Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2000
03/14/2000US6036809 Laser ablation of interface or cutting to remove film containing dielectrics and metal connectors from carrier for use in microelectronics, semiconductors
03/14/2000US6036798 Process for producing electronic part with laminated substrates
03/14/2000US6036777 Powder dispensing apparatus using vibration
03/14/2000US6036758 Surface treatment of copper
03/14/2000US6036528 Hollow contact for solder connection
03/14/2000US6036502 Flexible circuit compression connector system and method of manufacture
03/14/2000US6036377 Camera with lens barrier apparatus
03/14/2000US6036099 Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
03/14/2000US6036084 Screen printing method and apparatus therefor, and electronic component soldering method using screen printing and apparatus therefor
03/14/2000US6035528 Method of manufacturing electronic components
03/14/2000US6035527 Method for the production of printed circuit boards
03/14/2000US6035526 Method of repairing defect and apparatus for repairing defect
03/14/2000US6035525 Method of making a circuitized substrate assembly with carrier having substrates therein
03/14/2000US6035523 Method and apparatus for supporting a component on a substrate
03/14/2000US6035522 Circuit board leveling apparatus
03/09/2000WO2000013474A1 Forming plugs in vias of circuit board layers and subassemblies
03/09/2000WO2000013254A1 Method for vertical connection of conductors in a device in the microwave range
03/09/2000WO2000013232A1 Through hole bump contact
03/09/2000WO2000013228A1 Method for connecting electronic components to a substrate, and a method for checking such a connection
03/09/2000WO2000013190A1 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part
03/09/2000WO2000013062A1 Method for producing micro-openings
03/09/2000WO1999066599A8 Solder ball terminal
03/09/2000DE19938056A1 Conductive section removing method from surfaces of dielectric resonators used in oscillators, filters, duplexers includes a dielectric resonator plated with copper held by a holder which is irradiated by a laser
03/09/2000DE19840471A1 Apparatus for removal of coating from an article comprises devices which monitor voltage and/or current or potential variation, and are electrically connected to the control system of the apparatus
03/09/2000DE19826649C1 Phantom component item for use in circuit boards' automatic equipping machines
03/09/2000DE19822794C1 Mehrfachnutzen für elektronische Bauelemente, insbesondere akustische Oberflächenwellen-Bauelemente Multiple uses for electronic components, especially surface acoustic wave devices
03/09/2000DE19600388C2 Chipkarte Smart card
03/09/2000CA2341645A1 Method for vertical connection of conductors in a device in the microwave range
03/09/2000CA2338550A1 Through hole bump contact
03/08/2000WO2000045430A1 Electronic parts mounting method and device therefor
03/08/2000EP0984675A2 Apparatus for aligning a support for electronic circuits
03/08/2000EP0984672A2 Process for treating metal surfaces
03/08/2000EP0984467A1 Method and apparatus for producing multilayer body for electronic component
03/08/2000EP0984313A2 Reflective sheet display with laser patternable coating
03/08/2000EP0984247A2 Inductive sensor
03/08/2000EP0984030A2 Polyimide film and process for manufacture thereof
03/08/2000EP0983714A2 Method and arrangement for heating a component
03/08/2000EP0898794B1 Electrical and thermal anisotropically conducting structure
03/08/2000EP0897351B1 Overlay substrate for securing electronic devices in a vehicle
03/08/2000EP0839091B1 Apparatus for supporting and tensioning a stencil
03/08/2000EP0836796B1 Process for assembling electronics using microwave irradiation
03/08/2000EP0734642B1 Process and device for automatically fitting the top and bottom sides of printed circuit boards with smd components
03/08/2000EP0729585B1 A surface mount test point enabling hands free diagnostic testing of electronical circuits
03/08/2000EP0721682B1 Connector device for electrically interconnecting printed circuit board like members
03/08/2000CN2368255Y Device for preheating circuitboard before press-filming
03/08/2000CN2368136Y Flexible printed circuitboard cable device
03/08/2000CN1247016A Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material
03/08/2000CN1246739A Improved microstrip edge package board connector
03/08/2000CN1050260C Panel assembly structure and panel assembling method having minimal spacing electrode terminal
03/07/2000US6035382 Circuit for receiving a command word for accessing a secure subkey
