| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/27/1997 | EP0791920A2 Recording medium cassette and a recording/reproducing apparatus |
| 08/27/1997 | EP0791671A1 Surface treating agent for copper or copper alloy |
| 08/27/1997 | EP0790892A1 Stencil holder |
| 08/27/1997 | EP0663140A4 Fabrication of dense parallel solder bump connections. |
| 08/27/1997 | CN1158101A Foiled UD-prepreg and PWB laminate prepared therefrom |
| 08/27/1997 | CN1158071A Electroplate lead structure for terminal electroplate |
| 08/27/1997 | CN1157849A Furfuryl alcohol mixtures for use as cleaning agents |
| 08/27/1997 | CA2180368A1 Improved tape feeder for automated electronic component assembly devices |
| 08/26/1997 | US5661744 Excimer laser beam irradiation apparatus for optically processing workpiece |
| 08/26/1997 | US5661647 Low temperature co-fired ceramic UHF/VHF power converters |
| 08/26/1997 | US5661441 Dielectric resonator oscillator and method of manufacturing the same |
| 08/26/1997 | US5661409 Field programmable printed circuit board |
| 08/26/1997 | US5661343 Power hybrid integrated circuit apparatus |
| 08/26/1997 | US5661341 Method of manufacturing a composite structure for use in electronic devices and structure, manufactured by said method |
| 08/26/1997 | US5661267 Detector alignment board |
| 08/26/1997 | US5661089 Method for making a semiconductor chip package with enhanced thermal conductivity |
| 08/26/1997 | US5661088 Disposing a malleable metallic layer overlying the first surface of substrate and hole, diposing an electroconductive layer in the hole, coupled to malleable layer, deforming the malleable layer, disposing an encapsulant into the hole |
| 08/26/1997 | US5661087 Vertical interconnect process for silicon segments |
| 08/26/1997 | US5661042 Process for electrically connecting electrical devices using a conductive anisotropic material |
| 08/26/1997 | US5660892 Creating sulfur-reactive surface on polymer substrate, depositing metal |
| 08/26/1997 | US5660883 Process for catalyzation in electroless plating |
| 08/26/1997 | US5660738 Direct etch processes for the manufacture of high density modules |
| 08/26/1997 | US5660632 Apparatus for spreading material onto a substrate |
| 08/26/1997 | US5660570 Micro emitter based low contact force interconnection device |
| 08/26/1997 | US5660321 Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts |
| 08/26/1997 | US5660270 Electrical switch having an internal lighting circuit |
| 08/26/1997 | US5659953 Method of manufacturing an apparatus having inner layers supporting surface-mount components |
| 08/26/1997 | US5659952 Method of fabricating compliant interface for semiconductor chip |
| 08/26/1997 | US5659951 Method for making printed circuit board with flush surface lands |
| 08/26/1997 | US5659950 Method of forming a package assembly |
| 08/26/1997 | US5659947 Device for automatically populating a top and a bottom side of printed-circuit boards with SMD components |
| 08/22/1997 | CA2197513A1 Dielectric breakdown interconnection |
| 08/21/1997 | WO1997030571A1 Coating pattern formation |
| 08/21/1997 | WO1997030477A1 Ball grid array electronic package standoff design |
| 08/21/1997 | WO1997030418A2 Method and device for bonding a wire conductor |
| 08/21/1997 | WO1997002733A3 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 08/21/1997 | EP0782766A3 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 08/21/1997 | DE19606246A1 Circuit board mounting fixture e.g. for double-lug type contact part |
| 08/21/1997 | DE19605595A1 Coating process of substrate in selective areas for e.g circuit boards |
| 08/21/1997 | DE19546888C1 Circuit board connector terminal machining method |
| 08/20/1997 | EP0790762A2 Conductive cooling of a heat-generating electronic component |
| 08/20/1997 | EP0790759A1 Device, particularly for use in an electronic control apparatus |
| 08/20/1997 | EP0790758A1 Printed circuit board sparkgap |
| 08/20/1997 | EP0790644A2 Process for manufacturing electric circuits |
| 08/20/1997 | EP0790332A1 A non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath |
| 08/20/1997 | EP0790123A2 Patterned metal foil laminate and method for making same |
| 08/20/1997 | EP0646281B1 Thermal protection device and process for activating the same |
| 08/20/1997 | EP0572540B1 Arrangement for driving a rotary tool |
| 08/20/1997 | CN1157547A Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom |
| 08/20/1997 | CN1157319A Cleaning compositions based on 1,1,1,2,2,4,4-heptafluorobutane and alcohols |
| 08/20/1997 | CN1157204A Sheet machining apparatus |
