H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1997
10/28/1997	US5682294 Integrated circuit card with a reinforcement structure for retaining and protecting integrated circuit module
10/28/1997	US5682293 Integrated circuit card having a reinforcement structure and an integrated circuit module disposed on opposing surfaces
10/28/1997	US5682228 Alignment method and apparatus in an exposing process
10/28/1997	US5682018 Interface regions between metal and ceramic in a metal/ceramic substrate
10/28/1997	US5681662 Copper alloy foils for flexible circuits
10/28/1997	US5681648 Printed wiring board and method for preparing the same
10/28/1997	US5681647 Nail-shaped conductive elements filled through holes of self-supporting polymeric layer; connectors
10/28/1997	US5681615 Dissolving a salt in a monomer solution, vacuum flash evaporating the solution, condensing evaporated solution as a liquid film, and depositing the composite material on to a substrate in vacuum atomosphere
10/28/1997	US5681485 Bisphenol-epichlorohydrin resin as photosensitive film for laminating onto insulating material carrying conductor pattern
10/28/1997	US5681444 Electroplating connector holes with nickel, then oxidizing it and covering with screen printed dielectric glass, firing to remove organic binders and solvents, applying conductive ink containing metal powder and glass, then more firing
10/28/1997	US5681443 Electrodeposition of electroconductive matal on to a nonmetallic, dielctric polymeric substrate, the time is reduced by reducing the gap between active anode surfaces and moving substrate thereby reducing thermal power loss too
10/28/1997	US5681441 Placing substrate in close proximity to cathode but such that there is no substantial electrical continuity between electroplatable surface and electrode
10/28/1997	US5681387 Segmented squeegee blade
10/28/1997	US5681205 Method of using abrasive blast media containing corrosion inhibitor
10/28/1997	US5681174 Electrical connector with releasable positioning cover
10/28/1997	US5680985 Reflow process for mixed technology on a printed wiring board
10/28/1997	US5680984 Apparatus and method for mounting soldering balls onto surfaces of electronic components
10/28/1997	US5680814 Squeegee device for screen printing processes
10/28/1997	US5680701 Fabrication process for circuit boards
10/28/1997	CA2044607C Peroxide composition for removing organic contaminants and method of using same
10/23/1997	WO1997039610A1 Organic-metallic composite coating for copper surface protection
10/23/1997	WO1997039609A1 Method for forming fiducial mark in resin stencil and stencil formed thereby
10/23/1997	WO1997039483A1 Method for manufacturing multi-chip modules utilizing direct lead attach
10/23/1997	WO1997039383A1 Method of manufacturing passive elements using conductive polypyrrole formulations
10/23/1997	WO1997039163A1 Process for manufacturing inductive counting systems
10/23/1997	WO1997038851A1 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
10/23/1997	WO1997038810A1 Method of manufacturing a sintered structure on a substrate
10/23/1997	WO1997027646A3 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
10/23/1997	DE19618254A1 Multi-layer circuit manufacturing method
10/23/1997	DE19615787A1 Verfahren zur Herstellung eines keramischen Multilayer-Substrats A method for producing a ceramic multilayer substrate
10/23/1997	DE19615643A1 Arrangement for protecting voltage-limited electronic modules against over-heating and over-voltage
10/23/1997	DE19615432A1 Mounting plate for electric components
10/23/1997	DE19615201A1 Metallising metal surfaces which are difficult to plate
10/23/1997	DE19615015A1 Electrical connection device for electronic equipment, such as audio and video devices and even data processing and telecomms. apparatus
10/23/1997	CA2228611A1 Process for manufacturing inductive counting systems
10/22/1997	EP0802711A2 Wiring board and its manufacturing method
10/22/1997	EP0802710A2 Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure
10/22/1997	EP0802707A1 Solderless method for connecting electrical components on a circuit board and electrical assembly according to this method
10/22/1997	EP0802706A1 Uni-pad for suface mount component package
10/22/1997	EP0802582A2 Contact device
10/22/1997	EP0802566A2 Semiconductor devices, method of connecting semiconductor devices, and semicondutor device connectors
10/22/1997	EP0802456A1 Resist compositions for circuit boards
10/22/1997	EP0802444A1 Holder for a liquid crystal display device
10/22/1997	EP0802266A1 Process for manufacturing inductive payment systems
10/22/1997	EP0802010A1 Reflow method and reflow device
10/22/1997	EP0801883A1 Method and device for the treatment of plate-shaped workpieces having small holes
10/22/1997	EP0801815A1 Electrical circuit suspension system
10/22/1997	EP0801692A2 Electroplating plant
10/22/1997	EP0766909A4 Vertical interconnect process for silicon segments