03/07/2000US6034875 Cooling structure for electronic components
03/07/2000US6034598 Hazard warning switch for motor vehicles
03/07/2000US6034571 Oscillator module having a multi-layered base with a cover
03/07/2000US6034428 Semiconductor integrated circuit device having stacked wiring and insulating layers
03/07/2000US6034349 Laser machining system for sequential irradiation of machining points
03/07/2000US6034331 Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet
03/07/2000US6033936 Method of mounting an LSI package
03/07/2000US6033935 Sockets for "springed" semiconductor devices
03/07/2000US6033787 Ceramic circuit board with heat sink
03/07/2000US6033764 Bumped substrate assembly
03/07/2000US6033289 Detailing and cleaning apparatus for green ceramic dry dicing process
03/07/2000US6033245 Self-aligning electrical connector
03/07/2000US6033235 Socket apparatus particularly adapted for BGA type semiconductor devices
03/07/2000US6033234 Printed circuit board to flexible printed circuit connection system
03/07/2000US6033202 Mold for non - photolithographic fabrication of microstructures
03/07/2000US6032788 Multi-rail board transport system
03/07/2000US6032683 System for cleaning residual paste from a mask
03/07/2000US6032577 Method and apparatus for transporting substrates
03/07/2000US6032359 Method of manufacturing a female electrical connector in a single layer flexible polymeric dielectric film substrate
03/07/2000US6032357 Method of fabricating a printed circuit
03/07/2000US6032356 Wafer-level test and burn-in, and semiconductor process
03/07/2000US6032355 Method of forming thermal conductive structure on printed circuit board
03/02/2000WO2000011921A1 Method and device for placing and remelting shaped pieces consisting of solder material
03/02/2000WO2000011920A1 Printed circuit plate used for testing electric components
03/02/2000WO2000011766A1 Laser repetition rate multiplier
03/02/2000WO2000011755A1 Contact device mainly intended for contact between electric components and circuit supports and method for producing said device
03/02/2000WO2000011749A1 Method for making an antenna for a medium comprising an electronic circuit
03/02/2000WO2000011679A2 Contact element
03/02/2000WO2000011665A1 Assembly for chip(s) with magnetic head(s) and method for making same
03/02/2000WO2000011062A1 Curable composition
03/02/2000WO2000010763A1 Method and device for distributing solder balls
03/02/2000WO2000010736A1 Printing of electronic circuits and components
03/02/2000DE19940633A1 IC-Gehäuse IC package
03/02/2000DE19934732A1 Verfahren zum Laminieren eines flexiblen Schaltkreises auf ein Substrat A method for laminating a flexible circuit to a substrate
03/02/2000DE19912605A1 Circuit board strengthening element for system board arrangement has flow channels in side elements for heated fluid to heat connecting parts between electronic part and circuit board
03/02/2000DE19839760A1 Verfahren zur Verbindung von elektronischen Bauelementen mit einem Trägersubstrat sowie Verfahren zur Überprüfung einer derartigen Verbindung A method for connection of electronic components comprising a carrier substrate and to methods for checking of such a compound
03/02/2000DE19839114A1 Elektrischer Anschluß für einen flachen elektrischen Leiter und ein Verbindungsverfahren Electrical connection for a flat electrical conductor and a connection method
03/02/2000DE19837663A1 Connection for control unit integral to e.g. engine or gearbox of motor vehicle comprises free strip from track substrate with additional length pushed down into bush insert by contact pin
03/02/2000CA2341218A1 Contact element
03/01/2000EP0982809A2 Electric terminal for a flat electrical conductor and a method of connection
03/01/2000EP0982807A2 Improved microstrip edge card connector
03/01/2000EP0982806A1 Connector with electric contact elements adapted to be mounted on a circuit board
03/01/2000EP0982751A1 Subminiature lamp for indication light
03/01/2000EP0982741A2 Method for fabricating a thin film resistor onto a ceramic-polymer substrate
03/01/2000EP0982385A1 Adhesive, method for bonding, and assemblies of mounted boards
03/01/2000EP0982111A2 Apparatus and method for encapsulating electric circuits by injection moulding
03/01/2000EP0981722A1 Measuring system
03/01/2000EP0821725B1 Cold cleaning composition based on alkanes or cycloalkanes and an organic compound comprising a ketone group
03/01/2000EP0821724B1 Cycloalkane-based cleaning agent
03/01/2000CN2367056Y Machine for forming connections between printed circuits without waste material
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