| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/17/1997 | CN1159378A Laser working method and device |
| 09/16/1997 | US5668702 Combination axial and surface mount cylindrical package containing one or more electronic components |
| 09/16/1997 | US5668700 Panel assembly structure capable of connecting wiring line with electrode at fine pitch |
| 09/16/1997 | US5668699 System and method for providing uniform solder jiunt height for printed circuit boards and their assemblies |
| 09/16/1997 | US5668407 Integrated circuit carrier having lead-socket array with various inner dimensions |
| 09/16/1997 | US5668405 Semiconductor device with a film carrier tape |
| 09/16/1997 | US5668237 Silicon-containing polymer |
| 09/16/1997 | US5668194 Shell-core polymer from unsaturated silicon monomer |
| 09/16/1997 | US5668059 Filling gap with epoxy binder, filler, curing; noncracking |
| 09/16/1997 | US5668058 Soldering |
| 09/16/1997 | US5667934 Solder mask for printed circuits, epoxidized bisphenol a novolak, cationic photopolymerization catalyst |
| 09/16/1997 | US5667884 Area bonding conductive adhesive preforms |
| 09/16/1997 | US5667851 Process for preparing a metallized polymide film containing a hydrocarbyl tin compound |
| 09/16/1997 | US5667662 Conductive polymer, nonionic polymeric surfactant stabilizer with anionic end group |
| 09/16/1997 | US5667659 Low friction solder electrodeposits |
| 09/16/1997 | US5667412 Press-in contact |
| 09/16/1997 | US5667388 Printed circuit board adapter carrier for input/output cards |
| 09/16/1997 | US5667156 Process for the separation and isolation of precious and semi-precious metals from electronic circuit boards |
| 09/16/1997 | US5667132 Method for solder-bonding contact pad arrays |
| 09/16/1997 | US5666722 Method of manufacturing printed circuit boards |
| 09/16/1997 | US5666721 Method of soldering an electronic connector on a printed circuit board |
| 09/12/1997 | WO1997033311A1 Method for making electrical connections |
| 09/12/1997 | WO1997033013A1 Misted precursor deposition apparatus and method with improved mist and mist flow |
| 09/11/1997 | DE19608683A1 Production of substrate |
| 09/11/1997 | DE19608661A1 Moisture resistant contact for resistive rain sensor on motor vehicle window glass |
| 09/11/1997 | DE19600388A1 Smart card with electrically conducting contact pads |
| 09/10/1997 | EP0794572A2 Electronic component, method for making the same, and lead frame and mold assembly for use therein |
| 09/10/1997 | EP0794269A1 Composition for microetching copper or copper alloy |
| 09/10/1997 | EP0794132A1 Process for preserving solder paste |
| 09/10/1997 | EP0793903A1 Coating for the structured production of conductors on the surface of electrically insulating substrates |
| 09/10/1997 | EP0793853A1 Surface-mountable electrical component |
| 09/10/1997 | EP0793695A1 Pressure sensitive adhesives and damping constructions |
| 09/10/1997 | EP0649574B1 Electronic price-marking device |
| 09/10/1997 | CN1159201A Plated molding and process for preparing plated moldings |
| 09/10/1997 | CN1159135A 柔性印制电路 Flexible printed circuit |
| 09/10/1997 | CN1159134A Thick film compositions for via fill and capture pad applications |
| 09/10/1997 | CN1159133A Manufacturing method of metal substrate for PCB (printed circuit board) |
| 09/10/1997 | CN1159077A Method of bulging substrate by holding soldering paste stacking |
| 09/10/1997 | CN1158915A Non-cyanide brass plating bath and method of making metallic foilhaving brass layer using non-cyanide brass plating bath |
| 09/09/1997 | US5665650 Method for manufacturing a high density electronic circuit assembly |
| 09/09/1997 | US5665648 Integrated circuit spring contact fabrication methods |
| 09/09/1997 | US5665526 Thermally stable photoimaging composition |
| 09/09/1997 | US5665525 Method for producing printed circuit boards |
| 09/09/1997 | US5665459 Low-temperature fired ceramic circuit substrate and thick-film paste for use in fabrication thereof |
| 09/09/1997 | US5665195 Dimensional stability |
| 09/09/1997 | US5665172 Method for washing an article with composition having a brominated hydrocarbon and stabilizer |
| 09/09/1997 | US5664325 Fabrication process of wiring board |
| 09/09/1997 | CA2056950C Thermal print head |
| 09/04/1997 | WO1997032457A1 Method for manufacturing electronic circuit device |
| 09/04/1997 | WO1997032455A2 Printed circuit board fabrication apparatus |
| 09/04/1997 | WO1997032279A1 Integrated circuit card comprising a conductor pattern made of a conductive polymer |
