| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/27/1998 | US5711806 Printed circuit board processing apparatus |
| 01/27/1998 | US5711681 Jumper connector |
| 01/27/1998 | US5711473 Inert atmosphere soldering apparatus |
| 01/22/1998 | WO1998003047A1 Film-like adhesive for connecting circuit and circuit board |
| 01/22/1998 | WO1998003046A1 Rectifier set for high voltage device |
| 01/22/1998 | WO1998002954A1 Power pad/power delivery system |
| 01/22/1998 | WO1998002935A1 Printed circuit board layering configuration for very high bandwidth interconnect |
| 01/22/1998 | WO1998002921A1 Transferred flexible integrated circuit |
| 01/22/1998 | WO1998002756A2 Method of and device for inspecting a pcb |
| 01/22/1998 | WO1998002254A1 Resist coating apparatus and coating method |
| 01/22/1998 | WO1998002252A1 Device for wet coating, in particular printed circuit boards with lacquer |
| 01/22/1998 | DE19701950A1 Electrical circuit arrangement e.g. for motor vehicle indicator units |
| 01/22/1998 | DE19649332C1 Crystal oscillator formed as surface-mounted-device (SMD) |
| 01/21/1998 | EP0820217A1 Composition and process for filling vias |
| 01/21/1998 | EP0819781A1 Apparatus for the treatment of objects, in particular galvanising apparatus for printed circuit boards |
| 01/21/1998 | EP0819747A1 Adhesive, adhesive film and adhesive-backed metal foil |
| 01/21/1998 | EP0819504A1 Apparatus for punching printed circuit boards |
| 01/21/1998 | EP0819473A1 Method and apparatus for applying a liquid coating in atomised or non-atomised form by use of a single nozzle |
| 01/21/1998 | EP0819368A1 Printed-circuit board and electronic apparatus provided with the same |
| 01/21/1998 | EP0819267A1 Coating compositions |
| 01/21/1998 | EP0819055A1 A laminate for sealing capsules |
| 01/21/1998 | CN1171167A Composite intermediate connecting element of microelectronic device and its production method |
| 01/21/1998 | CN1171081A Method and apparatus for dispensing viscous material |
| 01/21/1998 | CN1170960A Substrate for semiconductor device, method of manufacturing the same, semiconductor device, card type module, and information storage device |
| 01/21/1998 | CN1170940A Resistor and its producing method |
| 01/21/1998 | CN1037134C Integrated circuit device |
| 01/20/1998 | US5710693 Electronic device having a flat, card-like casing enclosing components for a complete computer system including a sub-printed wiring board attached to an inner surface of the casing and electrically connected to a printed wiring board by a flexible member |
| 01/20/1998 | US5710612 Liquid crystal device and manufacturing method therefor with anisotropic conductive adhesive connecting glass substrate and glass auxiliary substrate |
| 01/20/1998 | US5710459 Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability |
| 01/20/1998 | US5710063 Method for improving the alignment of holes with other elements on a printed circuit board |
| 01/20/1998 | US5710062 Plastic molded semiconductor package and method of manufacturing the same |
| 01/20/1998 | US5709979 Printed wiring board with photoimageable dielectric base substrate and method of manufacture therefor |
| 01/20/1998 | US5709957 Metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer |
| 01/20/1998 | US5709931 Release liners for production of molded products |
| 01/20/1998 | US5709928 Multilayered wiring substrate of aluminum nitride having a high dielectric layer and method of manufacture thereof |
| 01/20/1998 | US5709906 Method for conditioning halogenated polymeric materials and structures fabricated therewith |
| 01/20/1998 | US5709905 Apparatus and method for automatic monitoring and control of stencil printing |
| 01/20/1998 | US5709805 Method for producing multi-layer circuit board and resulting article of manufacture |
| 01/20/1998 | US5709576 LCD connector alignment with printed wiring board |
| 01/20/1998 | US5709554 Angled circuit connector structure |
| 01/20/1998 | US5709338 Soldering method |
| 01/20/1998 | US5709336 Method of forming a solderless electrical connection with a wirebond chip |
| 01/20/1998 | CA2089479C Process for metallizing substrates using starved-reaction metal-oxide reduction |
| 01/19/1998 | CA2209274A1 Method and apparatus for applying a liquid coating with an improved spray nozzle |
| 01/16/1998 | CA2181207A1 Polymeric stencil for use in electronic assemblies and method of making same |
| 01/15/1998 | WO1998002023A1 Method and device for the manufacturing of solder stop preferably on a printed board |
| 01/15/1998 | WO1998001906A1 Floating lateral support for ends of elongate interconnection elements |
| 01/15/1998 | DE19726869A1 Thin metal plate used as printed wiring for LSI, lead frame of IC |
