| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/16/2000 | CN1244950A Product having a rechargeable battery which is held in a mechanically stable manner and is easy to remove |
| 02/16/2000 | CN1244935A 芯片卡模块 Chip Card Module |
| 02/16/2000 | CN1244897A Lead-free tin alloy |
| 02/16/2000 | CN1244832A Injection molding encapsulation for an electronic device directly onto a substrate |
| 02/16/2000 | CN1244729A Method and apparatus for isolating wet sensitive plastic ball grid array device |
| 02/16/2000 | CN1244460A Composite foil of aluminium and copper |
| 02/15/2000 | US6026221 Prototyping multichip module |
| 02/15/2000 | US6025998 Method for manufacturing electronic parts and electronic parts using the method |
| 02/15/2000 | US6025988 Interconnect adapter and head suspension assembly |
| 02/15/2000 | US6025729 Floating spring probe wireless test fixture |
| 02/15/2000 | US6025649 Pb-In-Sn tall C-4 for fatigue enhancement |
| 02/15/2000 | US6025644 Liquid crystal display and apparatus using the same |
| 02/15/2000 | US6025609 Laser synthesized ceramic electronic devices and circuits and method for making |
| 02/15/2000 | US6025258 Method for fabricating solder bumps by forming solder balls with a solder ball forming member |
| 02/15/2000 | US6025110 Irradiating transfer carrier to cause ablative ejection of transfer material onto receiver surface according to pattern; building up object in successive layers |
| 02/15/2000 | US6025057 Organic substrate, photoimaging device, polyelectrolyte and palladium-tin seed and conductive circuits |
| 02/15/2000 | US6024857 Electroplating additive for filling sub-micron features |
| 02/15/2000 | US6024589 Power bus bar for providing a low impedance connection between a first and second printed circuit board |
| 02/15/2000 | US6024584 High density connector |
| 02/15/2000 | US6024580 High performance pad on pad connector for flex circuit packaging |
| 02/15/2000 | US6024466 Electronic parts holder |
| 02/15/2000 | US6024275 Method of making flip chip and BGA interconnections |
| 02/15/2000 | US6024266 System and method for transporting and clamping flexible film structures |
| 02/15/2000 | US6024176 Omega-hydrofluoroalkyl ethers, precursor carboxylic acids and derivatives thereof, and their preparation and application |
| 02/15/2000 | US6023842 Process for the manufacture of printed circuit boards |
| 02/15/2000 | US6023841 Printed circuit board fixing and mounting procedure for power devices |
| 02/15/2000 | CA2147398C Solder medium for circuit interconnection |
| 02/10/2000 | WO2000007421A1 A method for controlling stress in thin film layers deposited over a high density interconnect common circuit base |
| 02/10/2000 | WO2000007419A1 Production method for flexible substrate |
| 02/10/2000 | WO2000007418A1 Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor |
| 02/10/2000 | WO2000007417A1 Low-impedance high-density deposited-on-laminate structures having reduced stress |
| 02/10/2000 | WO2000007267A1 Insulated conductive through-feature in conductive core materials |
| 02/10/2000 | WO2000007239A1 Integrated component, composite body consisting of an integrated component and a conductive structure, chip card and method for producing the integrated component |
| 02/10/2000 | WO2000007235A1 Semiconductor device, method of manufacture thereof, semiconductor module, and electronic device including circuit board and electronic unit board |
| 02/10/2000 | WO2000007233A1 An improved method of planarizing thin film layers deposited over a common circuit base |
| 02/10/2000 | WO2000007222A2 Method for forming low-impedance high-density deposited-on-laminate structures having reduced stress |
| 02/10/2000 | WO2000007219A2 High density printed circuit substrate and method of fabrication |
| 02/10/2000 | WO2000007197A2 Composition and method for manufacturing integral resistors in printed circuit boards |
| 02/10/2000 | WO2000007070A1 Diazo-containing photosensitive material |
| 02/10/2000 | WO2000006661A1 Adhesive compositions and their precursors |
| 02/10/2000 | WO2000006333A1 Method for brazing by solder reflow electronic components and brazing device therefor |
| 02/10/2000 | WO2000005938A2 Laser imaging of printed circuit patterns without using phototools |
| 02/10/2000 | DE19936305A1 Component holder for inserting component without connector wires into hole in circuit board where component presses against edge of hole |
| 02/10/2000 | DE19924934A1 Surface mountable electronic package for high frequency digital applications |
| 02/10/2000 | DE19835332A1 Installation for treating articles, in particular, for galvanizing circuit boards comprises additional current supply to the articles undergoing treatment by means of at least one additional contact |
| 02/10/2000 | DE19835158A1 Verfahren zur Erzeugung von Leiterplatten A process for the production of printed circuit boards |
| 02/10/2000 | DE19835127A1 Leiterplatte mit einem Heatsink und Verfahren zum Anbringen eines Heatsink Printed circuit board with a heat sink and method for attaching a heatsink |
| 02/10/2000 | DE19822536A1 Soldering of electronic components to circuit boards involves withdrawal of surplus solder after the components to be joined have been wetted by solder |
| 02/10/2000 | CA2338181A1 Method for brazing by solder reflow electronic components using pre-deposits of solder alloy and brazing device therefor |
