| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 02/02/2000 | EP0976104A2 Smart card, connection arrangement and method of producing a smart card |
| 02/02/2000 | EP0976010A1 Waterborne photoresists made from urethane acrylates |
| 02/02/2000 | EP0975979A1 Method for making cards with multiple contact tips for testing semiconductor chips |
| 02/02/2000 | EP0975953A1 Device for inspecting test objects and the use thereof |
| 02/02/2000 | EP0975464A1 Silicon nitride coating compositions |
| 02/02/2000 | CN1243601A Mounting structure and mounting process for semiconductor devices |
| 02/02/2000 | CN1243534A Repellent-containing material for electronic components, electronic components made by using same, and process for production of components |
| 02/02/2000 | CN1243526A Thermosetting resin compositions |
| 02/02/2000 | CN1243461A Method for making a sonoprobe |
| 02/02/2000 | CN1243417A 电子回路装置 Electronic circuit devices |
| 02/02/2000 | CN1243416A Method for producing multilayer cicuit board and multilayer circuitboard produced by said method |
| 02/02/2000 | CN1048969C Composite uncalcined ceramic bodies and method for manufacturing same |
| 02/01/2000 | US6021050 Printed circuit boards with integrated passive components and method for making same |
| 02/01/2000 | US6021048 High speed memory module |
| 02/01/2000 | US6021046 Thermal protection of electrical elements systems |
| 02/01/2000 | US6021025 Disk apparatus having an actuator for moving heads |
| 02/01/2000 | US6020862 Method for making non-planar radio frequency device and device produced thereby |
| 02/01/2000 | US6020809 Mounting structure for thermistor with positive resistance-to-temperature characteristic |
| 02/01/2000 | US6020745 Method of batch testing surface mount devices using a substrate edge connector |
| 02/01/2000 | US6020660 Dynamoelectric machine |
| 02/01/2000 | US6020638 Packaging structure of BGA type semiconductor device mounted on circuit substrate |
| 02/01/2000 | US6020637 Ball grid array semiconductor package |
| 02/01/2000 | US6020634 Replaceable power module |
| 02/01/2000 | US6020624 Semiconductor package with bi-substrate die |
| 02/01/2000 | US6020562 Reduced-capacitance component mounting pads and capacitance-reduction methods for high frequency multi-layer printed circuit boards |
| 02/01/2000 | US6020561 Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof |
| 02/01/2000 | US6020559 Flat flexible cable |
| 02/01/2000 | US6020261 Process for forming high aspect ratio circuit features |
| 02/01/2000 | US6020059 Multilayer anisotropic electroconductive adhesive and method for manufacturing same |
| 02/01/2000 | US6020049 This photoimageable dielectric material is a substitute for conventional dielectrics like epoxy, polyimides, etc. |
| 02/01/2000 | US6020048 Thick film circuit board and method of forming wire bonding electrode thereon |
| 02/01/2000 | US6020029 Process for treating metal surfaces |
| 02/01/2000 | US6019932 Method of sealing electronic parts with a resin |
| 02/01/2000 | US6019910 Etching tri-metal layers to form electronic circuits using aqueous alkaline solutions including nitrates |
| 02/01/2000 | US6019883 Process for producing a deposit on a removable support |
| 02/01/2000 | US6019274 Semiconductor device and mounting method therefor |
| 02/01/2000 | US6019272 Method for attaching a terminal connector to a metallic surface |
| 02/01/2000 | US6019271 Method for ultrasonic bonding flexible circuits |
| 02/01/2000 | US6019037 Method for screen printing patterns on a target object |
| 02/01/2000 | US6018866 Apparatus and method for printed circuit board repair |
| 01/27/2000 | WO2000004753A2 Alignment of vias in circuit boards or similar structures |
| 01/27/2000 | WO2000004750A1 Method for producing printed circuit boards with rough conducting structures and at least one area with fine conducting structures |
| 01/27/2000 | WO2000004749A1 Method for joining copper films and separating sheets of metal |
| 01/27/2000 | WO2000004610A1 Ic socket |
| 01/27/2000 | WO2000004595A2 Land-side mounting of components to an integrated circuit package |
| 01/27/2000 | WO2000004584A2 Semiconductor component in a chip format and method for the production thereof |
| 01/27/2000 | WO2000004578A1 Method for transferring solder to a device and/or testing the device |
| 01/27/2000 | WO2000004446A1 Prototype development system |
| 01/27/2000 | WO2000004075A2 Heat curable epoxy compositions |
| 01/27/2000 | WO2000003845A2 Device for the automated machining of workpieces |
| 01/27/2000 | WO2000003831A1 Device for the laser processing of workpieces |
| 01/27/2000 | WO2000003830A1 Device for the laser processing of flat workpieces |
| 01/27/2000 | WO2000003829A1 Solder ball placement apparatus |
| 01/27/2000 | DE19934224A1 Lubricant film for process films has a layer(s) of mainly syndiotactic styrene with specific wettability, crystallinity and impact resistance |