| 01/15/1998 | DE19633486C1 Manufacturing method for circuit board with thin conduction paths and good solderable connection-contact regions e.g for measurement resistor or heating element |
| 01/14/1998 | EP0818947A1 Spacer for boards |
| 01/14/1998 | EP0818946A2 A printed-wiring board and a production method thereof |
| 01/14/1998 | EP0818818A1 Method of separating wafers into individual die |
| 01/14/1998 | EP0818816A1 Method of forming airbridged metallization for integrated circuit fabrication |
| 01/14/1998 | EP0818813A1 Component system for bonding and method of bonding enabling thermal dilatations |
| 01/14/1998 | EP0818812A1 Connection construction and method of manufacturing the same |
| 01/14/1998 | EP0818811A1 Method of making solder bumps |
| 01/14/1998 | EP0818563A1 Aqueous solution for forming metal complexes, tin-silver alloy plating bath, and process for producing plated object using the plating bath |
| 01/14/1998 | EP0818562A1 Composition for treating copper and copper alloy surfaces and method for the surface treatment |
| 01/14/1998 | EP0818515A1 Water-base photosensitive resin composition |
| 01/14/1998 | EP0818061A1 System and process for producing electrically conductive connecting structures and a process for producing circuits and printed circuits |
| 01/14/1998 | EP0715570A4 Multiple layer printed circuit boards and method of manufacture |
| 01/14/1998 | CN1170374A Cleaning agent, method and equipment |
| 01/14/1998 | CN1170333A 印刷电路板 A printed circuit board |
| 01/14/1998 | CN1170234A Semiconductor apparatus |
| 01/14/1998 | CN1170149A Light exposure installation of double-sided printed circuit plate through artworks |
| 01/14/1998 | CN1169915A Method for manufacturing laminates and apparatus performing the method |
| 01/13/1998 | US5708885 Light intercepting device of a lens shutter type of camera |
| 01/13/1998 | US5708570 Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures |
| 01/13/1998 | US5708569 Annular circuit components coupled with printed circuit board through-hole |
| 01/13/1998 | US5708568 Electronic module with low impedance ground connection using flexible circuits |
| 01/13/1998 | US5708566 Solder bonded electronic module |
| 01/13/1998 | US5708565 Thermal and shock resistant data recorder assembly |
| 01/13/1998 | US5708400 AC coupled termination of a printed circuit board power plane in its characteristic impedance |
| 01/13/1998 | US5708298 Semiconductor memory module having double-sided stacked memory chip layout |
| 01/13/1998 | US5708252 Excimer laser scanning system |
| 01/13/1998 | US5708110 Pressure sensitive adhesives with good low energy surface adhesion |
| 01/13/1998 | US5708109 Pressure sensitive adhesives with good oily surface adhesion |
| 01/13/1998 | US5708056 Hot melt epoxy encapsulation material |
| 01/13/1998 | US5707893 Method of making a circuitized substrate using two different metallization processes |
| 01/13/1998 | US5707749 Polyimide, bisphenol ether bismaleimide adhesive |
| 01/13/1998 | US5707729 Adhesive for copper foils and adhesive-backed copper foil |
| 01/13/1998 | US5707715 Metal ceramic composites with improved interfacial properties and methods to make such composites |
| 01/13/1998 | US5707714 Printed circuit board for flow soldering |
| 01/13/1998 | US5707575 Method for filling vias in ceramic substrates with composite metallic paste |
| 01/13/1998 | US5707249 Device holder attaching to a printed circuit board |
| 01/13/1998 | US5707241 Slide locking connector |
| 01/13/1998 | US5706995 Apparatus for the treatment of cloth strip with metal-surface rollers |
| 01/13/1998 | US5706568 Automated chamfering apparatus and method |
| 01/08/1998 | WO1998001013A2 Method and circuit board panel for preventing assembly-line delamination and sagging for circuit board manufacturing |
| 01/08/1998 | WO1998000886A1 Method and device for connecting electrical components having wire leads |
| 01/08/1998 | WO1998000884A1 Button and dovetail connector actuation mechanism |
| 01/08/1998 | WO1998000865A1 Module for an electrical device |
| 01/08/1998 | WO1998000864A1 Component housing for surface mounting a semiconductor component |
| 01/08/1998 | WO1998000759A1 Photopolymerizable thermosetting resin composition |
| 01/08/1998 | WO1998000293A1 Superficial coating layer for electrical conductors |
| 01/08/1998 | WO1997034247A3 Smart card, connection arrangement and method of producing a smart card |
| 01/08/1998 | DE19635039C1 Continuous recovery of copper@ from used circuit boards |
| 01/08/1998 | DE19627364A1 Correction values determination method for hole positions on multilayer printed circuit boards |
| 01/08/1998 | DE19626522A1 Electronic module with circuit board |
| 01/08/1998 | CA2258517A1 Button and dovetail connector actuation mechanism |