| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/09/1997 | US5696207 Fluroropolymeric substrates with metallized surfaces and methods for producing the same |
| 12/09/1997 | US5696027 Method of manufacturing a semiconductor chip carrier affording a high-density external interface |
| 12/09/1997 | US5696013 Method of manufacturing semiconductor device having unit circuit-blocks |
| 12/09/1997 | US5695860 Resonant tag and method of manufacturing the same |
| 12/09/1997 | US5695828 Method for inducing electrical conductivity in zirconia ceramic surfaces |
| 12/09/1997 | US5695667 Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component |
| 12/09/1997 | US5695571 Cleaning with first liquid containing acid and organic solvent, cleaning with second liquid which does not contain acid |
| 12/09/1997 | US5695110 Procedure for soldering an insulated wire |
| 12/09/1997 | US5695109 Solder paste inter-layer alignment apparatus for area-array on-board rework |
| 12/09/1997 | US5694843 PC(printed circuit) board printing machine with cantilever-supported printing head and stencil holders and bi-directionally movable printing table |
| 12/09/1997 | CA2093407C Method for fabricating a ceramic multi-layer substrate |
| 12/09/1997 | CA2077406C Process for flip chip connecting semiconductor chip |
| 12/09/1997 | CA2028113C Electrically conductive feedthrough connection and methods of manufacturing same |
| 12/09/1997 | CA2011000C Solder assembly of components |
| 12/04/1997 | WO1997046070A1 Reel for winding photosensitive film |
| 12/04/1997 | WO1997046063A1 Lead attach for chip on board printed wiring board |
| 12/04/1997 | WO1997046062A1 Method of forming raised metallic contacts on electrical circuits for permanent bonding |
| 12/04/1997 | WO1997046061A1 Method of forming raised metallic contacts on electrical circuits |
| 12/04/1997 | WO1997046060A1 Method for mounting terminal on circuit board and circuit board |
| 12/04/1997 | WO1997046059A1 Method for mounting terminal on circuit board and circuit board |
| 12/04/1997 | WO1997046058A1 Conducting section device and method for manufacturing the same |
| 12/04/1997 | WO1997045893A1 Anisotropic conductive film |
| 12/04/1997 | WO1997045499A1 Pressure-sensitive adhesive having excellent heat resistance and heat conductivity, adhesive sheets, and method of securing electronic component to heat-radiating member therewith |
| 12/04/1997 | WO1997045268A1 Cleaning apparatus and cleaning method |
| 12/04/1997 | WO1997045265A1 Screen printing method and screen printing press |
| 12/04/1997 | WO1997045264A1 Screen printing apparatus and screen printing method |
| 12/04/1997 | WO1997045242A1 Circuit-carrying automotive component and method of manufacturing the same |
| 12/04/1997 | WO1997036728A3 Adhesive bonding using variable frequency microwave energy |
| 12/04/1997 | WO1997034459A3 Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
| 12/04/1997 | DE19718029A1 Electrical connection system for printed circuit boards |
| 12/04/1997 | DE19621766A1 Halbleiteranordnung mit Kunststoffgehäuse und Wärmeverteiler A semiconductor device with plastic housing and heat spreader |
| 12/03/1997 | EP0810697A2 Connector for a circuit board |
| 12/03/1997 | EP0810661A2 Microelectronic packaging using arched solder columns |
| 12/03/1997 | EP0810656A2 Semiconductor device substrate and method of manufacturing the same |
| 12/03/1997 | EP0810649A2 Method for coupling substrates and structure |
| 12/03/1997 | EP0810614A1 A resistor and its manufacturing method |
| 12/03/1997 | EP0810303A1 Process for the deposition of etch resistant and pore free tin layers or alloy layers of tin with other metals |
| 12/03/1997 | EP0810298A1 Thermoplastic resin molding with metallic layer formed on the surface thereof |
| 12/03/1997 | EP0810252A1 Photopolymerisable metallocene containing organosilicoxane compositions |
| 12/03/1997 | EP0810091A2 Ink supplier for feeding a printer device |
| 12/03/1997 | EP0809862A2 Organic chip carriers for wire bond-type chips |
| 12/03/1997 | CN2269695Y Ultrasonic peak welder |
| 12/03/1997 | CN1166912A A low cost, high performance package for microwave circuits in the up to 90 GHZ frequency range |
| 12/03/1997 | CN1166893A Electrical connector assembly with interleaved multilayer structure and fabrication method |
| 12/03/1997 | CN1166704A Connector for circuit board |
| 12/02/1997 | US5693701 Tamper-proof electronic coatings |
| 12/02/1997 | US5693599 Quaternary ammonium salt and hydrazine |
| 12/02/1997 | US5693572 Using heat conductive slug |
| 12/02/1997 | US5693559 Method for printing solder paste |