| 08/19/1997 | US5659630 For automatically inspecting a product for defects |
| 08/19/1997 | US5659458 Heat dissipative means for integrated circuit chip package |
| 08/19/1997 | US5659284 Electric fuse and protective circuit |
| 08/19/1997 | US5659245 ESD bypass and EMI shielding trace design in burn-in board |
| 08/19/1997 | US5659200 Semiconductor device having radiator structure |
| 08/19/1997 | US5659161 Rubber contact switch |
| 08/19/1997 | US5659153 Thermoformed three dimensional wiring module |
| 08/19/1997 | US5659007 Process for producing aromatic polyamide film |
| 08/19/1997 | US5658962 Omega-hydrofluoroalkyl ethers, precursor carboxylic acids and derivatives thereof, and their preparation and application |
| 08/19/1997 | US5658827 Method for forming solder balls on a substrate |
| 08/19/1997 | US5658611 Surface protection material for printed circuit board and process of forming surface protection films |
| 08/19/1997 | US5658499 Waterbase binder comprising an acrylic homo- or copolyemr and a neutralizing agent to promot silver flake dispersion |
| 08/19/1997 | US5658441 Roller brushes positioned between electrolyte spray heads and panel; metal anodes contact wet roller brushes to provide for electrical contact |
| 08/19/1997 | US5658156 Electrical connector and alignment apparatus for contact pins therefor |
| 08/19/1997 | US5657924 Method for wave soldering with lead-free solder materials |
| 08/19/1997 | US5657537 Method for fabricating a stack of two dimensional circuit modules |
| 08/19/1997 | US5657528 Method of transferring conductive balls |
| 08/19/1997 | CA2068992C Complex compounds of an oligomeric or polymeric nature |
| 08/14/1997 | WO1997029621A1 Printed-circuit board and electronic apparatus provided with the same |
| 08/14/1997 | WO1997029526A1 Circuit board clip connector |
| 08/14/1997 | WO1997029490A1 Anisotropic conductive composition |
| 08/14/1997 | WO1997029222A2 Production of bevelled galvanic structures |
| 08/14/1997 | WO1997028923A1 Solder, solder paste and soldering method |
| 08/14/1997 | WO1997022235A3 Solder mask for manufacture of printed circuit boards |
| 08/14/1997 | WO1997015702A3 Device for chemical or electrolytic surface treatment of plate-like objects |
| 08/14/1997 | DE19621211C1 Connecting point for soldered connection e.g. between contact pin, soldering lug and at least one conductor |
| 08/14/1997 | DE19619771A1 Ultrasonic bonding method e.g. for mounting wire conductor on substrate surface |
| 08/14/1997 | DE19618481C1 Manufacture of electronic module with plug contacts and conducting cover cap |
| 08/14/1997 | DE19604774A1 Plastics carrier with an induction coil |
| 08/14/1997 | DE19604614A1 Encapsulated electronic control device e.g. for motor vehicles |
| 08/14/1997 | DE19604489A1 Electrical measuring device for measuring the positions of two relatively moving objects |
| 08/14/1997 | DE19604319A1 Smart card with optical effect contact pads e.g. for telephone and bank credit cards |
| 08/14/1997 | DE19603822A1 Aluminium nitride substrate especially for direct copper bond metallisation |
| 08/13/1997 | EP0789507A2 Encapsulated electronic controlling device and method of fabricating the same |
| 08/13/1997 | EP0789397A2 Circuit board and semiconductor device using the circuit board |
| 08/13/1997 | EP0789390A2 A method for producing multilayer hybrid circuit |
| 08/13/1997 | EP0789352A1 Flex circuit head module within a tape drive |
| 08/13/1997 | EP0788728A1 Process for coating electrically non-conducting surfaces with connected metal structures |
| 08/13/1997 | EP0788727A1 Process for manufacturing electrical circuit bases |
| 08/13/1997 | EP0788726A1 Current supply module for mounting on a component-carrying printed circuit board |
| 08/13/1997 | EP0693138B1 Method for metallising plastics, and resulting products |
| 08/13/1997 | EP0603296B1 Solder bump fabrication method and solder bumps formed thereby |
| 08/13/1997 | EP0458916B1 Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil |
| 08/13/1997 | CN1157062A Electric power distribution system |
| 08/13/1997 | CN1156949A PC board and fixing body thereof |
| 08/13/1997 | CN1156948A Method of making circuitized substrate using two different metallization processes |
| 08/13/1997 | CN1035609C Method for reducing shrinkage during firing of ceramic bodies |
| 08/12/1997 | US5657242 Method of determining routes for a plurality of wiring connections and a circuit board produced by such a method |
| 08/12/1997 | US5657208 Surface mount attachments of daughterboards to motherboards |