Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/2000
04/12/2000EP0992559A1 Flame retardant adhesive composition
04/12/2000EP0992086A1 Display mounting assembly
04/12/2000EP0992065A1 Film used as a substrate for integrated circuits
04/12/2000EP0991682A1 A curable, water-borne one-component coating system using thermally labile hydrophilic groups
04/12/2000EP0975464A4 Silicon nitride coating compositions
04/12/2000EP0901695A4 Connectors for microelectronic elements
04/12/2000EP0749594B1 Stable, ionomeric photoresist emulsion and process of preparation and use thereof
04/12/2000EP0660762B1 Oil based composition clean up method and composition for use therein
04/12/2000EP0646290B1 Face-mount connector
04/12/2000CN1250588A Method for forming metal conductor models on electrically insulating supports
04/12/2000CN1051435C Method and apparatus for aligning and attaching a surface mount component
04/12/2000CN1051434C Jig for detecting warp of printed circuit board
04/12/2000CN1051409C Pinned module
04/12/2000CN1051386C Hot pluggable motherboard bus connector method
04/12/2000CN1051309C Fluoro taxols
04/12/2000CN1051280C Process for the production of plastic laminates with metal laminae, especially for printed circuits using double-band laminae
04/11/2000US6049656 Method of mounting an integrated circuit on a printed circuit board
04/11/2000US6049466 Substrate with embedded member for improving solder joint strength
04/11/2000US6049464 Electronic modules manufacturing
04/11/2000US6049262 Surface mountable transmission line device
04/11/2000US6049214 Universal printed circuit board inspection apparatus, and method of using same
04/11/2000US6049163 Discharge lamp unit with RF shield primary coil
04/11/2000US6049147 Motor, structure of stator of the motor and assembly method of the stator
04/11/2000US6049125 Semiconductor package with heat sink and method of fabrication
04/11/2000US6049122 Flip chip mounting substrate with resin filled between substrate and semiconductor chip
04/11/2000US6049121 Tape carrier package and liquid crystal display device including such tape carrier package
04/11/2000US6049055 Method of producing a smart card
04/11/2000US6049043 Printed circuit board
04/11/2000US6049041 Flexible metal-clad dielectric including a beryllium-copper alloy foil, with an enriched electrical conductivity and a mean grain size of 20 mu.m or lesss, which is laminated with highly flexible resin film; improved bending
04/11/2000US6049039 Terminal and a method of forming the same
04/11/2000US6048744 Integrated circuit package alignment feature
04/11/2000US6048741 Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
04/11/2000US6048667 Free radicals or cation polymerizable or photocrosslinkable monomers, substrates and photoinitiators, bonding with substrates
04/11/2000US6048666 Radiation sensitive resin composition
04/11/2000US6048629 Substrate having copper pads and electrodeposited highwettability tin-bismuth solderalloy; printed circuits
04/11/2000US6048584 Apparatus and method for coating multilayer article
04/11/2000US6048465 Circuit board and fabrication method thereof
04/11/2000US6048445 Metal seed layer is then deposited over a photoresist layer utilizing a directional deposition technique. a portion of the metal seed layer is then removed. a metal plating is then formed on the metal seed layer
04/11/2000US6048430 Component of printed circuit boards
04/11/2000US6048424 Method for manufacturing ceramic laminated substrate
04/11/2000US6048420 Method for surface mounting electrical components to a substrate
04/11/2000US6048095 External connection mechanism of temperature-measuring type for printed circuit board
04/11/2000US6048082 Direct-mounting electric lamp unit
04/11/2000US6047875 Reflow soldering self-aligning fixture
04/11/2000US6047637 Method of paste printing using stencil and masking layer
04/11/2000US6047470 Singulation methods
04/11/2000US6047469 Method of connecting a unit under test in a wireless test fixture
04/11/2000US6047463 Embedded trimmable resistors
04/06/2000WO2000019791A1 Device for protecting an electric circuit against interface microdischarge phenomena
