H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1997
10/14/1997	US5677514 Metal-core PC board for insertion into the housing of an electronic device
10/14/1997	US5677511 Overmolded PC board with ESD protection and EMI suppression
10/14/1997	US5677450 Curing agent
10/14/1997	US5677398 Epoxy acrylate resins and their uses
10/14/1997	US5677393 Heat-resistant film adhesive for use in fabrication of printed circuit boards and process for using the same
10/14/1997	US5677014 On ceramic; coating; trimming with laser
10/14/1997	US5676907 Method for making near net shape ceramic-metal composites
10/14/1997	US5676866 Apparatus for laser machining with a plurality of beams
10/14/1997	US5676865 Method of and apparatus for providing welded joints
10/14/1997	US5676855 Multiple substrate and process for its production
10/14/1997	US5676789 Film peeling method and apparatus
10/14/1997	US5676788 Method for forming cavity structures using thermally decomposable surface layer
10/14/1997	US5676781 Mixing hollow and non-hollow inorganic powders, binder, solvent to form slurry, spreading on substrate, drying, cutting into sheets, forming via holes, printing conductor paste on surface, stacking sheets, firing
10/14/1997	US5676554 Board mounted connector
10/14/1997	US5676305 Method to achieve regulated force contact in pin transfer deposition of liquidus substances
10/14/1997	US5676301 Castellated nozzle and method of use thereof
10/14/1997	US5675889 Solder ball connections and assembly process
10/14/1997	US5675888 Molded printed circuit board with wipe-in connector and method of making same
10/14/1997	US5675884 Apparatus for multilayer conductor chip packaging
10/09/1997	WO1997037521A1 Method and apparatus for reducing warpage of an assembly substrate
10/09/1997	WO1997037520A1 Method for depositing solder onto pad-on and pad-off via contacts
10/09/1997	WO1997037403A1 Arrangement of two disconnectable flat conductors and a connection unit for connecting a flat conductor
10/09/1997	WO1997037373A2 Method for connecting area grid arrays to printed wire board
10/09/1997	WO1997037360A1 Flat cable and method of making
10/09/1997	WO1997037275A1 Liquid crystal display and apparatus using the same
10/09/1997	WO1997037062A1 Process and device for the electrochemical treatment of items with a fluid
10/09/1997	WO1997036773A1 Control unit
10/09/1997	WO1997036728A2 Adhesive bonding using variable frequency microwave energy
10/09/1997	WO1997036710A1 A solder dispensing apparatus
10/09/1997	WO1997024709A3 End-wall frame for led alphanumeric display
10/09/1997	DE19705383A1 Impact sensor e.g. for motor vehicle in-built airbag system
10/09/1997	DE19615481A1 Metallised ceramic electrical or electronic substrate - has convex curvature for elastic bending into tight contact with heat sink
10/09/1997	DE19613587A1 Arrangement for reducing electromagnetic radiation with circuit boards and other electronic circuit carriers
10/09/1997	DE19612555A1 Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens Process for the selective electrochemical treatment of printed circuit boards and device for carrying out the method
10/09/1997	CA2250020A1 Method and device for the electrochemical treatment with treatment liquid of an item to be treated
10/08/1997	EP0800338A2 Devices for minimising electromagnetic radiation in printed circuit boards and other electronic circuit carriers
10/08/1997	EP0800337A1 Blocking system for holding multilayer printed circuit boards in place during polymerisation of the intermediate insulating sheets
10/08/1997	EP0800336A1 Resin filler and multilayer printed wiring board
10/08/1997	EP0800102A1 Module comprising a fixed component and process for the fixation of this component
10/08/1997	EP0799912A1 Process for the electrolytic metallization of plastic surfaces
10/08/1997	EP0799911A1 Electroplating process and composition
10/08/1997	EP0799868A1 Insulating paints
10/08/1997	EP0799558A1 Method for depositing a protective coating on the components of an electronic board
10/08/1997	EP0799487A1 Electric component, in particular a coil, preferably for an smd assembly technique
10/08/1997	EP0799329A2 Conveyor device for vertically guiding plate-like objects for chemical or electrolytic surface-treatment
10/08/1997	EP0799327A1 Process for the corrosion protection of copper or copper alloys
10/08/1997	EP0799286A1 Mouldings made of polyurethane hot-melt-type adhesives
10/08/1997	EP0656025B1 Solution for coating non conductors with conductive polymers and their metallization process
10/08/1997	CN1161761A 球栅阵列插座 Ball grid array socket
10/08/1997	CN1161253A Spreding appratus
10/07/1997	US5675397 Electric connecting structure of display equipment
