| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/22/2000 | WO2000036887A1 Electronic control device |
| 06/22/2000 | WO2000036886A1 Conductive connecting pin and package board |
| 06/22/2000 | WO2000036731A1 Electric drive unit for units of a motor vehicle |
| 06/22/2000 | WO2000036646A1 Mounting adapter for ball grid array packages, mounting structure for ball grid array packages utilizing the same, and method of repairing ball grid array package |
| 06/22/2000 | WO2000036559A1 Chip card with soldered chip module and method of its manufacturing |
| 06/22/2000 | WO2000036557A1 Chip card with a shaped lead frame module and mehtod of its manufacturing |
| 06/22/2000 | WO2000036188A2 Method for producing a self-supporting metal film |
| 06/22/2000 | CA2353994A1 Improved methods for wire-scribing filament circuit patterns with planar and non-planar portions; improved wire-scribed boards, interconnection cards, and smart cards made by these methods |
| 06/22/2000 | CA2353965A1 Method for producing a self-supporting metal film |
| 06/21/2000 | EP1011299A2 Coatings for improved resin dust resistance |
| 06/21/2000 | EP1011298A1 Substrate for formation of special pattern, and method of manufacture of substrate |
| 06/21/2000 | EP1011139A1 Printed wiring board and method for manufacturing the same |
| 06/21/2000 | EP1011118A1 Electronic component |
| 06/21/2000 | EP1011117A2 Monolithic ceramic capacitor |
| 06/21/2000 | EP1011111A1 Resistive metal layers and method for making same |
| 06/21/2000 | EP1010523A1 Screen printing machine |
| 06/21/2000 | EP1010228A4 A transient voltage protection device and method of making same |
| 06/21/2000 | EP1010228A1 A transient voltage protection device and method of making same |
| 06/21/2000 | EP1010108A1 Method and apparatus for channel-routing of an electronic device |
| 06/21/2000 | EP1010037A1 Applications for encapsulated electrophoretic displays |
| 06/21/2000 | EP1010035A1 Novel addressing schemes for electrophoretic displays |
| 06/21/2000 | EP0896706B1 Resonant tag and method of manufacturing the same |
| 06/21/2000 | EP0755618B1 Sealed electronic packaging for environmental protection of active electronics |
| 06/21/2000 | DE19961999A1 Method to arrange low-impedance resistor on circuit plate, for use in electric vehicle; involves calculating required resistance per square centimeter to determine required area of thin film microresistor |
| 06/21/2000 | DE19856083A1 Electrical connection arrangement for data communications equipment e.g. between contact pads especially of electro=optical module and terminals of circuit board |
| 06/21/2000 | DE19855023A1 Applying conductor track on any shape surface used in computer and entertainment fields, involves using pressure tool to apply conductor track at points where direction change is implemented |
| 06/21/2000 | CN1257607A Method for making a patterned array of solder bumps |
| 06/21/2000 | CN1257599A Electronic module for chip card |
| 06/21/2000 | CN1257402A Vacuum laminating method for adhering film |
| 06/21/2000 | CN1257224A Optical imaging compositions with improved flexibility and stripping ability |
| 06/21/2000 | CN1257223A Optical imaging compositions with improved stripping ability and resolution |
| 06/21/2000 | CN1256985A Method and apparatus for working ceramic printed-circuit board |
| 06/21/2000 | CN1256974A Paint for improving resin stive property |
| 06/21/2000 | CN1053785C Circuit elements and manufacture of same |
| 06/20/2000 | US6078748 Lens-fitted film unit |
| 06/20/2000 | US6078505 Circuit board assembly method |
| 06/20/2000 | US6078500 Pluggable chip scale package |
| 06/20/2000 | US6078137 Display device having angled connector |
| 06/20/2000 | US6078102 Semiconductor die package for mounting in horizontal and upright configurations |
| 06/20/2000 | US6078101 High-power microwave-frequency hybrid integrated circuit |
| 06/20/2000 | US6078097 Lead frame |
| 06/20/2000 | US6078013 Clover-leaf solder mask opening |
| 06/20/2000 | US6077766 Variable thickness pads on a substrate surface |
| 06/20/2000 | US6077728 Method of producing a ceramic package main body |
| 06/20/2000 | US6077725 High density contact pads on silicon substrate |
| 06/20/2000 | US6077724 Multi-chips semiconductor package and fabrication method |
| 06/20/2000 | US6077623 Electrode; electroconductive metal and polymer laminate |
| 06/20/2000 | US6077477 Solder alloy of electrode for joining electronic parts and soldering method |
| 06/20/2000 | US6077405 Method and apparatus for making electrical contact to a substrate during electroplating |
| 06/20/2000 | US6077382 Mounting method of semiconductor chip |
| 06/20/2000 | US6077380 Method of forming an adhesive connection |