04/06/2000WO2000019789A1 Printed wiring board and method for producing the same
04/06/2000WO2000019788A1 Connector device for an unwired electronic component with an overlying and underlying electrode
04/06/2000WO2000019567A1 Rf interface
04/06/2000WO2000019533A1 Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame
04/06/2000WO2000019532A1 Package for providing improved electrical contact and methods for forming the same
04/06/2000WO2000019513A1 Method for moulding a flat electronics module onto the body of a plastic card by means of thermoplastic injection moulding
04/06/2000WO2000018536A1 Soldering material and electric/electronic device using the same
04/06/2000WO2000018534A1 Device for treating printed circuit boards
04/06/2000WO1999060189A3 Method for metal coating of substrates
04/06/2000DE19943401A1 Manufacturing method for laminated transmission line, forming structure on laminated substrate using laser etching
04/05/2000EP0991306A1 Film for flexible printed wiring board
04/05/2000EP0991141A2 Surface-mount connector
04/05/2000EP0991028A2 Electronic verification machine for documents
04/05/2000EP0991014A2 Conductive paste and method of forming antenna for transponder
04/05/2000EP0990949A1 Negative photoresist composition
04/05/2000EP0990686A2 Adhesive film for semiconductor package
04/05/2000EP0990673A2 Polybenzoxazole resin and precursor thereof
04/05/2000EP0989914A1 Multilayer metalized composite on polymer film product and process
04/05/2000EP0989899A1 Method and device for supplying several working gases, and its application to an installation for assembling electronic components
04/05/2000EP0877709A4 Soft pack package and dispensing system for liquid photoimageable solder mask
04/05/2000EP0876691B1 Solder element
04/05/2000EP0722512B1 Copper etchant solution additives
04/05/2000EP0703863B1 Method of producing patterns on objects, especially ceramic articles
04/05/2000CN1249898A Transport apparatus for thin, board-shaped substrates
04/05/2000CN1249537A Miltilayer wiring structure and producing method thereof
04/05/2000CN1051200C Electronic component mounting apparatus
04/05/2000CN1051199C Printed circuit board with internal capacitor
04/05/2000CN1051198C Resistive metal layers and method for making same
04/05/2000CN1051197C Method for mfg. circuit board, and made circuit board
04/05/2000CN1051169C Method for enhancement of polyimide adhesion to reactive metal
04/04/2000US6046911 Dual substrate package assembly having dielectric member engaging contacts at only three locations
04/04/2000US6046910 Microelectronic assembly having slidable contacts and method for manufacturing the assembly
04/04/2000US6046909 Computer card with a printed circuit board with vias providing strength to the printed circuit board
04/04/2000US6046902 Ceramic electronic part having u-shape terminals
04/04/2000US6046901 Support structure, electronic assembly
04/04/2000US6046886 Flex circuit head interconnect with insulating spacer
04/04/2000US6046882 Solder balltape and method for making electrical connection between a head transducer and an electrical lead
04/04/2000US6046598 Test board and a test method using the same providing improved electrical connection
04/04/2000US6046503 Metalization system having an enhanced thermal conductivity
04/04/2000US6046501 RF-driven semiconductor device
04/04/2000US6046500 Method of controlling the spread of an adhesive on a circuitized organic substrate
04/04/2000US6046429 Laser repair process for printed wiring boards
04/04/2000US6046410 Interface structures for electronic devices
04/04/2000US6046409 Multilayer microelectronic circuit
04/04/2000US6046071 Plastic molded semiconductor package and method of manufacturing the same
04/04/2000US6045979 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material
04/04/2000US6045975 Photosensitive, heat-resistant resin composition for forming patterns
04/04/2000US6045972 Coating method using aqueous photopolymerizable compositions
04/04/2000US6045893 Multilayered electronic part with minimum silver diffusion
04/04/2000US6045874 Fluid delivery method
04/04/2000US6045866 Method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof