Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/1998
01/07/1998EP0817551A1 Motor mounting bracket for PCB
01/07/1998EP0817550A1 Circuit board with improved positioning means
01/07/1998EP0817549A2 Circuit board and method of producing the same
01/07/1998EP0817548A1 Printed wiring board and method for manufacturing the same
01/07/1998EP0817325A1 Contact device for electrical connection of a circuit board to a liquid crystal display support
01/07/1998EP0817267A1 Semiconductor package having pins connected to inner layers of multilayer structure
01/07/1998EP0817266A2 Mounting structure for an integrated circuit
01/07/1998EP0815999A1 Method & control system for applying solder flux to a printed circuit
01/07/1998EP0815709A1 A motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple integrated circuit packages
01/07/1998EP0815622A1 Cross-connect method and apparatus
01/07/1998EP0815591A2 Microcircuit via interconnect
01/07/1998EP0815589A2 Process for fabricating layered superlattice materials and making electronic devices including same
01/07/1998EP0815499A1 Multi-rate positioner system having an improved profiling filter
01/07/1998EP0770006B1 Stencil for depositing and portioning variously thick spot layers of a viscous material
01/07/1998EP0746884A4 Spring biased tapered contact element
01/07/1998CN1169653A Manual electronic-part mounting apparatus and method
01/07/1998CN1036972C Component for manufaturing printed circuit boards
01/06/1998US5706181 Sensor unit for controlling an occupant protection system of a motor vehicle
01/06/1998US5706180 Electronic device protected from shocks by encapsulation
01/06/1998US5706178 Ball grid array integrated circuit package that has vias located within the solder pads of a package
01/06/1998US5706175 Resin-sealed semiconductor device
01/06/1998US5706174 Compliant microelectrionic mounting device
01/06/1998US5706040 Reliable contact pad arrangement on plastic print cartridge
01/06/1998US5705857 Capped copper electrical interconnects
01/06/1998US5705848 Power semiconductor module having a plurality of submodules
01/06/1998US5705570 Acrylate polymers
01/06/1998US5705463 Composition and process for removal of ionic salt deposits
01/06/1998US5705298 Holographic method for generating three dimensional conformal photo lithographic masks
01/06/1998US5705230 Method for filling small holes or covering small recesses in the surface of substrates
01/06/1998US5705219 Method for coating surfaces with finely particulate materials
01/06/1998US5705082 Coating, etching
01/06/1998US5705022 Continuous lamination of electronic structures
01/06/1998US5704795 Electrical connectors
01/06/1998US5704794 For propagation of electrical signals
01/06/1998US5704536 Automatic ball placing device
01/06/1998US5704535 Shield and method for selective wave soldering
01/06/1998US5704287 Flip up side stencil to be used with single site stencil printer
01/06/1998US5704286 Screen printing apparatus
01/06/1998US5704116 Method of holding a component using an anhydride fluxing agent
01/06/1998CA2109761C Electronic module of extra-thin construction
01/06/1998CA2083197C Use of imidazole-2-thione as complexing agent in displacement tin plating
01/06/1998CA2068657C Moisture resistant electrically conductive cements and methods for making and using same
01/02/1998DE19726571A1 Electrical connector for ribbon cable or printed circuit substrate
01/02/1998DE19725625A1 Semiconductor casing with bottom leads
01/02/1998DE19725424A1 Circuit card with flush-mounted components and for insertion in computer expansion slot
01/02/1998DE19638637A1 Mounting LED displays and other devices on printed circuit boards
01/02/1998DE19626082A1 Package for surface-mounted semiconductor device
01/02/1998DE19625934C1 Electrical conductor for coupling double-sided printed circuit conductor paths
01/02/1998DE19625756A1 Modul für ein elektrisches Gerät Module for an electrical appliance
01/02/1998DE19625386A1 Multilayer, double-sided, flexible or rigid electrical and optical circuit board production avoiding chemicals recovery
