| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/11/2000 | US6014316 IC stack utilizing BGA contacts |
| 01/11/2000 | US6014314 Package structure of a multi-chip module |
| 01/11/2000 | US6014196 Transparent electrically conductive film-attached substrate |
| 01/11/2000 | US6013945 Electronic module for data cards |
| 01/11/2000 | US6013899 Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component |
| 01/11/2000 | US6013897 Electric circuit board having protective part against light beam soldering |
| 01/11/2000 | US6013877 Solder bonding printed circuit boards |
| 01/11/2000 | US6013876 Method and device for electrically connecting circuits to opposite surfaces of a printed circuit board |
| 01/11/2000 | US6013713 A paste for forming an electroconductive coatings on a c4 bump, comprising metallic particles selected from the group consisting of au, sn and au/sn alloy suspended in solvent solution; forming a coatings for testing integrated circuit |
| 01/11/2000 | US6013588 Printed circuit board and printed circuit board base material |
| 01/11/2000 | US6013581 Method for preventing poisoned vias and trenches |
| 01/11/2000 | US6013571 Microelectronic assembly including columnar interconnections and method for forming same |
| 01/11/2000 | US6013419 Polyimide resin films, coating on the surface with cyclodehydration and photopolymerization |
| 01/11/2000 | US6013417 Process for fabricating circuitry on substrates having plated through-holes |
| 01/11/2000 | US6013381 Lead-tin alloy solder having fluorine deposited on exposed surface by dissociative adsorption |
| 01/11/2000 | US6013357 Sintering aluminium nitride stack in presence of boron nitride release agent |
| 01/11/2000 | US6013355 Testing laminates with x-ray moire interferometry |
| 01/11/2000 | US6012928 Microstrip edge card connector |
| 01/11/2000 | US6012713 Reflow pallet with lever arm |
| 01/11/2000 | US6012626 Method of forming ball grid array contacts |
| 01/11/2000 | US6012624 Solder apparatus and method |
| 01/11/2000 | US6012388 Screen printing method and screen printing apparatus |
| 01/11/2000 | US6012231 Soldered integrated circuit connections |
| 01/11/2000 | US6012225 Method of making surface mount pads |
| 01/11/2000 | US6012224 Method of forming compliant microelectronic mounting device |
| 01/11/2000 | US6012223 Process for structurally securing stick-leaded components to a circuit board |
| 01/11/2000 | US6012221 Method of attaching a flexible circuit to a substrate |
| 01/11/2000 | US6012210 Light emitting diode jig |
| 01/11/2000 | CA2069865C Metallization of non-conductors |
| 01/11/2000 | CA2064859C Multi-layer circuit board that suppresses radio frequency interference from high frequency signals |
| 01/06/2000 | WO2000001209A1 Multilayer printed wiring board and production method thereof |
| 01/06/2000 | WO2000001208A1 Assembly of an electronic component with spring packaging |
| 01/06/2000 | WO2000001039A1 Membrane-supported contactor for semiconductor test |
| 01/06/2000 | WO2000000869A1 Photopolymerizable thermosetting resin compositions |
| 01/06/2000 | WO2000000563A1 Fine pitch anisotropic conductive adhesive |
| 01/06/2000 | WO2000000334A1 Polymeric materials and process for producing same |
| 01/06/2000 | WO2000000326A1 Method and device for cleaning a printed-circuit board mask or a printed-circuit board |
| 01/06/2000 | WO1999057342A8 Method and device for plating substrate |
| 01/06/2000 | CA2334734A1 Polymeric materials and process for producing same |
| 01/06/2000 | CA2333365A1 Photopolymerizable thermosetting resin compositions |
| 01/05/2000 | EP0969707A2 Multilayer printed wiring board and method for manufacturing same |
| 01/05/2000 | EP0969706A2 Electrical connections with deformable contacts |
| 01/05/2000 | EP0969705A2 Connector particularly for a thin smart card |
| 01/05/2000 | EP0969703A2 Method for the production of an electrotechnical device |
| 01/05/2000 | EP0969557A1 Connector |
| 01/05/2000 | EP0969502A2 Resin encapsulated electronic parts and method of manufacturing the same |
| 01/05/2000 | EP0969409A2 Method for producing a chip card and corresponding chip card |
| 01/05/2000 | EP0969324A1 One part photoimageable composition for forming solder mask |
| 01/05/2000 | EP0969065A2 Die attach adhesives for use in microelectronic |
| 01/05/2000 | EP0968631A1 Method for forming metal conductor models on electrically insulating supports |
| 01/05/2000 | EP0968630A1 Dual track stenciling system with solder gathering head |
| 01/05/2000 | EP0968629A2 Flat assembly and method for post-assembling additional components on a printed circuit board |