| 06/20/2000 | US6077359 With high precision and velocity by means of a treatment liquid |
| 06/20/2000 | US6077124 Electrical connectors for flat flexible circuitry with yieldable backing structure |
| 06/20/2000 | US6077094 Plug connector means with gripper rib |
| 06/20/2000 | US6077093 Cover for an edge mounted printed circuit board connector |
| 06/20/2000 | US6077091 Surface mounted package adapter using elastomeric conductors |
| 06/20/2000 | US6076726 Pad-on-via assembly technique |
| 06/20/2000 | US6076723 Metal jet deposition system |
| 06/20/2000 | US6076257 System for making a printed circuit board |
| 06/20/2000 | CA2158785C Electronic thick film component multiple terminal and method of making the same |
| 06/20/2000 | CA2069933C Etching solution containing a vanadium catalyst |
| 06/15/2000 | WO2000035262A2 Method for mounting an electronic component |
| 06/15/2000 | WO2000035260A1 Method of manufacturing ceramic substrate |
| 06/15/2000 | WO2000035259A2 Method for producing printed conductor structures |
| 06/15/2000 | WO2000035258A1 Multilayered switching plate |
| 06/15/2000 | WO2000035257A1 Contact node |
| 06/15/2000 | WO2000035009A1 Substrate for ic crystals |
| 06/15/2000 | WO2000035008A1 Monocrystalline ic module |
| 06/15/2000 | WO2000034961A1 Method for forming transparent conductive film by using chemically amplified resist |
| 06/15/2000 | WO2000034830A1 Photocurable anisotropically conductive composition and anisotropically conductive pattern formed by using the same |
| 06/15/2000 | WO2000034351A1 Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates |
| 06/15/2000 | DE19956970A1 Arrangement for wiring circuits on a panel e.g. of vehicle body, has circuit board separate from panel, conductors laid in desired wiring pattern to form circuits, and chamber in panel for circuit board |
| 06/15/2000 | DE19951721A1 Very fine circuit production on polymer involves structurization by erosion with short wavelength electromagnetic radiation using metal coat penetrated by photons and erosion by plasma formed at interface with polymer |
| 06/15/2000 | DE19857157A1 Verfahren zur Herstellung einer selbsttragenden Metallfolie A process for producing a self-supporting metal foil |
| 06/15/2000 | DE19851532A1 Fuseholder for mounting on PCB, includes injection-molded base for dimensional stability and strength assisting automatic mounting and soldering, with holders and mounting pins projecting on each side |
| 06/14/2000 | EP1009206A2 Method of vacuum-laminating adhesive film |
| 06/14/2000 | EP1009205A1 Single-sided circuit board and method for manufacturing the same |
| 06/14/2000 | EP1009204A1 Multilayer printed wiring board and method for manufacturing the same |
| 06/14/2000 | EP1009203A2 Methods for manufacture of electronic devices |
| 06/14/2000 | EP1009202A1 Soldering member for printed wiring boards |
| 06/14/2000 | EP1009201A2 Flexible printed substrate having a conductive pattern formed thereon |
| 06/14/2000 | EP1009200A1 Circuit member and circuit board |
| 06/14/2000 | EP1009028A2 Matrix type display apparatus, method of production thereof, and thermocompression bonding head |
| 06/14/2000 | EP1008912A1 Photoimageable compositions having improved chemical resistance and stripping ability |
| 06/14/2000 | EP1008911A1 Photoimageable compositions having improved flexibility and stripping ability |
| 06/14/2000 | EP1008910A1 Photoimageable compositions having improved stripping ability and resolution |
| 06/14/2000 | EP1008909A1 Composition for a photosensitive silver conductor tape and tape comprising the same |
| 06/14/2000 | EP1008675A1 Copper pretreatment for tin solder alloy deposition |
| 06/14/2000 | EP1008668A1 Method and apparatus for manufacturing thin film, thin-film laminate, and electronic parts |
| 06/14/2000 | EP1008636A2 Bonding process |
| 06/14/2000 | EP1008414A2 Solder ball connections and assembly process |
| 06/14/2000 | EP1008395A2 Method for separating metallic material from waste printed circuit boards, and dry distilation apparatus used for waste treatment |
| 06/14/2000 | EP1008231A2 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same |
| 06/14/2000 | EP1008156A1 Monolithic inductor and method of manufacturing same |
| 06/14/2000 | EP1008143A4 Multilayer thick film surge resistor network |
| 06/14/2000 | EP1008143A1 Multilayer thick film surge resistor network |
| 06/14/2000 | EP1007980A1 Printed circuit board testing device |
| 06/14/2000 | EP1007766A2 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated |
| 06/14/2000 | EP1007596A1 Printable adhesive composition and methods of preparation |
| 06/14/2000 | EP1007349A4 Patterned conducting polymer surfaces and process for preparing the same and devices containing the same |