| 12/02/1997 | US5693455 Masking portions of photosensitive layer for heat insulation, then heating for removal, applying second mask to expose different areas, exposure to ultraviolet light and development |
| 12/02/1997 | US5693375 Method for transferring ink by printing method |
| 12/02/1997 | US5693364 Method for the manufacture of printed circuit boards |
| 12/02/1997 | US5693209 Process for metallization of a nonconductor surface |
| 12/02/1997 | US5692913 PC card |
| 12/02/1997 | US5692910 Printed-circuit board for use with card-edge connector and method |
| 12/02/1997 | US5692669 Printed circuit board |
| 12/02/1997 | US5692423 Vibration finishing method and apparatus for same |
| 12/02/1997 | US5692297 Method of mounting terminal to flexible printed circuit board |
| 12/02/1997 | US5692286 Method for shaping parts in one or more stacked board shaped elements and machine tool for implementing this method |
| 12/02/1997 | CA2067709C Process for the manufacture of printed circuits using electrophoretically deposited organic resists |
| 11/27/1997 | WO1997044879A1 Thin film electric motors and method of manufacture |
| 11/27/1997 | WO1997044861A1 Electrical and thermal anisotropically conducting structure |
| 11/27/1997 | WO1997044859A1 Connectors for microelectronic elements |
| 11/27/1997 | WO1997044836A1 Battery contact and retention apparatus for printed circuit boards |
| 11/27/1997 | WO1997044825A1 Surface mount package with heat transfer feature |
| 11/27/1997 | WO1997044823A1 Substrate for a semiconductor chip |
| 11/27/1997 | WO1997044819A1 Process and device for fastening bonding wires to bond lands of a hybrid circuit |
| 11/27/1997 | WO1997044676A1 Microelectronic contact structure and method of making same |
| 11/27/1997 | WO1997044192A1 Screen printing method and apparatus therefor |
| 11/27/1997 | WO1997044191A1 Printing method and printing apparatus |
| 11/27/1997 | WO1997044155A1 Method employing uv laser pulses of varied energy density to form blind vias in multilayered targets |
| 11/27/1997 | WO1997037373A3 Method for connecting area grid arrays to printed wire board |
| 11/27/1997 | DE19721141A1 Microwave range circuit assembly for MMIC |
| 11/27/1997 | DE19721061A1 Semiconductor module for power IGBT module |
| 11/27/1997 | DE19621125A1 Automobile electronics type SMD plug-in connector |
| 11/27/1997 | DE19620935A1 Process for coating polymers |
| 11/27/1997 | DE19620275A1 Conductive structure production in aluminium oxide substrate |
| 11/27/1997 | DE19620194A1 Arrangement for reducing electromagnetic radiation with circuit boards and other electronic circuit carriers |
| 11/27/1997 | CA2246329A1 Method employing uv laser pulses of varied energy density to form blind vias in multilayered targets |
| 11/26/1997 | EP0809424A1 Circuit board and method for manufacturing same |
| 11/26/1997 | EP0809423A1 Flexible board |
| 11/26/1997 | EP0809282A1 A method for treating a substrate surface, a method for producing an at least partially metallized substrate and a substrate having a treated surface |
| 11/26/1997 | EP0809151A1 Photoresist layer supporting film and photoresist film laminate |
| 11/26/1997 | EP0809150A1 Photosensitive aqueous developable thick film composition employing vinylpyrrolidone polymer |
| 11/26/1997 | EP0808508A1 Methods of mechanical and electrical substrate connection |
| 11/26/1997 | EP0735949B1 A press pad |
| 11/26/1997 | EP0689491B1 Smd-soldering installation |
| 11/26/1997 | CN1166187A Electrolytic treating device for plate-like workpieces, in particular printed circuit boards |
| 11/26/1997 | CN1165981A Device for supporting artwork for light exposure installation of flat piece |
| 11/25/1997 | US5691913 Layout designing apparatus for circuit boards |
| 11/25/1997 | US5691690 Chip type jumper |
| 11/25/1997 | US5691688 PTC device |
| 11/25/1997 | US5691649 Carrier having slide connectors for testing unpackaged semiconductor dice |
| 11/25/1997 | US5691509 Flexible cable termination and connector system |
| 11/25/1997 | US5691395 Applying a photosensitive layer on a substrate, the resin binder a polybutadiene with epoxy group and photoacid or base |
| 11/25/1997 | US5691245 Methods of forming two-sided HDMI interconnect structures |
| 11/25/1997 | US5691209 Lattice interconnect method and apparatus for manufacturing multi-chip modules |
| 11/25/1997 | US5691065 Polymerizable compositions made with polymerization initiator systems based on organoborane amine complexes |
| 11/25/1997 | US5691041 Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer |
| 11/25/1997 | US5691006 Water soluble acrylate polymer |