| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/29/1997 | EP0792462A4 Probe card assembly and kit, and methods of using same |
| 12/29/1997 | EP0734325B1 Ablative imaging by proximity lithography |
| 12/27/1997 | CA2207860A1 Method and control system for applying solder flux to a printed circuit |
| 12/24/1997 | WO1997049130A1 Method and apparatus for manufacturing side-terminated chips |
| 12/24/1997 | WO1997048658A1 Photosensitive ceramic green sheet, ceramic package, and process for producing the same |
| 12/24/1997 | CN1168618A High-frequency electron device |
| 12/24/1997 | CN1168617A Plastic ball grid array module |
| 12/23/1997 | US5701234 Surface mount component for selectively configuring a printed circuit board and method for using the same |
| 12/23/1997 | US5700987 Alignment and bonding techniques |
| 12/23/1997 | US5700629 Applying developing solution to photoresist surface while jetting controlled pressure gas at it for removal of narrow sections and formation of walls vertical to substrate, accuracy, resolution |
| 12/23/1997 | US5700607 Method of forming a multilayer printed circuit board and product thereof |
| 12/23/1997 | US5700562 Laminated resin films with predetermined coefficients of linear expansion |
| 12/23/1997 | US5700549 Structure to reduce stress in multilayer ceramic substrates |
| 12/23/1997 | US5700398 Composition containing a polymer and conductive filler and use thereof |
| 12/23/1997 | US5700389 Etching solution for copper or copper alloy |
| 12/23/1997 | US5700373 Method for sealing a filter |
| 12/23/1997 | US5700362 Method of treating copper foil for printed circuits |
| 12/23/1997 | US5699954 Device for securing an electronic component to a pin grid array socket |
| 12/23/1997 | US5699613 Fine dimension stacked vias for a multiple layer circuit board structure |
| 12/23/1997 | US5699612 Method of checking connected state between IC socket and printed wiring board |
| 12/23/1997 | US5699611 Method of hermetically self-sealing a flip chip |
| 12/23/1997 | US5699610 Process for connecting electronic devices |
| 12/23/1997 | US5699609 Method of making power substrate assembly |
| 12/23/1997 | CA2083077C Polyimide multilayer interconnection board and method of making the same |
| 12/18/1997 | WO1997048260A1 One-sided circuit board for multi-layer printed wiring board, multi-layer printed wiring board, and method for its production |
| 12/18/1997 | WO1997048259A1 Method for mounting electronic parts |
| 12/18/1997 | WO1997048258A1 Screen printing method and screen printing apparatus |
| 12/18/1997 | WO1997048257A1 Electrical circuit |
| 12/18/1997 | WO1997048256A1 Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same |
| 12/18/1997 | WO1997048187A1 Printed circuit board having integrated broadside microwave coupler |
| 12/18/1997 | WO1997048146A1 Ceramic stripline filter |
| 12/18/1997 | WO1997048117A1 The provision of color elements on substrates by means of a screen-printing or stencil-printing method |
| 12/18/1997 | WO1997048020A1 The provision of tracks on flat substrates by means of a stencil-printing method |
| 12/18/1997 | WO1997047426A1 Lead-free, high tin ternary solder alloy of tin, silver, and indium |
| 12/18/1997 | WO1997047425A1 Lead-free, high tin ternary solder alloy of tin, silver, and bismuth |
| 12/18/1997 | DE19725108A1 Hot melt adhesive for making printed circuit boards |
| 12/18/1997 | DE19626100C1 Application of multi-component resin to small electronic parts |
| 12/18/1997 | CA2258108A1 Microwave stripline structure |
| 12/17/1997 | EP0813356A1 Hold-down collar for attachment of IC substrates and elastomeric material to PCBs |
| 12/17/1997 | EP0813355A2 Printed circuit board with embedded decoupling capacitance and method for producing same |
| 12/17/1997 | EP0813235A2 Method for manufacturing multilayer wiring board and wiring pattern forming apparatus |
| 12/17/1997 | EP0813205A2 Single in-line memory module |
| 12/17/1997 | EP0813204A2 Single in-line memory module |
| 12/17/1997 | EP0812527A1 Sealed packaging for environmental protection of electronics |
| 12/17/1997 | EP0812258A1 Electrical feedthroughs for ceramic circuit board support substrates |
| 12/17/1997 | CN2271092Y Cantilever and bidirectional displacement type circuit board press |
| 12/17/1997 | CN1168221A Multilayered printed wiring board and its manufacture |
| 12/17/1997 | CN1168195A Method for forming bump of semiconductor device |
| 12/17/1997 | CN1168080A Attached terminal component mounting structure |
| 12/17/1997 | CN1168079A Method and machine for wave soldering or tinning |
| 12/17/1997 | CN1168078A Printed-circuit board and method for precise assembly and soldering of electronic components on surface of printed-circuit board |
| 12/17/1997 | CN1168077A Wiring board and its making method |
| 12/17/1997 | CN1168008A Connector for circuit board |
| 12/17/1997 | CA2208098A1 Radio pager |
| 12/17/1997 | CA2207701A1 Process for producing metal-coated films in web form |
| 12/17/1997 | CA2206713A1 Tape comprising solvent-containing non-tacky, free-standing, fully imidized polyimide film |
| 12/16/1997 | US5699235 Electronic control board assembly including embedded lead frames for electrically connecting the circuit boards of the assembly |
| 12/16/1997 | US5699234 Stacking of three dimensional high density interconnect modules with metal edge contacts |
| 12/16/1997 | US5699231 Method of packaging high voltage components with low voltage components in a small space |
| 12/16/1997 | US5699230 Electric circuit device and ignition apparatus for internal combustion engine using the same |
| 12/16/1997 | US5699228 Method of interconnecting leadless devices to printed wiring boards and apparatus produced thereby |
| 12/16/1997 | US5699185 Use of fresnel zone plates for material processing |
| 12/16/1997 | US5699032 For protecting a circuit |
| 12/16/1997 | US5698895 Silicon segment programming method and apparatus |
| 12/16/1997 | US5698819 Surface mount electronic reed switch component |
| 12/16/1997 | US5698623 Resin precursors having thixotropic properties and fillers stabilized against settling |
| 12/16/1997 | US5698496 Filling micro-channels of a non-conducting matrix with a liquid precursor of conductive material, heating and decomposing the dried precursor to form hollow tubular or porous conductive pathways |
| 12/16/1997 | US5698470 Fabrication method of multilayer printed wiring board |
| 12/16/1997 | US5698465 Process for manufacturing an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating |
| 12/16/1997 | US5698376 Blend of binder, photopolymerizable material and photoinitiator |
| 12/16/1997 | US5698366 Method for preparation of an imaging element |
| 12/16/1997 | US5698268 Resin composition for electroless metal deposition and method for electroless metal deposition |
| 12/16/1997 | US5698087 Plating bath and method for electroplating tin and/or lead |
| 12/16/1997 | US5698068 Thermocompression bonding equipment |
| 12/16/1997 | US5698015 Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste |
| 12/16/1997 | US5697796 Contact sleeve |
| 12/11/1997 | WO1997047165A1 Resin-carrying metal foil for multilayered wiring board, process for manufacturing the same, multilayered wiring board, and electronic device |
| 12/11/1997 | WO1997047164A2 Method of exposing a path on a curved, or otherwise irregularly shaped surface |
| 12/11/1997 | WO1997047087A1 Proximity switches with mechanical decoupling of terminal pins and plug-in unit |
| 12/11/1997 | WO1997047037A1 Semiconductor arrangement with plastic housing and heat spreader |
| 12/11/1997 | WO1997047031A1 Method for mounting semiconductor chip |
| 12/11/1997 | WO1997047019A2 A surface-mount fuse and the manufacture thereof |
| 12/11/1997 | WO1997046731A1 Electroless copper plating solution and method for electroless copper plating |
| 12/11/1997 | WO1997046350A1 Solder for electronic part bonding electrodes, and soldering method |
| 12/11/1997 | WO1997046349A1 Blind via laser drilling system |
| 12/11/1997 | DE19724473A1 Suppression filter for reducing switching interference signals in static converter |
| 12/11/1997 | DE19625398C1 Leiterplatte mit leiterbahnartigen Steckkontaktstellen PCB with conductor track-like plug contact positions |
| 12/11/1997 | CA2257467A1 A surface-mount fuse and the manufacture thereof |
| 12/11/1997 | CA2257185A1 Electroless copper plating solution and method for electroless copper plating |
| 12/10/1997 | EP0812015A1 A heat dissipator for integrated circuits |
| 12/10/1997 | EP0811993A2 Electrical devices |
| 12/10/1997 | EP0811705A1 Defluxing agent and cleaning apparatus |
| 12/10/1997 | EP0811480A1 Metal film bonded body, bonding agent layer and bonding agent |
| 12/10/1997 | EP0811308A1 Board matched nested support fixture |
| 12/10/1997 | EP0811245A1 Microelectronic assemblies including z-axis conductive films |
| 12/10/1997 | CN1167563A Chemically grafted electrical device |
| 12/10/1997 | CN1036693C Method for forming tin solder durable figures with photosensitive thermosetting resin composition |
| 12/09/1997 | US5696478 Soldering pin, especially for use in a coil former |
| 12/09/1997 | US5696404 Semiconductor wafers with device protection means and with interconnect lines on scribing lines |
| 12/09/1997 | US5696353 Flexible circuit |