| 02/10/2000 | CA2338157A1 Method for brazing by solder reflow electronic components and brazing device therefor |
| 02/10/2000 | CA2337186A1 Composition and method for manufacturing integral resistors in printed circuit boards |
| 02/09/2000 | EP0979029A2 Process for manufacturing printed circuit boards |
| 02/09/2000 | EP0979028A1 Device for dosing a very viscous liquid |
| 02/09/2000 | EP0978765A2 Positioning mark and alignment method using the same |
| 02/09/2000 | EP0978577A1 Process and apparatus for the electrochemical machining of workpieces |
| 02/09/2000 | EP0978528A1 Rubber for hot press cushioning pad, manufacturing method thereof, hot press cushioning pad and method of manufacturing printed circuit board |
| 02/09/2000 | EP0978333A2 Punch holder apparatus |
| 02/09/2000 | EP0978225A1 Apparatus for the coating of flat-form substrates, especially of printed circuit boards |
| 02/09/2000 | EP0978224A2 Device for electrolytic treatment of plate-shaped articles and method for electronic shielding of edge areas of articles during electrolytic treatment |
| 02/09/2000 | EP0978153A1 Multi-layered shielded substrate antenna |
| 02/09/2000 | EP0977900A1 Lead-free solder |
| 02/09/2000 | EP0977635A1 Multi-rail board transport system |
| 02/09/2000 | EP0788728B1 Process for coating electrically non-conducting surfaces with connected metal structures |
| 02/09/2000 | EP0680523B1 Preparation of alumina ceramic surfaces for electroless and electrochemical metal deposition |
| 02/08/2000 | US6023663 Method and apparatus for inspecting a solder joint using a correlation neural network |
| 02/08/2000 | US6023408 Floating plate capacitor with extremely wide band low impedance |
| 02/08/2000 | US6023376 Lens barrel having a linear guide mechanism |
| 02/08/2000 | US6023217 Resistor and its manufacturing method |
| 02/08/2000 | US6023211 Transmission circuit using strip line in three dimensions |
| 02/08/2000 | US6023041 Method for using photoabsorptive coatings and consumable copper to control exit via redeposit as well as diameter variance |
| 02/08/2000 | US6022761 Method for coupling substrates and structure |
| 02/08/2000 | US6022670 Hydrophobic photoimagable dielectric filmn in solvent;metallization |
| 02/08/2000 | US6022611 Dielectric sustrate with copper foil overcoating |
| 02/08/2000 | US6022596 Method for photoselective seeding and metallization of three-dimensional materials |
| 02/08/2000 | US6022466 Internally connecting first and second copper features; depositng etch-resist; masking second copper features and exposing region of first copper features; etching copper; removing etch-resist; plating gold on copper |
| 02/08/2000 | US6022225 Electrical assembly |
| 02/08/2000 | US6021940 Method and apparatus for reflow soldering metallic surfaces |
| 02/08/2000 | US6021833 Manufacturing line for multi-layered printed circuit boards |
| 02/08/2000 | US6021790 Substrate treating apparatus and method for treating substrate |
| 02/03/2000 | WO2000005936A1 Hybrid solder ball and pin grid array circuit board interconnect system and method |
| 02/03/2000 | WO2000005934A1 Clad board for printed-circuit board, multilayered printed-circuit board, and method of manufacture thereof |
| 02/03/2000 | WO2000005933A1 Printed-circuit board and method of manufacture thereof |
| 02/03/2000 | WO2000005932A1 Radio-electronic unit |
| 02/03/2000 | WO2000005765A1 Method for producing rewiring substrates for semiconductor chip packages |
| 02/03/2000 | WO2000005748A2 Blind pin placement on circuit boards |
| 02/03/2000 | WO2000005071A1 Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
| 02/03/2000 | DE19834436A1 Edge connections manufacturing method esp. for circuit boards of mobile radio communication terminals |
| 02/03/2000 | DE19834348A1 Electronic control unit and individual components of the unit |
| 02/03/2000 | DE19833683A1 Selective deposition, e.g. for conductive polymer coating or micro-manipulation, comprises selectively irradiating substrate with light-dependent electrical properties in solution of substance which precipitates in an electric field |
| 02/03/2000 | DE19832249A1 Chemical nickel plating method for electrical circuit board manufacture has galvanically deposited nickel layer deoxidized and activated prior to chemical nickel plating |
| 02/03/2000 | DE19832011A1 Flat ribbon cable e.g. for connection to printed circuit board, has springs in insulating housing fitted to cable termination region used to press contact regions of respective conductor paths against corresponding counter-contacts |
| 02/03/2000 | DE19823104C1 Recovering copper foil from scrapped printed circuit boards using molten tin bath in treating furnace |
| 02/02/2000 | EP0977471A1 Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material |
| 02/02/2000 | EP0977259A2 Semiconductor device and method of producing the same |
| 02/02/2000 | EP0976848A1 Metal composition containing metal acetilide, blank having metallic coating formed therewith, and method for forming the metallic coating |
| 02/02/2000 | EP0976489A1 Solder material |
| 02/02/2000 | EP0976309A1 Case for circuit boards |
| 02/02/2000 | EP0976308A1 Fabrication of high density multilayer interconnect printed circuit boards |
| 02/02/2000 | EP0976307A1 Positive working photodefinable resin coated metal for mass production of microvias in multilayer printed wiring boards |
| 02/02/2000 | EP0976155A1 High-voltage, high-current multilayer circuit board, method for the production thereof |