| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 11/25/1997 | US5691003 Plating method by means of an electroless gold plating solution and system therefor |
| 11/25/1997 | US5690846 Laser processing method |
| 11/25/1997 | US5690837 Process for producing multilayer printed circuit board |
| 11/25/1997 | US5690805 Direct metallization process |
| 11/25/1997 | US5690780 Useful for bonding low surface energy substrates |
| 11/25/1997 | US5690750 Nonaqueous solvent; perfluorocarbon cleaning compounds |
| 11/25/1997 | US5690270 Surface mounting stress relief device and method |
| 11/25/1997 | US5689879 Copper, nickel-phosphorus alloy |
| 11/25/1997 | US5689878 Method for protecting electronic circuit components |
| 11/20/1997 | WO1997043884A1 Reflow soldering device |
| 11/20/1997 | WO1997043883A1 Device for mounting electrical components on printed-circuit boards |
| 11/20/1997 | WO1997043882A1 A circuit board |
| 11/20/1997 | WO1997043812A1 Protective device for an electronic circuit |
| 11/20/1997 | WO1997043656A2 Wafer-level burn-in and test |
| 11/20/1997 | WO1997043654A1 Microelectronic spring contact elements |
| 11/20/1997 | WO1997043653A1 Contact tip structures for microelectronic interconnection elements and methods of making same |
| 11/20/1997 | WO1997043352A1 Adhesive compositions and methods of use |
| 11/20/1997 | WO1997043123A1 Method for controlling screen printing machine |
| 11/20/1997 | WO1997043081A1 A solder composition |
| 11/20/1997 | WO1997043071A1 Molten solder dispensing system |
| 11/20/1997 | DE19700299A1 Hot embossing of metal foil elements from strip onto carrier |
| 11/20/1997 | DE19647035A1 Vorrichtung zum Schutz einer elektronischen Schaltung Device for protecting an electronic circuit |
| 11/20/1997 | DE19636429C1 Making weak line or desired break line with laser |
| 11/20/1997 | DE19620113A1 Verfahren und Vorrichtung zur Befestigung von Bonddrähten auf Bondlands einer Hybridschaltung Method and apparatus for attaching bond wires to bond lands of a hybrid circuit |
| 11/20/1997 | DE19620095A1 Circuit boards production |
| 11/20/1997 | DE19620025A1 Semiconductor chip carrier for chip card |
| 11/20/1997 | DE19619292A1 Circuit board mfg. technique for SMD |
| 11/20/1997 | CA2254883A1 Adhesive compositions and methods of use |
| 11/20/1997 | CA2253565A1 Emi protection and cte control of three-dimensional circuitized substrates |
| 11/20/1997 | CA2253483A1 Solder composition and method of using to interconnect electronic components to circuits on thermoplastic substrates |
| 11/19/1997 | EP0808087A2 Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards |
| 11/19/1997 | EP0807856A1 Device for double-sided exposure of printed circuit boards using masks |
| 11/19/1997 | EP0807855A1 Mask holder for a flat panel exposure device |
| 11/19/1997 | EP0807372A1 Printed circuit board and heat sink arrangement |
| 11/19/1997 | EP0807368A1 Upgradeable voltage regulator modules |
| 11/19/1997 | EP0807325A1 Press-fit connecting pin and electronic device using the same |
| 11/19/1997 | EP0807258A1 Test device for flat electronic assemblies |
| 11/19/1997 | EP0807190A1 Process for producing metal-coated materials |
| 11/19/1997 | CN1165609A Coating for the structured production of conductors on the surface of electrically insulating substrates |
| 11/19/1997 | CN1165608A Metallized laminate material having ordered distribution of conductive through holes |
| 11/19/1997 | CN1165584A Microelectronic assemblies including z-axis conductive films |
| 11/19/1997 | CN1165419A Printed circuit board sparkgap |
| 11/19/1997 | CN1165086A Printing squeegee apparatus |
| 11/19/1997 | CN1165076A Terminal plate resin die casting method and resin die casting forming metal modeld evice for die casting motor |
| 11/18/1997 | US5689428 Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture |
| 11/18/1997 | US5689227 Circuit board material with barrier layer |
| 11/18/1997 | US5688753 Flux removing composition |
| 11/18/1997 | US5688716 Fan-out semiconductor chip assembly |
| 11/18/1997 | US5688618 Millimeter wave device and method of making |
| 11/18/1997 | US5688601 Exterior protective layer for an electrical component |
| 11/18/1997 | US5688584 Multilayer electronic circuit having a conductive adhesive |
| 11/18/1997 | US5688583 Adhesive for printed circuit board |
| 11/18/1997 | US5688565 Integrated circuits |
| 11/18/1997 | US5688441 Used to connect wiring layers of ceramic multilayer substrate, metal and glass powders, vehicle, metal salt of organic acid, boron or silicon compound |
| 11/18/1997 | US5688408 Multilayer printed wiring board |
| 11/18/1997 | US5688352 Process for making of plastic laminates each having a metal lamina on each of two opposite side surfaces, especially for printed circuits |
| 11/18/1997 | US5688350 Method of laminate manufacture |
| 11/18/1997 | US5688326 Apparatus for coating elongated material with photoresist |
| 11/18/1997 | US5688324 Apparatus for coating substrate |
| 11/18/1997 | US5688150 Connector arrangement for a substrate |
| 11/18/1997 | US5688146 Printed plastic circuits and contracts and method for making same |
| 11/18/1997 | US5687901 Process and apparatus for forming ball bumps |
| 11/18/1997 | US5687602 Conductor for a flat cable, and manufacturing method and equipment therefor |
| 11/18/1997 | US5687479 Electrical trace interconnect assembly |
| 11/18/1997 | US5687476 Method of making printed circuit arrangement |
| 11/13/1997 | WO1997042800A1 Multi-layer stamped electrically conductive circuit and method for making same |
| 11/13/1997 | WO1997042799A1 A multi-layer moulded electronic device and method for manufacturing same |
| 11/13/1997 | WO1997042798A1 Process for establishing electrically conducting connections between two or more conductor structures |
| 11/13/1997 | WO1997042727A1 Process for producing a multilayered composite structure with electroconductive connections |
| 11/13/1997 | WO1997042687A1 Process for establishing an electroconductive connection between a sheathed copper wire and an electric conductor |
| 11/13/1997 | WO1997042684A1 Arrangement for forming discrete soldering joints |
| 11/13/1997 | WO1997042638A1 Electroconductive gluing process |
| 11/13/1997 | WO1997042515A1 Methods and systems for increased numbers of test points on printed circuit boards |
| 11/13/1997 | WO1997042060A1 Overlay substrate for securing electronic devices in a vehicle |
| 11/13/1997 | WO1997041991A1 Process for soldering electronic components to a printed circuit board |
| 11/13/1997 | WO1997041975A1 Method for cleaning electronic hardware components |
| 11/13/1997 | WO1997041969A1 Electroformed squeegee blade for surface mount screen printing |
| 11/13/1997 | DE19718093A1 Assembly base plate for mounting electronic components |
| 11/13/1997 | DE19625466C1 Chip card with visible contact areas of different colour from usual silver or gold |
| 11/13/1997 | DE19618227A1 Verfahren und Vorrichtung zum Verlöten von elektronischen Bauelementen auf einer Leiterplatte Method and apparatus for soldering of electronic components on a printed circuit board |
| 11/13/1997 | DE19618104A1 Verfahren zur Herstellung einer elektrisch leitenden Verbindung zwischen einem ummantelten Kupferdraht und einem elektrischen Leiter A process for producing an electrically conductive connection between a sheathed copper wire, and an electrical conductor |
| 11/13/1997 | DE19618100A1 Verfahren zur Herstellung einer Mehrlagen-Verbundstruktur mit elektrisch leitenden Verbindungen A process for producing a multi-layer composite structure with electrically conductive connections |
| 11/13/1997 | DE19618099A1 Leiterverbundsystem und Verfahren zur Herstellung elektrisch leitender Verbindungen zwischen zwei oder mehr Leiterstrukturen Composite conductor system and method for producing electrically conductive connections between two or more conductor structures |
| 11/13/1997 | CA2253336A1 Methods and systems for increased numbers of test points on printed circuit boards |
| 11/13/1997 | CA2252884A1 Overlay substrate for securing electronic devices in a vehicle |
| 11/12/1997 | EP0806892A1 Faraday cage |
| 11/12/1997 | EP0806262A1 Method and apparatus for wave soldering or wave tinplating |
| 11/12/1997 | EP0806128A1 Method of selectively removing a metallic layer from a non-metallic substrate |
| 11/12/1997 | EP0806127A1 An environmentally desirable method of manufacturing printed circuits, printed circuits made thereby and associated apparatus |
| 11/12/1997 | EP0806056A1 Glass bonding layer for a ceramic circuit board support substrate |
| 11/12/1997 | EP0805785A1 Low dielectric loss glasses |
| 11/12/1997 | EP0805722A1 Roughening of metal surfaces |
| 11/12/1997 | EP0795200A4 Mounting electronic components to a circuit board |
| 11/12/1997 | CN2267608Y Multi-point type tin applied soldering machine |
| 11/12/1997 | CN1164762A Integrated circuit tester for semiconductor |
| 11/12/1997 | CN1036405C Furfuryl alcohol mixtures for use as cleaning agents |
| 11/11/1997 | US5687209 Automatic warp compensation for laminographic circuit board inspection |
| 11/11/1997 | US5687062 High-thermal conductivity circuit board |
| 11/11/1997 | US5686994 Appearance inspection apparatus and appearance inspection method of electronic components |
| 11/11/1997 | US5686833 Load board enhanced for differential pressure retention in an IC test head |