| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 10/01/1997 | EP0797910A1 Method of plating through holes of a printed circuit board |
| 10/01/1997 | EP0797909A1 Copper coating |
| 10/01/1997 | EP0797908A1 Single alloy solder clad substrate |
| 10/01/1997 | EP0797690A1 Printed circuit board manufacture |
| 10/01/1997 | EP0797558A1 Electrically conductive connection |
| 10/01/1997 | EP0703859B1 Clamping-stretching system for stencils for screen printers, with printing table for pc boards |
| 10/01/1997 | CN1161065A High fatigue ductility electrodeposited copper foil |
| 10/01/1997 | CN1160984A Semiconductor device manufacturing method and package for semiconductor device |
| 10/01/1997 | CN1160983A Method for detecting deterioration of solder paste printing |
| 10/01/1997 | CN1160926A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 09/30/1997 | US5673179 Plastic integrated circuit card with reinforcement structure outer to the card and protecting integrated circuit module |
| 09/30/1997 | US5672846 Electrical connector |
| 09/30/1997 | US5672760 Obtaining a photoabsorber-containing acrylic polymer by using n-2-hydroxyethyl-n-ethyl aniline to obtain 4-((2-hydroxyethyl)ethylamino)-4'-(trifluoromethylsulfonyl)-tolane which reacts with a polymerizable methacrylic acid |
| 09/30/1997 | US5672542 Method of making solder balls by contained paste deposition |
| 09/30/1997 | US5672464 Exposure to computer controlled light source, for printed circuits |
| 09/30/1997 | US5672458 Laser dye or pigment removal imaging process |
| 09/30/1997 | US5672414 Multilayered printed board structure |
| 09/30/1997 | US5672407 Structure with etchable metal |
| 09/30/1997 | US5672400 Polyether and polyamide monomeric units, a tackifier and conductive particles |
| 09/30/1997 | US5672260 Electroplating solder materials onto portions of conductive layer which is on dielectric surface layer with apertures, then reflowing solder away from portions of dielectric surface |
| 09/30/1997 | US5672226 Process of forming multilayer circuit boards |
| 09/30/1997 | US5672220 Method of producing a laminated electronic device |
| 09/30/1997 | US5672062 Electrical connectors |
| 09/30/1997 | US5671531 Fabrication process for circuit substrate having interconnection leads |
| 09/30/1997 | CA1339485C Active energy ray-curable unsaturated resin composition |
| 09/25/1997 | WO1997035343A1 Improved solder joint reliability |
| 09/25/1997 | WO1997035342A1 Printed wiring board substrate for chip on board device and process for fabrication thereof |
| 09/25/1997 | WO1997035334A1 A method of selectively metallising an inner, electrically insulating surface of an open body, and a scan velocity modulator manufactured using such a method |
| 09/25/1997 | WO1997034786A1 Ignition device for release of restraining means in a motor vehicle |
| 09/25/1997 | WO1997034711A1 Aqueous alkali cleaning compositions |
| 09/25/1997 | WO1997029222A3 Production of bevelled galvanic structures |
| 09/25/1997 | DE19611137A1 Direct plastic metallising by electroplating |
| 09/25/1997 | DE19610586A1 Circuit board for precise placement and soldering of electronic components e.g. for fitting overvoltage protection modules |
| 09/24/1997 | EP0797381A2 Cast electric/electronic subassembly without using a PCB |
| 09/24/1997 | EP0797380A1 Method for enhancing the solderability of a surface |
| 09/24/1997 | EP0797379A2 Circuit board and process for mounting and soldering of electronic components in accurate positions on the surface of the circuit board |
| 09/24/1997 | EP0797378A2 Copper-clad laminate, multilayer copper-clad laminate and process for producing the same |
| 09/24/1997 | EP0797266A2 Dielectric filter and method of making same |
| 09/24/1997 | EP0796732A2 Method for manufacturing laminates and apparatus performing the method |
| 09/24/1997 | EP0796551A1 Fabrication multilayer combined rigid/flex printed circuit board |
| 09/24/1997 | EP0772636A4 Radiation- and/or moisture-curable silicone compositions |
| 09/24/1997 | EP0678216A4 Electroluminescent lamp devices and their manufacture. |
| 09/24/1997 | CN1160449A Support element |
| 09/24/1997 | CN1160447A Process for producing smart card module for contactless smart cards |
| 09/24/1997 | CN1160289A Method and apparatus for forming conductive layer on printed wiring board terminal |
| 09/24/1997 | CN1159984A Squeegee for screen printing and its production method |
| 09/24/1997 | CN1159979A Circuit board leveling apparatus |