| 09/04/1997 | DE19708254A1 Perforating organic film by two successive pulsed laser beams |
| 09/04/1997 | DE19610799C1 Zündeinrichtung zum Auslösen eines Rückhaltemittels in einem Kraftfahrzeug Ignition device for triggering a restraining means in a motor vehicle |
| 09/04/1997 | DE19609253A1 Complete encapsulation of formerly-bare conductors in walls of insulating casing at low cost |
| 09/04/1997 | DE19607726A1 Prevention of damage during soldering of surface mounted devices |
| 09/03/1997 | EP0793406A1 Process for producing multilayer wiring boards |
| 09/03/1997 | EP0793405A2 Multilayer electronic assembly utilizing a sinterable composition and related method of forming |
| 09/03/1997 | EP0792897A1 Aromatic polycarbodiimide and films thereof |
| 09/03/1997 | EP0792519A1 Interconnection elements for microelectronic components |
| 09/03/1997 | EP0792518A1 Method for fabricating a self-limiting silicon based interconnect for testing bare semiconductor dice |
| 09/03/1997 | EP0792517A1 Electrical contact structures from flexible wire |
| 09/03/1997 | EP0792463A1 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 09/03/1997 | EP0792462A1 Probe card assembly and kit, and methods of using same |
| 09/03/1997 | EP0792391A1 Electrolytic treatment device for plate-like workpieces, in particular printed circuit boards |
| 09/03/1997 | EP0792388A1 Method for directly depositing metal containing patterned films |
| 09/03/1997 | EP0792221A1 Symmetrical circuit connection board for vehicle application |
| 09/03/1997 | CN1158689A Printed wiring board, method of producing the same and electronic device |
| 09/02/1997 | US5663869 Packaging electrical components |
| 09/02/1997 | US5663654 For testing an array of semiconductor dice located on a wafer |
| 09/02/1997 | US5663598 Electrical circuit bonding interconnect component and flip chip interconnect bond |
| 09/02/1997 | US5663597 RF device package for high frequency applications |
| 09/02/1997 | US5663596 Semiconductor chip |
| 09/02/1997 | US5663542 Contact device for rain sensor of a vehicle |
| 09/02/1997 | US5663529 Anti-skew mounting pads and processing method for electronic surface mount components |
| 09/02/1997 | US5663526 Optical module with tolerant wave soldered joints |
| 09/02/1997 | US5663269 Organosiloxane fluids prepared using organo-lithium reagents |
| 09/02/1997 | US5663105 Semiconductor device package side-by-side stacking and mounting system |
| 09/02/1997 | US5662987 Multilayer printed wiring board and method of making same |
| 09/02/1997 | US5662816 Signal isolating microwave splitters/combiners |
| 09/02/1997 | US5662761 Method of manufacturing a UD-reinforced PWB laminate |
| 09/02/1997 | US5662755 Method of making multi-layered ceramic substrates |
| 09/02/1997 | US5662262 Tape withh solder forms and methods for transferring solder forms to chip assemblies |
| 09/02/1997 | US5661902 Methods of making printed circuit boards and heat sink structures |
| 09/02/1997 | US5661901 Method for mounting and electrically interconnecting semiconductor dice |
| 08/28/1997 | WO1997031515A1 High speed depaneling apparatus and method |
| 08/28/1997 | WO1997031510A1 Electrode pad for electric signal connection |
| 08/28/1997 | WO1997031395A1 Method of producing bumps on pads of electronic components |
| 08/28/1997 | WO1997031323A1 Method of producing a smart card |
| 08/28/1997 | WO1997031078A1 Polyamide based laminating, coverlay, and bond ply adhesive with heat activated cure component |
| 08/28/1997 | WO1997031051A1 Composition exhibiting improved fluorescent response |
| 08/28/1997 | WO1997031042A1 Reversible and irreversible water-based coatings |
| 08/28/1997 | DE19708037A1 Test unit for testing unencapsulated semiconductor integrated circuit |
| 08/28/1997 | DE19706983A1 Semiconductor electronics component surface fitting unit for motor vehicle |
| 08/28/1997 | DE19704600A1 Motor vehicle dashboard with printed circuit tracks formed on housing |
| 08/28/1997 | DE19547124A1 Rotary slide valve for selective application of pressure or suction esp for applying conducting paste to circuit boards |
| 08/28/1997 | CA2246319A1 High speed depaneling apparatus and method |
| 08/28/1997 | CA2245782A1 Reversible and irreversible water-based coatings |
| 08/28/1997 | CA2196024A1 Multilayer electronic assembly utilizing a sinterable composition and related method of forming |
| 08/27/1997 | EP0792093A2 Dielectric breakdown interconnection |
| 08/27/1997 | EP0792092A2 Process for manufacturing a composite arrangement |