| 01/05/2000 | EP0968539A1 Product having a rechargeable battery which is held in a mechanically stable manner and is easy to remove |
| 01/05/2000 | EP0914688A4 Printed circuit board layering configuration for very high bandwidth interconnect |
| 01/05/2000 | EP0793695B1 Damping constructions comprising at least one layer of a viscoelastic material applied to a vibratory solid article |
| 01/05/2000 | DE19929194A1 Electrical connector box for use in a motor vehicle improved to be smaller, cheaper to manufacture and able to be connected to external circuits without problems |
| 01/05/2000 | DE19912628A1 Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstoffolie Electrically conductive, thermoplastic and heat-activatable adhesive film |
| 01/05/2000 | DE19829581A1 Baugruppenträger für elektronische Schaltungen Rack for electronic circuits |
| 01/05/2000 | DE19829580A1 Mechanical arrangement for lining up substrates for multilayer electronic circuits lines up carrier substrates by moving axes by cage lead screw movement, with centering elements and stops |
| 01/05/2000 | DE19829248A1 Verfahren zur Herstellung eines elektrotechnischen Bauteiles Process for the preparation of an electrotechnical component |
| 01/05/2000 | DE19828987A1 Verfahren und Vorrichtung zum Reinigen einer Leiterplattenschablone oder einer Leiterplatte Method and apparatus for cleaning a circuit board or a printed circuit board template |
| 01/05/2000 | DE19827089A1 Multilayer-Schaltungsaufbau mit beidseitiger SMD-Bestückung Multilayer circuit structure with two-sided SMD assembly |
| 01/05/2000 | CN1240568A Electronic component and mounting method and device thereof |
| 01/05/2000 | CN1240567A Process and apparatus for the coating of boards |
| 01/05/2000 | CN1240465A Thermally reworkable binders for flip-chip devices |
| 01/05/2000 | CN1240327A Installed circuit board structure and multi-layer circuit board for same |
| 01/05/2000 | CN1048116C Protective circuit for fuse |
| 01/04/2000 | US6011693 Slotted printed circuit board surface mount stress relief system |
| 01/04/2000 | US6011683 Thin multilayer ceramic capacitors |
| 01/04/2000 | US6011629 Method of positional alignment of substrate and screen mask in electrical paste screen printing |
| 01/04/2000 | US6011313 Flip chip interconnections on electronic modules |
| 01/04/2000 | US6011310 Film carrier and semiconductor device using the same |
| 01/04/2000 | US6010956 Process for producing multilayer wiring boards |
| 01/04/2000 | US6010920 Method and an arrangement for mounting a component on a carrier |
| 01/04/2000 | US6010823 Resist compositions for plating |
| 01/04/2000 | US6010771 Electrical circuit component formed of a conductive liquid printed directly onto a substrate |
| 01/04/2000 | US6010769 Multilayer wiring board and method for forming the same |
| 01/04/2000 | US6010768 Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler |
| 01/04/2000 | US6010340 Solder column tip compliancy modification for use in a BGA socket connector |
| 01/04/2000 | US6010061 Reflow soldering method |
| 01/04/2000 | US6010060 Lead-free solder process |
| 01/04/2000 | US6010058 BGA package using a dummy ball and a repairing method thereof |
| 01/04/2000 | US6009620 Method of making a printed circuit board having filled holes |
| 01/04/2000 | US6009619 Process for manufacturing an electronic circuit card |
| 12/30/1999 | DE19928788A1 Ceramic electronic component such as a laminated ceramic capacitor |
| 12/30/1999 | DE19928612A1 Test adapter card for printed circuit board, for line testing of integrated circuits |
| 12/30/1999 | DE19902950A1 Printed circuit board manufacture |
| 12/29/1999 | WO1999067978A1 Method for coating printed circuit boards or similar substrates |
| 12/29/1999 | WO1999067822A1 Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module |
| 12/29/1999 | WO1999067819A1 Thermocompression bonding device and bonding head thereof |
| 12/29/1999 | WO1999067321A2 Method for depositing a metallic layer on a polymer surface of a workpiece |
| 12/29/1999 | EP0967846A2 Apparatus for treating objects, especially circuit boards |
| 12/29/1999 | EP0967845A1 Liquid injector |
| 12/29/1999 | EP0967650A2 Circuit board for mounting bare chip |
| 12/29/1999 | EP0967635A2 Method of manufacturing a bonded, aluminum containing device |
| 12/29/1999 | EP0967624A2 Via formation for multilayer inductive devices and other devices |
| 12/29/1999 | EP0967299A1 Process for partial electroless plating |
| 12/29/1999 | EP0967042A2 Portable electric desoldering tool |
| 12/29/1999 | EP0966868A1 Printed circuit assembly |
| 12/29/1999 | EP0966777A1 Electric subassembly |