Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/1997
08/12/1997US5657207 Alignment means for integrated circuit chips
08/12/1997US5657206 Conductive epoxy flip-chip package and method
08/12/1997US5657205 Vibration-generating-motor mounting structure and its mounting method
08/12/1997US5657104 Liquid crystal display device and manufacturing method thereof
08/12/1997US5657075 Method and apparatus for locating and facilitating the repair of defects on a printed circuit board
08/12/1997US5656985 Electronic surface mount package
08/12/1997US5656933 Solder paste and residue measurement system
08/12/1997US5656863 Resin seal semiconductor package
08/12/1997US5656862 Gap created by solder connections filled with curable cycloaliphatic polyepoxide or cyanate ester
08/12/1997US5656855 Lead frame and method for manufacturing same
08/12/1997US5656798 Terminal-carrying circuit board
08/12/1997US5656411 Two-part system; one part thermocurable material; other part curing system
08/12/1997US5656355 Multilayer elastic metallized material
08/12/1997US5656139 Electroplating apparatus
08/12/1997US5656115 Method of manufacturing flat wiring body
08/12/1997US5656113 Slurrying aluminum nitride, sintering aid and dielectric increasing compound, molding sheets, degreasing and sintering them
08/12/1997US5656081 Press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid
08/12/1997US5655859 Machine tool
08/12/1997US5655704 Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component
08/12/1997US5655703 Solder hierarchy for chip attachment to substrates
08/12/1997US5655354 Method and apparatus for automated verification and loading of precision drill bits into a drilling machine package
08/12/1997US5655291 Forming rigid circuit board
08/12/1997CA2125994C Field control and stability enhancement in multi-layer 3-dimensional structures
08/07/1997WO1997028675A1 Multiple chip module for mother board
08/07/1997WO1997028673A1 Polymer based circuit and method of making same
08/07/1997WO1997028668A1 Thin film fabrication technique for implantable electrodes
08/07/1997WO1997028542A1 Asymmetric resistor terminal
08/07/1997WO1997028296A1 Aqueous solution for forming metal complexes, tin-silver alloy plating bath, and process for producing plated object using the plating bath
08/07/1997WO1997028194A1 Dual-curing coating formulation and method
08/07/1997WO1997028053A1 Soft pack package and dispensing system for liquid photoimageable solder mask
08/07/1997WO1997021229A3 Electrically conducting reaction resin mixture
08/07/1997DE19650310A1 Dimensionally stable, untwisted, non-curved epoxide glass laminate production
08/07/1997DE19604242A1 Herstellung von schrägen Galvanikstrukturen Production of oblique galvanic structures
08/07/1997CA2244775A1 Soft pack package and dispensing system for liquid photoimageable solder mask
08/07/1997CA2236319A1 Asymmetric resistor terminal
08/06/1997EP0788300A1 Method and apparatus for forming a conductive layer on a printed wiring board terminal
08/06/1997EP0788197A1 Circuit board assembly plug connector
08/06/1997EP0788159A2 Microelectronic integrated circuit mounted on circuit board with solder column interconnection
08/06/1997EP0788154A2 Electronic circuit substrate
08/06/1997EP0788153A2 Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same
08/06/1997EP0787762A1 Plated molding and process for preparing plated moldings
08/06/1997EP0787585A1 Squeegee for screen printing electric elements and structures
08/06/1997EP0787559A1 Soldering alloy, cream solder and soldering method
08/06/1997EP0787537A1 Cleaning agent, method and equipment
08/06/1997EP0787224A1 Process for separating metal coatings
08/06/1997EP0787219A1 Laser method for plating vias
08/06/1997EP0699354B1 Planar cable array
08/06/1997EP0643903B1 Tin-bismuth solder connection having improved high temperature properties, and process for forming same
08/06/1997EP0569423B1 Process for soldering materials like printed circuit boards or sets of components in electronics or metals in engineering work
08/06/1997EP0564652B1 Manufacture of multilayer ceramic part, and multilayer ceramic part
