1997 | DE19702491A1 Lens guide mechanism for zoom lens of shutter-type camera |
| 07/31/1997 | DE19702489A1 Zoom lens camera controlling |
| 07/31/1997 | DE19702488A1 Lens drive mechanism for camera |
| 07/31/1997 | DE19702487A1 Zoom-lens type compact camera with shutter accommodated in movable barrel |
| 07/31/1997 | DE19702486A1 Zoom-type compact camera |
| 07/31/1997 | DE19702485A1 Lens supporting mechanism for electronic camera |
| 07/31/1997 | DE19614879C1 Solderless fixture method e.g. for mounting components on to circuit board conductor paths |
| 07/31/1997 | DE19603971A1 Large, area data input device production, especially computer touch panel |
| 07/31/1997 | DE19603962A1 Integrated circuit multi-lead connector of chip-and-foil type |
| 07/30/1997 | EP0786856A1 Switching device for brushless DC motor |
| 07/30/1997 | EP0786808A1 Anisotropic conductive sheet and printed circuit board |
| 07/30/1997 | EP0786807A1 Plastic body surface-mounting semiconductor power device having dimensional characteristics optimized for use of standard shipping and testing modes |
| 07/30/1997 | EP0786540A1 Electroplating process |
| 07/30/1997 | EP0786335A1 Process and device for the manufacture of resin impregnated pressed laminates |
| 07/30/1997 | EP0683715B1 Process for making plastic laminates with metal laminae for printed circuits especially, with endothermic heating |
| 07/30/1997 | EP0640151B1 Solder bumping of integrated circuit die |
| 07/30/1997 | EP0570448B1 Drilling printed circuit boards and entry and backing boards therefor |
| 07/30/1997 | CN1155968A Printed wiring board |
| 07/30/1997 | CN1155828A Multilayer printed circuit board and process for producing and using the same |
| 07/30/1997 | CN1155827A Paper phenolic resin printed circuit board and manufacture thereof |
| 07/30/1997 | CN1155759A Silicon nitride ceramic circuit substrate and semiconductor device using the same |
| 07/29/1997 | US5652693 Substrate with thin film capacitor and insulating plug |
| 07/29/1997 | US5652645 High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates |
| 07/29/1997 | US5652608 Ink jet recording head, ink jet recording head cartridge, recording apparatus using the same and method of manufacturing the head |
| 07/29/1997 | US5652561 Laminating type molded coil |
| 07/29/1997 | US5652466 Package for a semiconductor element |
| 07/29/1997 | US5652055 Matched low dielectric constant, dimensionally stable adhesive sheet |
| 07/29/1997 | US5652042 Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste |
| 07/29/1997 | US5652019 Depositing diluted nonconductive precursor solution on substrate using ink jet apparatus, drying to film, heating to transform to conductive coating |
| 07/29/1997 | US5651899 Structuring of printed circuit boards |
| 07/29/1997 | US5651834 Directing mist and solid carbon dioxide particles at object; cleaning circuit boards |
| 07/29/1997 | US5651694 Flat cable with conductor ends connectable to connector |
| 07/29/1997 | US5651493 Applying dye solution and allowing it to penetrate any interstices to identify any structural failure by visual analysis |
| 07/29/1997 | US5651180 Method of making a filled via in a dielectric substrate |
| 07/29/1997 | CA1339116C Process for electroplating pt onto a substrate |
| 07/24/1997 | WO1997026780A1 Circuit-board substrate |
| 07/24/1997 | DE19622445C1 Proximity switch with mechanical isolation of terminal pins and plug-insert |
| 07/24/1997 | DE19601649A1 Electronic component heat extracting apparatus for e.g. electronics of motor vehicle |
| 07/24/1997 | DE19601388A1 Leiterplatten-Trägervorrichtung PCB carrier device |
| 07/24/1997 | DE19600928A1 Handling device for number of circuit cards |
| 07/24/1997 | DE19546782C1 Electrical circuit arrangement e.g for sequential blasting system used in mining |
| 07/23/1997 | EP0785708A1 Electrostatic discharge protection device for electrical and electronic components |
| 07/23/1997 | EP0785471A2 Method and apparatus for forming fine patterns on printed circuit board |
| 07/23/1997 | EP0785297A2 An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application |
| 07/23/1997 | EP0785295A1 Electrolytic copper foil for printed wiring board and method for manufacturing the same |
| 07/23/1997 | EP0785068A2 Method for manufacturing laminate and apparatus for manufacturing same |
| 07/23/1997 | EP0784914A1 Method of manufacturing a printed circuit board |
| 07/23/1997 | EP0784913A2 Method of manufacturing devices comprising a base with a conductor pattern of electrical conductors |
| 07/23/1997 | EP0784539A1 Thermal management for additive printed circuits |
| 07/23/1997 | EP0784514A1 Method of and arrangement for applying a fluid to a surface |
