H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1997
11/11/1997	US5686743 Method of forming airbridged metallization for integrated circuit fabrication
11/11/1997	US5686703 Anisotropic, electrically conductive adhesive film
11/11/1997	US5686702 Polyimide multilayer wiring substrate
11/11/1997	US5686697 Electrical circuit suspension system
11/11/1997	US5686525 Polyimide precursor composition and the production of said polyimide precursor composition
11/11/1997	US5686317 Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die
11/11/1997	US5686230 Exposing senstive layer to collimated radiation through mask
11/11/1997	US5686226 Method of forming an applicator for applying tacking media to a circuit substrate
11/11/1997	US5686191 Polyimide adhesive, elasticity
11/11/1997	US5686172 Metal-foil-clad composite ceramic board and process for the production thereof
11/11/1997	US5686135 Printed circuit board
11/11/1997	US5685970 Method and apparatus for sequentially metalized polymeric films and products made thereby
11/11/1997	US5685968 Ceramic substrate with thin-film capacitor and method of producing the same
11/11/1997	US5685943 Film applying apparatus
11/11/1997	US5685939 Process for making a Z-axis adhesive and establishing electrical interconnection therewith
11/11/1997	US5685629 Vanity mirror assembly
11/11/1997	US5685477 Method for attaching and handling conductive spheres to a substrate
11/11/1997	US5685475 Apparatus for cooling printed circuit boards in wave soldering
11/11/1997	US5685070 Method of making printed circuit board
11/11/1997	US5685069 Device for contacting electric conductors and method of making the device
11/06/1997	WO1997041716A1 Surface-mounted attachment means and use thereof
11/06/1997	WO1997041713A1 New method of forming fine circuit lines
11/06/1997	WO1997041710A1 Beside-the-door programming system for programming hearing aids
11/06/1997	WO1997041595A1 Method and apparatus for attaching balls to a substrate
11/06/1997	WO1997041594A1 Multilayer solder/barrier attach for semiconductor chip
11/06/1997	WO1997041543A1 Resonant tag and method of manufacturing the same
11/06/1997	WO1997040976A1 Press machine
11/06/1997	DE19717611A1 Electronic component housing structure for e.g. semiconductor sensor and control integrated circuit
11/06/1997	DE19715673A1 Elektrische Bauteilanordnung Electrical component assembly
11/06/1997	DE19714721A1 Activated catalytic solution used in production of high frequency coils and filters
11/06/1997	DE19705003A1 Two-layer or multilayer circuit arrangement for SMD technique
11/06/1997	DE19704260A1 Selectively lacquer coating circuit boards
11/05/1997	EP0805616A1 Electrically conductive compositions
11/05/1997	EP0805615A2 Improved printed-circuit board
11/05/1997	EP0805614A1 Multilayered wiring board, prefabricated material for multilayered wiring board, process of manufacturing multilayered wiring board, electronic parts package, and method for forming conductive pillar
11/05/1997	EP0805492A2 Curved metal ceramic substrate
11/05/1997	EP0804990A1 Method of mounting circuit components on a flexible substrate
11/05/1997	EP0804865A1 Production of electrical circuit boards
11/05/1997	EP0804817A1 An electrically conductive wire
11/05/1997	EP0804806A1 Device for superheating steam
11/05/1997	EP0804637A1 Method and device for galvanizing plate-shaped products in horizontal continuous plants
11/05/1997	EP0760023B1 Device for processing flat workpieces, in particular printed circuit boards
11/05/1997	EP0616558B1 Method of coating surfaces with finely particulate materials
11/04/1997	US5684677 Electronic circuit device
11/04/1997	US5684675 Semiconductor device unit having holder
11/04/1997	US5684518 Interconnect scheme for mounting differently configured printheads on the same carriage
11/04/1997	US5684407 Electronic circuit packaged with a position sensor
11/04/1997	US5683978 Saturated linear polyfluorohydrocarbons in cleaning compositions
11/04/1997	US5683798 Tackified pressure sensitive adhesives
11/04/1997	US5683791 Copper wire
11/04/1997	US5683790 Resonators, filters
11/04/1997	US5683758 Apertures in substrates of barium titanate formed by beams of light and forming a coating on the substrate
11/04/1997	US5683743 Manufacturing circuit boards dipped in molten solder
11/04/1997	US5683601 Laser ablation forward metal deposition with electrostatic assisted bonding
11/04/1997	US5683565 Electroplating process
11/04/1997	US5683256 Integral thru-hole contacts
11/04/1997	US5683040 Method for recycling waste from printed circuit board assemblies from electrical and electronic devices
11/04/1997	US5683036 Apparatus for applying discrete coatings
11/04/1997	US5683023 Apparatus for separating micro-joint processed products and die used therefor
11/04/1997	US5682814 Apparatus for manufacturing resonant tag
11/02/1997	CA2204226A1 Improved low profile mounting of electronic components
10/1997
10/30/1997	WO1997040568A1 Small-sized motor and motor driver
10/30/1997	WO1997040555A1 Electrical connector for circuit board
10/30/1997	WO1997040530A1 Solder bump apparatus, electronic component and method for forming a solder bump
10/30/1997	WO1997040529A1 Process for producing a ceramic multilayer substrate
10/30/1997	WO1997032455A3 Printed circuit board fabrication apparatus
10/30/1997	DE19717039A1 Drying device for flexible or rigid PCBs
10/30/1997	DE19714544A1 Dry-electrolyte capacitor mounting method for printed circuit board
10/30/1997	DE19712825A1 Production of ceramic conductor substrate
10/30/1997	DE19711350A1 Soldering flux minimising corrosion, insulation defects and cracking of base resin
10/30/1997	DE19707298A1 Modular assembly group system
10/30/1997	DE19616424A1 Electrically isolating material with electronic module
10/29/1997	EP0804063A2 Electronic-part mounting
10/29/1997	EP0804061A1 Multilayered printed wiring board and its manufacture
10/29/1997	EP0804060A1 Multilayer circuit boards and processes of making the same
10/29/1997	EP0804059A1 Structure for mounting an electrical module on a board
10/29/1997	EP0804058A1 Solder method
10/29/1997	EP0804057A2 Improvements in or relating to connecting board for connection between base plate and mounting board
10/29/1997	EP0804056A2 Improvements in or relating to connecting board
10/29/1997	EP0804055A2 An entry board for drilling small holes, a method of making the same and a method for drilling small holes through a printed circuit board by using said entry board
10/29/1997	EP0804053A1 Assembly support having at least one heat generating component
10/29/1997	EP0803940A2 Connector for a circuit board
10/29/1997	EP0803920A2 Rechargeable type small electric appliance
10/29/1997	EP0803729A1 Device with two micromachined substrates for forming a microsystem or part of a microsystem and assembly method for two micromachined substrates
10/29/1997	EP0803592A1 Electrodeposition bath
10/29/1997	EP0803558A2 Conductive adhesive bonding means
10/29/1997	EP0803318A1 Tool magazine and changer arrangement for co-ordinate boring machines for printed circuit boards
10/29/1997	EP0803135A1 Electrical connections with deformable contacts
10/29/1997	EP0802990A1 Device for chemical or electrolytic surface treatment of plate-like objects
10/29/1997	EP0802835A1 Surface modification processing of flat panel device substrates
10/29/1997	EP0721660A4 Method for assembling an electronic package
10/29/1997	EP0678232B1 Plated compliant lead
10/29/1997	CN1163637A Method for directly depositing metal containing patterned films
10/29/1997	CN1163478A Electronic module and its producing method and its used lead wire frame and metal mould
10/29/1997	CN1163466A Wire-wound element for mounting on printed circuit board
10/29/1997	CN1163318A Electrolytic copper foil for printed circuit board and its producing method
10/29/1997	CN1163177A 激光加工装置 The laser processing apparatus
10/28/1997	US5682589 Multilayer; overcoated with tungsten, molybdenum alloy
10/28/1997	US5682296 Plastic integrated circuit card with reinforcement structure located over integrated circuit module for protecting same
10/28/1997	US5682295 Plastic integrated circuit card with reinforcement structure separated from integrated circuit module by card

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