| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/14/2000 | EP1007349A1 Patterned conducting polymer surfaces and process for preparing the same and devices containing the same |
| 06/14/2000 | EP0931439B1 Method for building at least two wiring levels on electrically insulated supports |
| 06/14/2000 | CN1256854A Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board |
| 06/14/2000 | CN1256853A Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board |
| 06/14/2000 | CN1256613A Method for manufacturing flexible circuit board |
| 06/14/2000 | CN1256612A Two signals single power flush printed circuit board |
| 06/14/2000 | CN1256611A Built-in fingered flat capacitor and resistor and their manufacture |
| 06/14/2000 | CN1256610A Manufacture of solid self-lubricating surface for movable microelectronic machine |
| 06/14/2000 | CN1256609A Flexible printed substrate |
| 06/14/2000 | CN1256476A Matrix display unit and its making method, and hot-pressed key assembly |
| 06/14/2000 | CN1053551C Multilayer circuit board |
| 06/14/2000 | CA2286969A1 Coatings for improved resin dust resistance |
| 06/13/2000 | US6075948 Electronic flash apparatus |
| 06/13/2000 | US6075710 Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips |
| 06/13/2000 | US6075708 Partly bent electric circuit substrate and method for manufacturing the same |
| 06/13/2000 | US6075432 Method for generating enhanced etched inductor elements |
| 06/13/2000 | US6075211 Multi-layered printed wiring board |
| 06/13/2000 | US6075080 Flux composition |
| 06/13/2000 | US6074894 Mounting method of semiconductor device |
| 06/13/2000 | US6074893 Multilayer elements for photoresists layers with grooves and filling, drying and developing |
| 06/13/2000 | US6074803 Bonding layers of insulation and subbing layers with resins with free radical photoinitiators |
| 06/13/2000 | US6074728 Using a conductive ink and a metallic thin-film to facilitate wire bonding. |
| 06/13/2000 | US6074697 Method for forming an electrode pattern such as a pattern of input-output electrodes of dielectric resonators |
| 06/13/2000 | US6074694 Process of applying material, in particular for the production of electrodes for exhaust gas sensors |
| 06/13/2000 | US6074567 Method for producing a semiconductor package |
| 06/13/2000 | US6074561 Apparatus and method for recovering photoresist developers and strippers |
| 06/13/2000 | US6074219 Electromechanical subassembly including a carrier with springy contacts that exert large and small contact forces |
| 06/13/2000 | US6074067 Fixing and covering structure for a reflection mirror |
| 06/13/2000 | US6073856 Noncontact IC device |
| 06/13/2000 | US6073554 Ink shield screen printing assembly and process |
| 06/13/2000 | US6073344 Laser segmentation of plated through-hole sidewalls to form multiple conductors |
| 06/13/2000 | US6073339 Method of making low profile pin-less planar magnetic devices |
| 06/11/2000 | CA2291547A1 Photoimageable compositions having improved chemical resistance and stripping ability |
| 06/08/2000 | WO2000033627A1 Method for producing adhesive coated foil |
| 06/08/2000 | WO2000033626A1 Printed circuit boards with integrated passive components and method for making same |
| 06/08/2000 | WO2000033625A1 Process for depositing conducting layer on substrate |
| 06/08/2000 | WO2000033624A1 Printed circuit board and method for fabricating such board |
| 06/08/2000 | WO2000033452A1 A power supply device with externally disconnectable 'y' capacitors |
| 06/08/2000 | WO2000033427A1 Controlling the heat expansion of electrical couplings |
| 06/08/2000 | WO2000033420A1 Surface mounted device with grooves on a termination lead |
| 06/08/2000 | WO2000033375A1 Anisotropic conductor film, semiconductor chip, and method of packaging |
| 06/08/2000 | WO2000033374A1 Anisotropic conductor film, semiconductor chip, and method of packaging |
| 06/08/2000 | WO2000033360A1 A method and apparatus for the transport and tracking of an electronic component |
| 06/08/2000 | WO2000033096A1 Probe card for probing wafers with raised contact elements |
| 06/08/2000 | WO2000033089A2 Lithographic contact elements |
| 06/08/2000 | WO2000032849A1 Equipment for inline plating |
| 06/08/2000 | WO2000032848A2 An inflatable compliant bladder assembly |
| 06/08/2000 | WO2000032835A2 Electro-chemical deposition system |
| 06/08/2000 | WO2000003568A9 Improved method for forming conductive traces and printed circuits made thereby |
