Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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01/07/1998 | EP0817551A1 Motor mounting bracket for PCB |
01/07/1998 | EP0817550A1 Circuit board with improved positioning means |
01/07/1998 | EP0817549A2 Circuit board and method of producing the same |
01/07/1998 | EP0817548A1 Printed wiring board and method for manufacturing the same |
01/07/1998 | EP0817325A1 Contact device for electrical connection of a circuit board to a liquid crystal display support |
01/07/1998 | EP0817267A1 Semiconductor package having pins connected to inner layers of multilayer structure |
01/07/1998 | EP0817266A2 Mounting structure for an integrated circuit |
01/07/1998 | EP0815999A1 Method & control system for applying solder flux to a printed circuit |
01/07/1998 | EP0815709A1 A motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple integrated circuit packages |
01/07/1998 | EP0815622A1 Cross-connect method and apparatus |
01/07/1998 | EP0815591A2 Microcircuit via interconnect |
01/07/1998 | EP0815589A2 Process for fabricating layered superlattice materials and making electronic devices including same |
01/07/1998 | EP0815499A1 Multi-rate positioner system having an improved profiling filter |
01/07/1998 | EP0770006B1 Stencil for depositing and portioning variously thick spot layers of a viscous material |
01/07/1998 | EP0746884A4 Spring biased tapered contact element |
01/07/1998 | CN1169653A Manual electronic-part mounting apparatus and method |
01/07/1998 | CN1036972C Component for manufaturing printed circuit boards |
01/06/1998 | US5706181 Sensor unit for controlling an occupant protection system of a motor vehicle |
01/06/1998 | US5706180 Electronic device protected from shocks by encapsulation |
01/06/1998 | US5706178 Ball grid array integrated circuit package that has vias located within the solder pads of a package |
01/06/1998 | US5706175 Resin-sealed semiconductor device |
01/06/1998 | US5706174 Compliant microelectrionic mounting device |
01/06/1998 | US5706040 Reliable contact pad arrangement on plastic print cartridge |
01/06/1998 | US5705857 Capped copper electrical interconnects |
01/06/1998 | US5705848 Power semiconductor module having a plurality of submodules |
01/06/1998 | US5705570 Acrylate polymers |
01/06/1998 | US5705463 Composition and process for removal of ionic salt deposits |
01/06/1998 | US5705298 Holographic method for generating three dimensional conformal photo lithographic masks |
01/06/1998 | US5705230 Method for filling small holes or covering small recesses in the surface of substrates |
01/06/1998 | US5705219 Method for coating surfaces with finely particulate materials |
01/06/1998 | US5705082 Coating, etching |
01/06/1998 | US5705022 Continuous lamination of electronic structures |
01/06/1998 | US5704795 Electrical connectors |
01/06/1998 | US5704794 For propagation of electrical signals |
01/06/1998 | US5704536 Automatic ball placing device |
01/06/1998 | US5704535 Shield and method for selective wave soldering |
01/06/1998 | US5704287 Flip up side stencil to be used with single site stencil printer |
01/06/1998 | US5704286 Screen printing apparatus |
01/06/1998 | US5704116 Method of holding a component using an anhydride fluxing agent |
01/06/1998 | CA2109761C Electronic module of extra-thin construction |
01/06/1998 | CA2083197C Use of imidazole-2-thione as complexing agent in displacement tin plating |
01/06/1998 | CA2068657C Moisture resistant electrically conductive cements and methods for making and using same |
01/02/1998 | DE19726571A1 Electrical connector for ribbon cable or printed circuit substrate |
01/02/1998 | DE19725625A1 Semiconductor casing with bottom leads |
01/02/1998 | DE19725424A1 Circuit card with flush-mounted components and for insertion in computer expansion slot |
01/02/1998 | DE19638637A1 Mounting LED displays and other devices on printed circuit boards |
01/02/1998 | DE19626082A1 Package for surface-mounted semiconductor device |
01/02/1998 | DE19625934C1 Electrical conductor for coupling double-sided printed circuit conductor paths |
01/02/1998 | DE19625756A1 Modul für ein elektrisches Gerät Module for an electrical appliance |
01/02/1998 | DE19625386A1 Multilayer, double-sided, flexible or rigid electrical and optical circuit board production avoiding chemicals recovery |
