Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/1998
02/10/1998US5716713 Insulated metallized substrate; thermoconductivity
02/10/1998US5716663 Multilayer printed circuit
02/10/1998US5716502 Electrolytic cell, useful for eletroplating of metals, such as copper
02/10/1998US5716481 Applying ceramic paste to surface, printing electrodes
02/10/1998US5716458 Method of washing and drying an article
02/10/1998US5716457 Cleaning with solvating and rinsing agents
02/10/1998US5716310 For a machine tool
02/10/1998US5716222 Ball grid array including modified hard ball contacts and apparatus for attaching hard ball contacts to a ball grid array
02/10/1998US5716218 Process for manufacturing an interconnect for testing a semiconductor die
02/10/1998US5716168 Method of drilling holes in printed circuit boards with backup board material
02/10/1998US5715595 Method of forming a pinned module
02/10/1998US5715594 Method of making removable computer peripheral cards having a solid one-piece housing
02/10/1998CA2119325C Molded plastic packaging of electronic devices
02/05/1998WO1998005068A1 Method of manufacturing and transferring metallic droplets
02/05/1998WO1998004927A1 Loaded board drop pin fixture
02/05/1998WO1998004407A1 Manufacture of laminated film and printed wiring board
02/05/1998DE19732755A1 Multilayered circuit production
02/05/1998DE19732419A1 Etching agent used in production of circuit boards
02/05/1998DE19707905C1 Bipolar pulsed current supply method for electroplating
02/05/1998DE19630794A1 Temperature measuring system with temperature dependent measuring element as semiconductor resistor
02/05/1998DE19630676A1 Reflow soldering
02/05/1998DE19630593A1 Compact, direct mechanical- and electrical bonding of microcircuit to substrate
02/05/1998DE19621545C1 Production of circuit board
02/04/1998EP0822740A2 Automatic mounting or connecting recognition apparatus
02/04/1998EP0822738A2 Column array connections
02/04/1998EP0822737A2 Unit type clip lead terminal, connecting method, connecting board and method of producing such board
02/04/1998EP0822624A1 Retention clip for fastening at least two flat members together
02/04/1998EP0822595A2 Hybrid module
02/04/1998EP0822448A1 Flexible, flame-retardant, photoimageable composition for coating printed circuits
02/04/1998EP0822447A1 Photopolymerizable composition
02/04/1998EP0822229A1 Polyimide resin composition
02/04/1998EP0822097A1 Overcoat for thermally imaged sheets
02/04/1998EP0822096A1 Laser dye or pigment removal imaging process
02/04/1998EP0822082A2 Ink-jet recording head, process for producing the head and ink-jet recording apparatus employing the head
02/04/1998EP0821725A1 Cold cleaning composition based on alkanes or cycloalkanes and an organic compound comprising a ketone group
02/04/1998EP0821724A1 Cycloalkane-based cleaning agent
02/04/1998EP0761027B1 Surface mount electrical connector with improved grounding element
02/04/1998CN1172414A Printed-wiring board and production method thereof
02/04/1998CN1172292A Module structure and electronic device
02/03/1998US5715144 Multi-layer, multi-chip pyramid and circuit board structure
02/03/1998US5715140 Overlay substrate for securing electronic devices in a vehicle
02/03/1998US5714803 Low-profile removable ball-grid-array integrated circuit package
02/03/1998US5714794 Electrostatic protective device
02/03/1998US5714789 Circuit board-mounted IC package cooling apparatus
02/03/1998US5714718 Laminate wiring board
02/03/1998US5714559 Copolymer of hydroxystyrene and hydroxyvinyl cylcohexane derivatives wherein a portion of hydroxy group are protected; used as posotive resists
02/03/1998US5714238 Conductive adhesive and circuit using the same
02/03/1998US5714079 Method for making a thin gauge metallic article with electrical insulation on one side
02/03/1998US5714050 Electroplating mold surface, pressing the mold against a borad made of a thermoplastic resin, heating and pressing, bonding circuit body to inner surface of casing, releasing male mold from female mold after cooling
02/03/1998US5714013 Mixing rare earth compounds and metallic fluorides with solder and flux
02/03/1998US5713997 Solution for selectively imparting tackiness to a metallic surface