| 09/23/1997 | US5671125 Vertical package mounted on both sides of a printed circuit board |
| 09/23/1997 | US5670994 Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion |
| 09/23/1997 | US5670750 Electric circuit card having a donut shaped land |
| 09/23/1997 | US5670590 Curable polyoxazolines with initiators for electronics, adhesives, sheets and fiber optic connectors |
| 09/23/1997 | US5670418 Overcoating with gold; then an electroconductive material |
| 09/23/1997 | US5670187 Plurality of rolls or strips |
| 09/23/1997 | US5670067 Apparatus for laser cutting wiring in accordance with a measured size of the wiring |
| 09/23/1997 | US5670063 Method for making an interface connection through an insulating part |
| 09/23/1997 | US5670003 Holographic document and method for forming |
| 09/23/1997 | US5669979 Photoreactive surface processing |
| 09/23/1997 | US5669972 Flex tab thick film metal mask |
| 09/23/1997 | US5669971 Selective coating apparatus |
| 09/23/1997 | US5669970 Stencil apparatus for applying solder paste |
| 09/23/1997 | US5669945 Abrasive blast media containing corrosion inhibitor |
| 09/23/1997 | US5669783 IC socket permitting checking connected state between IC socket and printed wiring board |
| 09/23/1997 | US5669775 Assembly for mounting components to flexible cables |
| 09/23/1997 | US5669774 Ball grid array socket |
| 09/23/1997 | US5669548 Soldering method |
| 09/23/1997 | US5669137 Method of making electronic package assembly with protective encapsulant material |
| 09/23/1997 | CA2088148C Solder fluxes bearing oxide removers generated by light |
| 09/23/1997 | CA2080333C Surge absorber |
| 09/18/1997 | WO1997034459A2 Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
| 09/18/1997 | WO1997034451A1 System for realising connection jumpers between the tracks of double-sided printed circuit boards |
| 09/18/1997 | WO1997034320A1 Method and apparatus for fabricating silicon dioxide and silicon glass layers in integrated circuits |
| 09/18/1997 | WO1997034247A2 Smart card, connection arrangement and method of producing a smart card |
| 09/18/1997 | WO1997034206A1 Multi-tool positioning system |
| 09/18/1997 | WO1997034189A1 Liquid crystal display |
| 09/18/1997 | WO1997034025A1 Microcontact printing of catalytic colloids |
| 09/18/1997 | WO1997033737A1 Method of forming articles and patterning surfaces via capillary micromolding |
| 09/18/1997 | WO1997033713A1 Method for isolating ultrafine and fine particles and resulting particles |
| 09/18/1997 | DE19710187A1 Flat surfaced ceramic multilayer substrate production |
| 09/18/1997 | DE19707253A1 Repeated firing resistant ceramic circuit substrate |
| 09/18/1997 | DE19610044A1 Smart card with inductive antenna for contactless data transmission |
| 09/18/1997 | DE19609877A1 Apparatus for wave soldering of workpieces |
| 09/18/1997 | CA2248127A1 A method to make a metallic layer on a surface of a detail for screening against electromagnetic radiation |
| 09/18/1997 | CA2199898A1 Printed-circuit board and method for the precise assembly and soldering of electronic components on the surface of the printed-circuit board |
| 09/17/1997 | EP0796038A2 High-frequency module |
| 09/17/1997 | EP0796037A1 Process and device for coating substrates, preferably circuit boards |
| 09/17/1997 | EP0795908A2 Multilayer high frequency circuit with integrated active elements |
| 09/17/1997 | EP0795907A1 Multilayer high-frequency circuit with integrated active elements |
| 09/17/1997 | EP0795906A2 An electronic-circuit assembly and its manufacturing method |
| 09/17/1997 | EP0795903A1 Method and apparatus for mounting components on a substrate |
| 09/17/1997 | EP0795878A2 Chip resistor |
| 09/17/1997 | EP0795788A1 Resist compositions for plating |
| 09/17/1997 | EP0795584A2 Radiation-curable fluorinated organosiloxane compositions |
| 09/17/1997 | EP0795262A1 Chemically grafted electrical devices |
| 09/17/1997 | EP0795200A1 Mounting electronic components to a circuit board |
| 09/17/1997 | EP0795043A1 Silver plating |
| 09/17/1997 | EP0794847A1 Process for bonding wires to oxidation-sensitive metal substrates which can be soldered |
| 09/17/1997 | EP0711448B1 Conductive microparticles and pressure-sensitive adhesive tapes made therefrom |
| 09/17/1997 | CN1159731A Method for testing copper slag of grounding layer of power source on inner layer of printed-circuit board and equipment |
| 09/17/1997 | CN1159730A Flexible printed circuit and making method |
| 09/17/1997 | CN1159678A Surface sound wave device |