08/06/1997EP0464144B1 A multilayer film and laminate for use in producing printed circuit boards
08/06/1997CN1156515A Anisotropically conducting adhesive and process for its production
08/06/1997CN1156392A Method for forming metallized pattern on top surface of printed circuit board
08/05/1997US5655209 Forming plurality of dielectric ceramic layers and of self-supporting conductive layers, firing
08/05/1997US5655108 Pattern-evaluation aiding device and method for the same
08/05/1997US5655030 Method for detecting the center of target marks by image processing
08/05/1997US5654878 Solder tail and electric connector incorporating same
08/05/1997US5654730 Liquid crystal display device
08/05/1997US5654590 Multichip-module having an HDI and a temporary supporting substrate
08/05/1997US5654586 High thermal conductivity, avoidance of fatigue, cracking
08/05/1997US5654585 Semiconductor device with at least one lead having a plurality of bent portions
08/05/1997US5654528 Flexible printed circuit
08/05/1997US5654387 Pressure sensitive adhesives
08/05/1997US5654243 Process for fabricating a semiconductor device in a resin package housed in a frame having high conductivity
08/05/1997US5654128 Single resist layer lift-off process for forming patterned layers on a substrate
08/05/1997US5654126 Photodefinable dielectric composition useful in the manufacture of printed circuits
08/05/1997US5653893 Chemical etching using methylene chloride and hydrogen fluoride
08/05/1997US5653834 Insulating opening with nickel oxideand glass; filling with conductive metal
08/05/1997US5653599 Method and apparatus for retention of a fragile conductive trace with a protective clamp
08/05/1997US5653381 Process and apparatus for producing a bonded metal coating
08/05/1997US5653379 Clad metal substrate
08/05/1997US5653017 Method of mechanical and electrical substrate connection
08/05/1997CA2196641A1 Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same
08/05/1997CA2196627A1 Circuit clip connector
07/1997
07/31/1997WO1997027727A1 Process for producing a conductor structure
07/31/1997WO1997027710A1 Method and apparatus for a cross-connect system with automatic facility information transference to a remote location
07/31/1997WO1997027646A2 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
07/31/1997WO1997027346A1 Misted precursor deposition method and apparatus with uv radiation applied to mist
07/31/1997WO1997027142A1 Ultrasonic mixing of through hole treating compositions
07/31/1997WO1997027051A1 Method for manufacturing laminates
07/31/1997WO1997011209A3 Process and device for treating holes or recesses in workpieces with liquid treatment agents
07/31/1997WO1996038031A3 Chip socket assembly and chip file assembly for semiconductor chips
07/31/1997DE19702515A1 Telescopic type zoom lens barrel
07/31/1997DE19702514A1 Drive lens mechanism for moving focusing lenses within given range
07/31/1997DE19702513A1 Lens drive mechanism for photographic camera
07/31/1997DE19702512A1 Lens guide mechanism for zoom lens of shutter-type camera
07/31/1997DE19702511A1 Encoder for detecting forward and reverse rotations for use in photographic camera
07/31/1997DE19702510A1 Flexible printed circuit board for electronic camera
07/31/1997DE19702508A1 Exposure control device for photographic camera
07/31/1997DE19702507A1 Shutter arrangement for camera with light intercepting device
07/31/1997DE19702506A1 Shutter arrangement for photographic camera
07/31/1997DE19702505A1 Lens barrel for zoom camera
07/31/1997DE19702504A1 Telescoping-type zoom lens for camera
07/31/1997DE19702501A1 Electronically controlled photographic camera
07/31/1997DE19702500A1 Position detection apparatus for electronically controlled photographic camera
07/31/1997DE19702499A1 Lens supporting structure in lens barrel of camera
07/31/1997DE19702497A1 Strobe charging system for capacitor used in photographic flash unit in camera
07/31/1997DE19702495A1 Encoder for exposure controller of motorised aperture diaphragm in camera
07/31/1997DE19702494A1 Camera body with housing facility for flexible printed circuit board
07/31/1997DE19702493A1 Lens barrel for zoom camera