10/07/1997	US5675310 Thin film resistors on organic surfaces
10/07/1997	US5675302 Microwave compression interconnect using dielectric filled three-wire line with compressible conductors
10/07/1997	US5675299 Bidirectional non-solid impedance controlled reference plane requiring no conductor to grid alignment
10/07/1997	US5675192 Printed circuit board with header for magnetics all mounted to mother board
10/07/1997	US5675183 Hybrid multichip module and methods of fabricating same
10/07/1997	US5675180 Vertical interconnect process for silicon segments
10/07/1997	US5675121 For surface mounting of an electrical component
10/07/1997	US5674947 Method for preparing modified resins and their applications
10/07/1997	US5674934 Reversible and irreversible water-based coatings
10/07/1997	US5674660 Non-tacky photoimageable electrodepositable photoresist composition
10/07/1997	US5674659 Coating porous photoresist film on conductive substrate, roll-pressing with heating to change film from porous to uniform, photoetching
10/07/1997	US5674611 Rubber modified epoxy resin, polyvinyl acetal resin, melamine or urethane resin
10/07/1997	US5674596 Presence of the adhesive band that secures the copper and aluminum layers together, no prepreg dust or other contaminants are able to reach central zone before and during manufacturing
10/07/1997	US5674595 Flexible dielectric adhesive polymer free of conductive material and free of pre-formed film
10/07/1997	US5674580 Plastic foil for hot leaf stamping and method for forming
10/07/1997	US5674414 Method and apparatus of irradiating a surface of a workpiece with a plurality of beams
10/07/1997	US5674373 Method for metallizing non-conductive substrates
10/07/1997	US5674372 Selectively forming a sacrificial layer on metallic surfaces; then depositing carbon
10/07/1997	US5674326 Metal alloy coated by an agent that inhibits the reaction with dicarboxylic acid activator; prevents hardening or congealing over time
10/07/1997	US5673995 Support element for a motor vehicle indicating display, and a method of making it
10/07/1997	US5673846 Solder anchor decal and method
10/07/1997	US5673484 Method of manufacturing a magnetic head suspension
10/07/1997	US5673480 SCSI cable with termination circuit and method of making
10/07/1997	US5673479 Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer
10/07/1997	US5673478 Method of forming an electronic device having I/O reroute
10/05/1997	CA2201700A1 Blocking system for holding multilayer printed circuit boards in place during polymerisation of the intermediate insulating sheets
10/02/1997	WO1997036466A1 Perimeter matrix ball grid array circuit package with a populated center
10/02/1997	WO1997036465A1 A feeder system for supplying electrical components to pick up locations
10/02/1997	WO1997036464A1 Production of electrical circuit boards
10/02/1997	WO1997036340A1 Bidirectional non-solid impedance controlled reference plane
10/02/1997	WO1997036038A1 Screen-like plated article comprising mesh-like fabric using sheath-core composite filaments and cylinder for rotary screen
10/02/1997	WO1997035939A1 Coating fluid for low-permittivity silica coating and substrate provided with low-permittivity coating
10/02/1997	WO1997035924A1 Silicone composition cationically dual-curable by uv activation and condensation in the presence of atmospheric water, and one method for preparing same
10/02/1997	WO1997035790A1 Electrical components feeding and delivery system
10/02/1997	WO1997030418A3 Method and device for bonding a wire conductor
10/02/1997	DE19650296A1 Semiconductor device, e.g. ball grid array, production method
10/02/1997	DE19648728A1 High density semiconductor integrated circuit package apparatus
10/02/1997	DE19618917C1 Resin-sealed wired circuit board manufacturing method
10/02/1997	DE19612907A1 Reglereinheit Controller unit
10/02/1997	DE19612167A1 Computer housing
10/02/1997	CA2250206A1 Bidirectional non-solid impedance controlled reference plane
10/01/1997	EP0798954A1 Microelectronic casing with cooling system
10/01/1997	EP0798808A1 Device for fastening a cable harness to a support substrate
10/01/1997	EP0798802A2 RF flex circuit transmission line and interconnection method
10/01/1997	EP0798781A2 Silicon nitride circuit board and producing method therefor
10/01/1997	EP0798779A1 Ceramic circuit board
10/01/1997	EP0798772A1 Process for realizing a deposition on a detachable support, and realized deposition on a support
10/01/1997	EP0798571A2 Method of forming striped pattern of thin film material on board and masking apparatus used in the method
10/01/1997	EP0798401A2 Laminate and method for preparing same

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