| 07/23/1997 | EP0749594A4 Stable, ionomeric photoresist emulsion and process of preparation and use thereof |
| 07/23/1997 | EP0613610B1 Magnetic vias within a multilayer circuit board |
| 07/23/1997 | EP0499612B1 Electrically conductive polymer composition |
| 07/23/1997 | CN1155369A Solder pad for printed circuit boards |
| 07/23/1997 | CN1155230A Electroplating method |
| 07/23/1997 | CN1155163A Packed semicondcutor chip with reinforced heat-conductivity |
| 07/23/1997 | CN1155158A Multi-layer circuit substrate and mfg. method thereof |
| 07/23/1997 | CN1155154A Fitting structure of thermo-sensitive resistnace with positive resistance temp. characters |
| 07/23/1997 | CN1154993A Lead-wire protective coating composition, prepn. method and its structure |
| 07/22/1997 | US5650920 Mount for supporting a high frequency transformer in a hybrid module |
| 07/22/1997 | US5650919 Apparatus including a peak shaped dielectric dam |
| 07/22/1997 | US5650917 CPU card mounting structure |
| 07/22/1997 | US5650913 Thermally activated clamping apparatus and component part and method of use thereof |
| 07/22/1997 | US5650897 Wet etching the thick alumina layer and removing (in sequence) the metallic masking layers; studless; accuracy; stress relieving; reduced chipping; bonding strength; copper-free |
| 07/22/1997 | US5650665 Hybrid integrated circuit device including circuit patterns of different conductivity and circuit elements mounted on an insulating substrate |
| 07/22/1997 | US5650595 Electronic module with multiple solder dams in soldermask window |
| 07/22/1997 | US5650460 Polyurethanes with silver filling for electronics |
| 07/22/1997 | US5650357 Process for manufacturing a lead frame capacitor and capacitively-coupled isolator circuit using same |
| 07/22/1997 | US5650249 Method for making precision radomes |
| 07/22/1997 | US5650199 Printing an electrode on a ceramic layer with conductive ink, printing a pattern, coating with wet ceramic slurry, drying and printing |
| 07/22/1997 | US5650020 Colored soldered composition |
| 07/22/1997 | CA2080635C Foaming flux for automatic soldering process |
| 07/17/1997 | WO1997025847A1 Shielding of electronic components embedded in plastics directly on circuit board |
| 07/17/1997 | WO1997025845A1 Printed circuit assembly and method of manufacture therefor |
| 07/17/1997 | WO1997025844A1 Printed circuit multilayer assembly and method of manufacture therefor |
| 07/17/1997 | WO1997025843A1 Electrical component with foot-shaped connection wires |
| 07/17/1997 | WO1997025842A1 Electrical component with foot-shaped connection wires |
| 07/17/1997 | WO1997025841A1 Component for and method of making copper clad substrates |
| 07/17/1997 | WO1997025840A1 Electrical device |
| 07/17/1997 | WO1997025839A1 Printed wiring board and method for manufacturing the same |
| 07/17/1997 | WO1997025455A1 Rough electrical contact surface |
| 07/17/1997 | WO1997025331A1 Heterocycle-condensed morphinoid derivatives (ii) |
| 07/17/1997 | WO1997025175A1 High speed jet soldering system |
| 07/17/1997 | WO1997025152A1 Molten solder drop ejector |
| 07/17/1997 | WO1997025127A1 Method of filtering the organic solutions arising in the production of circuit boards |
| 07/17/1997 | DE19701824A1 Cylindrical electrical component with lead wires acting as support feet |
| 07/17/1997 | DE19701814A1 Cylindrical electrical component with lead wires providing support feet |
| 07/17/1997 | DE19642929A1 Multi-layered printed circuit board with HF component |
| 07/17/1997 | DE19600967A1 Verfahren zum Auftrennen von aus der Leiterplattenherstellung stammenden organischen Prozeßlösungen Method for separating derived from the organic circuit board manufacture process solutions |
| 07/17/1997 | DE19600617A1 Elektrisches Gerät Electrical equipment |
| 07/17/1997 | DE19600401A1 Surface-mounted semiconductor device |
| 07/17/1997 | CA2242609A1 Heterocycle-condensed morphinoid derivatives (ii) |
| 07/17/1997 | CA2242162A1 Method of filtering the organic solutions arising in the production of circuit boards |
| 07/17/1997 | CA2241446A1 Printed circuit multilayer assembly and method of manufacture therefor |
| 07/16/1997 | EP0784418A2 Process for manufacturing moulded three-dimensional circuitry bodies, so-called 3-D MID |
| 07/16/1997 | EP0783775A1 Solder-bearing lead and method of producing and using same |
| 07/16/1997 | EP0754120A4 Holographic document and method for forming |
| 07/16/1997 | EP0746482B1 Sensor unit for the control of a vehicle-occupant protection system |
| 07/16/1997 | EP0696410B1 Process for throughplating printed circuit boards using conductive plastics for direct plating |