10/22/1997	EP0652820B1 Process for producing plastic laminates from continuously fed bands
10/22/1997	EP0615679B1 Electronic module assembly
10/22/1997	CN1163039A Process for coating electrically non-conducting surface with connected metal structures
10/22/1997	CN1162527A Laminate and method for preparing same
10/21/1997	US5680191 Driver tabs liquid crystal display having multi-contact
10/21/1997	US5680183 Structure of liquid crystal display device for easy assembly and disassembly
10/21/1997	US5679979 Surface mount package with heat transfer feature
10/21/1997	US5679976 Molded electric parts and method of manufacturing the same
10/21/1997	US5679929 Anti-bridging pads for printed circuit boards and interconnecting substrates
10/21/1997	US5679928 Electrical connecting structure for electrically connecting terminals to each other
10/21/1997	US5679631 Limonene and tetrahydrofurfurly alcohol cleaning agent
10/21/1997	US5679498 Patterned development of photosensitive dielectric layer, sensitizing with catalyst, patterning photoresist to delineate conductors, forming conductors, repeating to add successive layers
10/21/1997	US5679493 Masked exposure of photosensitive film to form charged pattern, distributing electroconductive particles in charged sections and covering with dielectric resin to form liquid crystal display
10/21/1997	US5679444 Method for producing multi-layer circuit board and resulting article of manufacture
10/21/1997	US5679268 Thin multi-layer circuit board and process for fabricating the same
10/21/1997	US5679266 Method for assembly of printed circuit boards with ultrafine pitch components using organic solderability preservatives
10/21/1997	US5679230 Copper foil for printed circuit boards
10/21/1997	US5679194 Fabrication of leads on semiconductor connection components
10/21/1997	US5679175 Using solvating agent having specified room temperature vapor pressure and solvating strength, and rinsing agent of specified vapor pressure and low ozone depletion potential
10/21/1997	US5679155 Method and apparatus for soldering circuit boards
10/21/1997	US5679009 Connector for a printed circuit board
10/21/1997	US5678752 Wave soldering process
10/21/1997	US5678304 Method for manufacturing double-sided circuit assemblies
10/21/1997	US5678301 Method for forming an interconnect for testing unpackaged semiconductor dice
10/21/1997	US5678287 Uses of uniaxially electrically conductive articles
10/16/1997	WO1997038563A1 Structrure and method for supporting one or more electronic components
10/16/1997	WO1997038562A1 Component mounting board, process for producing the board, and process for producing the module
10/16/1997	WO1997038469A1 Low friction, ductile, multilayer electrodeposits
10/16/1997	WO1997038429A1 Floating plate capacitor with extremely wide band low impedance
10/16/1997	WO1997038418A1 Multilayer thick film surge resistor network
10/16/1997	WO1997037807A1 Material-irradiation device and process for operation of material-irradiation devices
10/16/1997	DE19707834A1 Material irradiation unit used e.g. in production of circuit boards
10/16/1997	DE19620340C1 Circuit board for precise placement and soldering of electronic components e.g. for fitting overvoltage protection modules
10/16/1997	DE19614501A1 Ceramic-metal substrate with differential thermal expansion compensation
10/16/1997	DE19614147A1 Applying material of defined structure on carrier by spraying
10/16/1997	CA2224188A1 Parts-packaging substrate and method for manufacturing same as well as method for manufacturing a module
10/15/1997	EP0801521A2 Process for the manufacturing of electrically conductive passages in metallised plastic casings
10/15/1997	EP0801520A1 Method and apparatus for printing solder paste
10/15/1997	EP0801423A2 Hdmi decal and fine line flexible interconnect forming methods
10/15/1997	EP0800755A1 Dual air knife for hot air solder levelling
10/15/1997	EP0800754A1 Compliant interface for a semiconductor chip
10/15/1997	EP0800753A1 Microelectronic bonding with lead motion
10/15/1997	EP0800560A1 Pressure-sensitive adhesive tapes for electronics applications
10/15/1997	EP0800457A1 Method and apparatus for dispensing viscous material
10/15/1997	CN1162243A Multi-layer printed circuit board and method for mfg. same
10/15/1997	CA2202316A1 Electronic device assembly
10/14/1997	US5678168 Two conductive thick film pastes, each containing gold, platinum and palladium powders, glasses and oxides, chromium oxide, bismuth oxide, organic vehicle in differing amounts; one paste to be deposited on substrate, other on first layer
10/14/1997	US5677748 Lead wire arrangement for LCD having glass sealed wires
10/14/1997	US5677712 Semiconductor device
10/14/1997	US5677568 Thin IC card
10/14/1997	US5677515 Shielded multilayer printed wiring board, high frequency, high isolation

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