02/03/1998US5713986 Resist material for deletion of coatings
02/03/1998US5713762 Selectively metallized plastic hold-down connector
02/03/1998US5713563 Wire bonding to flexible substrates
02/03/1998US5713508 Stabilization of conductive adhesive by metallurgical bonding
02/03/1998US5713474 Innerlayer surface treating rack
02/03/1998US5713276 Flexible self-level squeegee blade
02/03/1998US5713127 Non-annular lands
02/03/1998US5713126 Method of mounting electronic connector on an end of printed circuit board
02/03/1998CA2083072C Method for manufacturing polyimide multilayer wiring substrate
02/03/1998CA2067267C Composition containing 1,1,1,3,3-pentafluorobutane and methanol for the cleaning or drying of solid surfaces
02/03/1998CA2061119C Method of depositing conductors in high aspect ratio apertures
01/1998
01/29/1998WO1998004107A1 Z-axis interconnect method and circuit
01/29/1998WO1998004106A1 Method for making printed circuits and resulting printed circuit
01/29/1998WO1998004105A1 Method for making printed circuits and resulting printed circuit
01/29/1998WO1998004000A1 Plug-in type electronic control unit, connecting structure between wiring board and plug member, connecting unit between electronic parts and wiring board, and electronic parts mounting method
01/29/1998WO1998003937A1 Method and device for producing an electronic component, in particular for producing an induction coil for chip cards
01/29/1998WO1998003896A1 Electronically addressable microencapsulated ink and display thereof
01/29/1998WO1998003299A1 A flux formulation
01/29/1998DE19730323A1 Electrical connectors for motor vehicle door-mounted equipment
01/29/1998DE19726850A1 Moulded circuit board preparation
01/29/1998DE19637358C1 Method of manufacturing single-side structured circuit boards from GFR composite prepreg
01/29/1998DE19630134A1 Soldering or housing electronic or hybrid assembly
01/29/1998DE19629269A1 Vorrichtung und Verfahren zur Herstellung eines elektronischen Bauteils, insbesondere zur Herstellung einer Induktionsspule für Chipkarten Apparatus and method for manufacturing an electronic component, in particular for the production of an inductor for chip cards
01/29/1998CA2553137A1 Electronically addressable microencapsulated ink and display thereof
01/29/1998CA2260947A1 Electronically addressable microencapsulated ink and display thereof
01/29/1998CA2211535A1 Automatic mounting or connecting recognition apparatus
01/28/1998EP0821447A2 A connector for a circuit board
01/28/1998EP0821408A2 A structure of mounting a semiconductor element onto a substrate and a mounting method thereof
01/28/1998EP0820968A1 Dielectric ceramic composition
01/28/1998EP0820491A1 Melt-flowable materials and method of sealing surfaces
01/28/1998EP0820359A1 Method and apparatus for circuit board treatment
01/28/1998EP0820351A1 Fluid delivery apparatus and method
01/28/1998EP0645074B1 Method of making a printed circuit board
01/28/1998CN1171718A Multi-layered interconnection board capable of reducing cross-talk noise
01/28/1998CN1171602A Composition and process for filling vias
01/28/1998CN1171457A Liquid and method to clean metal masks for surface mounting technology
01/28/1998CN1037227C Wave soldering equipment with protective atmosphere and it soldering method
01/28/1998CN1037212C Photosensitive aqueous developable ceramic coating composition
01/28/1998CN1037201C 多元溶剂清洗系统 Multiple solvent cleaning system
01/27/1998US5712768 Space-saving assemblies for connecting integrated circuits to circuit boards
01/27/1998US5712767 Circuit elements mounting
01/27/1998US5712765 Housing for printed circuit board
01/27/1998US5712321 Amine curable polyether-ene polymers
01/27/1998US5712192 Process for connecting an electrical device to a circuit substrate
01/27/1998US5712080 Novel acrylic photosensitive resin and benzotriazole or benzothiazole adhesion promoter
01/27/1998US5712079 Aqueous latex dispersion of polycyanoacrylate copolymer
01/27/1998US5712047 Copper foil for printed wiring board
01/27/1998US5711989 Computer controlled method for dispensing viscous fluid
01/27/1998US5711838 Method of and device for continuously or discontinuously manufacturing flat sheets of multiple-layer materials, laminates or similar articles