01/02/1998 | DE19625139A1 Solder bump production on substrate |
01/01/1998 | CA2208292A1 Contact device for electrically connecting a printed circuit board with a liquid crystal display |
12/31/1997 | WO1997050281A1 Filter chip |
12/31/1997 | WO1997050280A1 Thick-film conductor circuit and production method therefor |
12/31/1997 | WO1997050156A1 Printed circuit board with plug-in contact points of the printed conductor type |
12/31/1997 | WO1997050148A1 Latticework with plurality of overlying lines |
12/31/1997 | WO1997050126A1 A c4 substrate contact pad which has a layer of ni-b plating |
12/31/1997 | WO1997050001A1 A method of testing and fitting electronic surface-mounted components |
12/31/1997 | WO1997049841A1 Process for the reduction of copper oxide |
12/31/1997 | WO1997049790A1 Aqueous cleaning composition for removing flux and method of use |
12/31/1997 | WO1997049549A1 A process for producing polytetrafluoroethylene (ptfe) dielectric boards on metal plates |
12/31/1997 | CN1169235A Printed circuit board and heat sink arrangement |
12/31/1997 | CN1169234A Resin filler and multi-layer printed wiring board |
12/31/1997 | CN1169095A Antennas and their making methods and electronic devices or timepieces with same antennas |
12/31/1997 | CN1169031A Method and device for forming convex |
12/31/1997 | CN1036887C Ultrasonic welding and electric circuit |
12/30/1997 | US5703762 Arrangement for connecting wiring backplanes and module circuit boards |
12/30/1997 | US5703761 Shielding for flat modules |
12/30/1997 | US5703752 Heat dissipating apparatus for a semiconductor device for use in a motor drive |
12/30/1997 | US5703542 Compact temperature stabilized crystal oscillator |
12/30/1997 | US5703341 Method for adhesion of metal films to ceramics |
12/30/1997 | US5703331 Circuitized structure including flexible circuit with elastomeric member bonded thereto |
12/30/1997 | US5702820 Blend of epoxy resin and unsaturated carboxylic acid |
12/30/1997 | US5702807 Ceramic circuit board and manufacturing method thereof |
12/30/1997 | US5702662 Process for ablating high density vias in flexible substrate |
12/30/1997 | US5702584 Enhanced plating adhesion through the use of metallized fillers in plastic substrate |
12/30/1997 | US5702583 Using photoresist |
12/30/1997 | US5702255 Ball grid array socket assembly |
12/30/1997 | US5702213 Retractable registration pin apparatus |
12/30/1997 | US5702051 Device for moving an object by means of thermal change in shape or volume |
12/30/1997 | US5701821 Screen cleaning apparatus and screen cleaning method |
12/30/1997 | US5701667 Method of manufacture of an interconnect stress test coupon |
12/30/1997 | US5701654 Precision fluid head transport |
12/30/1997 | CA2067266C Composition containing 1,1-dichloro-1-fluoroethane, 1,1,1,3,3-pentafluorobutane and methanol for the cleaning or drying of solid surfaces |
12/30/1997 | CA2060941C System for performing work on workpieces |
12/29/1997 | EP0814645A1 Electric connector assembly with improved registration characteristics |
12/29/1997 | EP0814644A1 Improved copper foil for printed circuit boards |
12/29/1997 | EP0814643A2 Multilayer printed circuit board |
12/29/1997 | EP0814539A2 Method and apparatus for connecting flexible circuits to printed circuit boards |
12/29/1997 | EP0814511A2 Plastic ball grid array module |
12/29/1997 | EP0814510A2 TAB tape and semiconductor device using the TAB tape |
12/29/1997 | EP0814504A2 Semiconductor mounting substrate having micronized wire and method of manufacturing the same |
12/29/1997 | EP0814382A1 Improved photoresists and method for making printing plates |
12/29/1997 | EP0814182A1 Process for producing strip-shaped metal coated foil |
12/29/1997 | EP0814175A2 CVD of metals using iodide precursor |
12/29/1997 | EP0814138A2 Tape comprising solvent-containing non-tacky, free-standing, fully imidized polyimide film |
12/29/1997 | EP0813750A1 Process for making a z-axis adhesive and establishing electrical interconnection therewith |
12/29/1997 | EP0813618A1 Currentless metallisation process for non electroconductive substrates |
12/29/1997 | EP0813590A1 Cleaning process and apparatus |
12/29/1997 | EP0813521A1 Energy-activatable salts with fluorocarbon anions |