01/02/1998DE19625139A1 Solder bump production on substrate
01/01/1998CA2208292A1 Contact device for electrically connecting a printed circuit board with a liquid crystal display
12/1997
12/31/1997WO1997050281A1 Filter chip
12/31/1997WO1997050280A1 Thick-film conductor circuit and production method therefor
12/31/1997WO1997050156A1 Printed circuit board with plug-in contact points of the printed conductor type
12/31/1997WO1997050148A1 Latticework with plurality of overlying lines
12/31/1997WO1997050126A1 A c4 substrate contact pad which has a layer of ni-b plating
12/31/1997WO1997050001A1 A method of testing and fitting electronic surface-mounted components
12/31/1997WO1997049841A1 Process for the reduction of copper oxide
12/31/1997WO1997049790A1 Aqueous cleaning composition for removing flux and method of use
12/31/1997WO1997049549A1 A process for producing polytetrafluoroethylene (ptfe) dielectric boards on metal plates
12/31/1997CN1169235A Printed circuit board and heat sink arrangement
12/31/1997CN1169234A Resin filler and multi-layer printed wiring board
12/31/1997CN1169095A Antennas and their making methods and electronic devices or timepieces with same antennas
12/31/1997CN1169031A Method and device for forming convex
12/31/1997CN1036887C Ultrasonic welding and electric circuit
12/30/1997US5703762 Arrangement for connecting wiring backplanes and module circuit boards
12/30/1997US5703761 Shielding for flat modules
12/30/1997US5703752 Heat dissipating apparatus for a semiconductor device for use in a motor drive
12/30/1997US5703542 Compact temperature stabilized crystal oscillator
12/30/1997US5703341 Method for adhesion of metal films to ceramics
12/30/1997US5703331 Circuitized structure including flexible circuit with elastomeric member bonded thereto
12/30/1997US5702820 Blend of epoxy resin and unsaturated carboxylic acid
12/30/1997US5702807 Ceramic circuit board and manufacturing method thereof
12/30/1997US5702662 Process for ablating high density vias in flexible substrate
12/30/1997US5702584 Enhanced plating adhesion through the use of metallized fillers in plastic substrate
12/30/1997US5702583 Using photoresist
12/30/1997US5702255 Ball grid array socket assembly
12/30/1997US5702213 Retractable registration pin apparatus
12/30/1997US5702051 Device for moving an object by means of thermal change in shape or volume
12/30/1997US5701821 Screen cleaning apparatus and screen cleaning method
12/30/1997US5701667 Method of manufacture of an interconnect stress test coupon
12/30/1997US5701654 Precision fluid head transport
12/30/1997CA2067266C Composition containing 1,1-dichloro-1-fluoroethane, 1,1,1,3,3-pentafluorobutane and methanol for the cleaning or drying of solid surfaces
12/30/1997CA2060941C System for performing work on workpieces
12/29/1997EP0814645A1 Electric connector assembly with improved registration characteristics
12/29/1997EP0814644A1 Improved copper foil for printed circuit boards
12/29/1997EP0814643A2 Multilayer printed circuit board
12/29/1997EP0814539A2 Method and apparatus for connecting flexible circuits to printed circuit boards
12/29/1997EP0814511A2 Plastic ball grid array module
12/29/1997EP0814510A2 TAB tape and semiconductor device using the TAB tape
12/29/1997EP0814504A2 Semiconductor mounting substrate having micronized wire and method of manufacturing the same
12/29/1997EP0814382A1 Improved photoresists and method for making printing plates
12/29/1997EP0814182A1 Process for producing strip-shaped metal coated foil
12/29/1997EP0814175A2 CVD of metals using iodide precursor
12/29/1997EP0814138A2 Tape comprising solvent-containing non-tacky, free-standing, fully imidized polyimide film
12/29/1997EP0813750A1 Process for making a z-axis adhesive and establishing electrical interconnection therewith
12/29/1997EP0813618A1 Currentless metallisation process for non electroconductive substrates
12/29/1997EP0813590A1 Cleaning process and apparatus
12/29/1997EP0813521A1 Energy-activatable salts with fluorocarbon anions