| 06/08/2000 | DE19948949A1 Plug connector for flexible printed circuit board has flexible printed circuit board sandwiched between plug component with spring contacts and plug socket |
| 06/08/2000 | DE19947604A1 Siebdruckvorrichtung Screen printing apparatus |
| 06/08/2000 | DE19856333A1 Klebeverfahren Bonding process |
| 06/08/2000 | DE19854270A1 Flexible multi-layer conductor foil contacting method detects penetration force of contact pin for comparison with stored value for providing fault indication |
| 06/08/2000 | DE19844730A1 HF-Schnittstelle RF interface |
| 06/08/2000 | CA2352942A1 Equipment for inline plating |
| 06/08/2000 | CA2352820A1 Printed circuit board and method for fabricating such board |
| 06/08/2000 | CA2350506A1 Process for depositing conducting layer on substrate |
| 06/07/2000 | EP1006765A2 Method for strengthening air bridge circuits |
| 06/07/2000 | EP1006764A2 Multi-layer Circuit Boards having air bridges |
| 06/07/2000 | EP1006763A2 Copper foil for printed wiring board having excellent chemical resistance and heat resistance |
| 06/07/2000 | EP1006762A2 Arrangement for processing a circuit board |
| 06/07/2000 | EP1006577A2 Multilayer wiring board |
| 06/07/2000 | EP1005983A1 Squeegee for screen printing and screen printing method |
| 06/07/2000 | EP1005963A2 Punching device comprising removable stamps |
| 06/07/2000 | EP1005703A1 Method for producing electrically conductive cross connections between two layers of wiring on a substrate |
| 06/07/2000 | EP1005642A1 Method and device for determining a parameter for a metallization bath |
| 06/07/2000 | EP1005510A1 Dual curing silicone compositions |
| 06/07/2000 | EP1005509A1 Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods |
| 06/07/2000 | CN1256067A Circuit board |
| 06/07/2000 | CN1255825A Method for making electrochemical sensor on printed circuit board |
| 06/07/2000 | CN1255738A Method for shaping medium film patterns and layered patterns |
| 06/07/2000 | CN1053315C Fabrication process for circuit substrate having interconnection leads |
| 06/07/2000 | CN1053314C Appts. for cleaning and drying printed circuit boards |
| 06/07/2000 | CN1053298C Connector for electrical components |
| 06/07/2000 | CN1053233C Agent for surface processing of copper and copper alloy |
| 06/06/2000 | US6072899 Method and device of inspecting three-dimensional shape defect |
| 06/06/2000 | US6072687 Multilayer capacitor |
| 06/06/2000 | US6072375 Waveguide with edge grounding |
| 06/06/2000 | US6072239 Device having resin package with projections |
| 06/06/2000 | US6072235 Terminal arrangement for an SMD-capable hybrid circuit |
| 06/06/2000 | US6072232 Windowed non-ceramic package having embedded frame |
| 06/06/2000 | US6072231 Semiconductor device |
| 06/06/2000 | US6072207 Process for fabricating layered superlattice materials and making electronic devices including same |
| 06/06/2000 | US6072150 Apparatus and method for in-line soldering |
| 06/06/2000 | US6072126 Printed wiring board with grounding lines arranged between wiring lines |
| 06/06/2000 | US6072122 Multi-chip packaging structure having chips sealably mounted on opposing surfaces of substrates |
| 06/06/2000 | US6072018 High abrasion resistant coating material |
| 06/06/2000 | US6071801 Method and apparatus for the attachment of particles to a substrate |
| 06/06/2000 | US6071800 Electronic device and manufacturing method thereof |
| 06/06/2000 | US6071756 Method for holding components in place during soldering |
| 06/06/2000 | US6071629 Facing adhesion for rustproofing, zinc or zinc alloy layer and organic resin |
| 06/06/2000 | US6071597 Flexible circuits and carriers and process for manufacture |
| 06/06/2000 | US6071592 Metal-ceramic composite substrate |
| 06/06/2000 | US6071559 Dustfree prepreg and method for making an article based thereon |
| 06/06/2000 | US6071400 Brushes which touch the structured surfaces to be treated with their electrically conductive and thin fibres. a large number of brushes which are arranged transversely to the direction of transportation |
| 06/06/2000 | US6071398 Programmed pulse electroplating process |
| 06/06/2000 | US6071387 Automatic plating method and apparatus thereof |
| 06/06/2000 | US6071371 Method of simultaneously attaching surface-mount and chip-on-board dies to a circuit board |
| 06/06/2000 | US6071139 Locking assembly for securing semiconductor device to carrier substrate |
| 06/06/2000 | US6071137 Pressure actuated zero insertion force circuit board edge connector socket |