| 01/27/2000 | DE19932938A1 Magnetic device for treating fluid stream, e.g. defoaming alkaline developer for photoresist, has alternating poles so that magnetic flux changes along direction of fluid flow |
| 01/27/2000 | DE19925652A1 Soldering method for manufacture of electronic circuit |
| 01/27/2000 | DE19846456A1 Electronic component with semiconductor component and lead frame |
| 01/27/2000 | DE19833593A1 Selective metallization of e.g. ceramic, glass or plastic, e.g. for circuit board or electromagnetically screened housing, comprising mechanically depositing seeds on a rough substrate surface and then chemical plating |
| 01/27/2000 | DE19832706A1 Chip format semiconductor device has external connection metal balls placed on conductive adhesive or solder paste fillings in via holes to prevent stress transfer to connections between the soldered device and a printed circuit board |
| 01/27/2000 | DE19832062A1 Mounting for control circuit chip in motor vehicle |
| 01/27/2000 | CA2341899A1 Solder ball placement apparatus |
| 01/27/2000 | CA2337393A1 Heat curable epoxy compositions |
| 01/27/2000 | CA2336871A1 Method for joining copper films and separating sheets of metal |
| 01/26/2000 | EP0975071A1 Component for smd-mounting on a support structure |
| 01/26/2000 | EP0975053A1 Electrical contact for mounting a module on a rigid circuit board |
| 01/26/2000 | EP0975019A2 Chip mounting board and method of measuring it |
| 01/26/2000 | EP0974685A1 Metal foil with improved bonding to substrates and method for making said foil |
| 01/26/2000 | EP0974249A1 Process for producing printed circuits and printed circuits thus obtained |
| 01/26/2000 | EP0973441A1 Method and pdt probe for minimizing ct and mri image artifacts |
| 01/26/2000 | EP0860033A4 Solder-holding clips for applying solder to connectors |
| 01/26/2000 | EP0819747B1 Adhesive, adhesive film and adhesive-backed metal foil |
| 01/26/2000 | EP0776262A4 Rosin-free, low voc, no-clean soldering flux and method using the same |
| 01/26/2000 | CN1242926A Improvements in or relating to thermal trip arrangements |
| 01/26/2000 | CN1242684A Multilayer printed wiring board and method for mfg. same |
| 01/26/2000 | CN1242603A Wiring board for bump bonding, semiconductor device assembled from wiring board and mfg. method of wiring board for bump bonding |
| 01/26/2000 | CN1242504A Method of drying copper foil and copper foil drying apparatus |
| 01/26/2000 | CN1242403A Anisotropic conductive adhesive and method for preparation thereof and electronic apapratus using said adhesive |
| 01/26/2000 | CN1048824C Chip carrier and method for producing same,and use thereof |
| 01/25/2000 | US6018584 Electronic component assembly for an electronic device and method of assembling the same |
| 01/25/2000 | US6018462 Multi-tip module |
| 01/25/2000 | US6018448 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 01/25/2000 | US6018285 Wire-wound component to be mounted on a printed circuit board |
| 01/25/2000 | US6018197 Wired board with improved bonding pads |
| 01/25/2000 | US6018196 Semiconductor flip chip package |
| 01/25/2000 | US6018191 Semiconductor device |
| 01/25/2000 | US6018167 Light-emitting device |
| 01/25/2000 | US6017971 A thermoplastic resin blends comprising aluminum borate or amorphous silica; use for electrodeposit coating electric or electronic parts such as printed circuit boards, wiring circuit boards, connectors, housing, and insulators |
| 01/25/2000 | US6017967 Forming a stable aqueous dispersion of a metal sulfide with a dispersant and a stabilizer having at least three alkylene oxide groups in a chain and a hydrophilic--lipophilic balance; providing a uniform metal coatings over substrate |
| 01/25/2000 | US6017642 Low dielectric loss glasses |
| 01/25/2000 | US6017634 Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive |
| 01/25/2000 | US6017613 Pattern-wise light exposure of photoresist-free seed layer comprising a metal compound and a metal oxalate, then removing unexposed layer with an alkaline solution prior to electroless deposition of metal onto seed pattern |
| 01/25/2000 | US6017584 Encapsulated displays are disclosed; particles encapsulated therein are dispersed within a suspending or electrophoretic fluid |
| 01/25/2000 | US6017424 Laser assisted surface reformation method of high polymer material |
| 01/25/2000 | US6017410 Method to anchor foils for green-tape circuits |
| 01/25/2000 | US6017246 Printed wiring board |
| 01/25/2000 | US6017244 Interconnection mechanism for flexible printed circuits |
| 01/25/2000 | US6017225 Integral holder-connector for capacitor microphone |
| 01/25/2000 | US6016949 Integrated placement and soldering pickup head and method of using |
| 01/25/2000 | US6016947 Non-destructive low melt test for off-composition solder |
| 01/25/2000 | US6016817 Method and device for the treatment of plate-shaped workpieces having small holes |