| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/25/2000 | US6016746 Flip chip screen printing method |
| 01/25/2000 | US6016598 Method of manufacturing a multilayer printed wire board |
| 01/25/2000 | CA2161569C Circuit element mounting structure |
| 01/20/2000 | WO2000003573A1 Integrated circuit module having springy contacts of at least two different types for reduced stress, and subassembly for such module |
| 01/20/2000 | WO2000003572A1 Printed wiring board and method for producing the same |
| 01/20/2000 | WO2000003571A1 Method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections |
| 01/20/2000 | WO2000003570A1 Printed-circuit board and method of manufacture thereof |
| 01/20/2000 | WO2000003569A1 Interconnect assembly for printed circuit boards and method of fabrication |
| 01/20/2000 | WO2000003568A1 Improved method for forming conductive traces and printed circuits made thereby |
| 01/20/2000 | WO2000003567A1 A thermal management device and method of making such a device |
| 01/20/2000 | WO2000003436A2 Low cost high power hermetic package with electrical feed-through bushings |
| 01/20/2000 | WO2000003380A1 Lcd apparatus and method of producing desired displays using such apparatus |
| 01/20/2000 | WO2000003354A1 Noncontact ic card and manufacture thereof |
| 01/20/2000 | WO2000003305A1 A method for making a printed wiring board with heavy and thin conductive traces |
| 01/20/2000 | WO2000003259A2 Method and apparatus for distinguishing regions where a material is present on a surface |
| 01/20/2000 | DE19830212A1 Verfahren und Vorrichtung zum Behandeln von Gegenständen, insbesondere scheibenförmigen Gegenständen wie Blechen, Glasplatten, Leiterplatten, Keramiksubstraten Method and apparatus for treating objects, in particular disc-shaped objects such as sheet metals, glass panes, printed circuit boards, ceramic substrates |
| 01/20/2000 | DE19829467A1 Kontaktträger insbesondere für einen dünnen Smart Card Connector Contact support especially for a thin Smart Card Connector |
| 01/20/2000 | DE19821174C1 Continuous hot lamination of solid photoresists onto metal-lined, thermoplastic, flexible printed circuit materials |
| 01/19/2000 | EP0973365A2 Method of drying copper foil and copper foil drying apparatus |
| 01/19/2000 | EP0973364A2 Self-shearing stencil |
| 01/19/2000 | EP0973197A2 Wafer-scale package structure and circuit board used therein |
| 01/19/2000 | EP0973108A2 Field programmable printed circuit board |
| 01/19/2000 | EP0973066A1 Film applying apparatus |
| 01/19/2000 | EP0972432A1 Method of arranging signal and destination pads to provide multiple signal/designation connection combinations |
| 01/19/2000 | EP0972321A1 Contact arrangement |
| 01/19/2000 | EP0972318A1 Electrical connection between a circuit support and a strip conductor support |
| 01/19/2000 | EP0972303A1 Low dielectric constant material with improved dielectric strength |
| 01/19/2000 | EP0912335A4 Conductive elastomers and methods for fabricating the same |
| 01/19/2000 | EP0807258B1 Test device for flat electronic assemblies |
| 01/19/2000 | CN1242137A Multilayered printed wiring board |
| 01/19/2000 | CN1241895A Double-sided circuit board soldering technology and device |
| 01/19/2000 | CN1241894A Circuit board and its producing method |
| 01/19/2000 | CN1241868A Linearity correction coil device and video display apparatus using the same |
| 01/19/2000 | CN1241808A Device and method for connecting two electronic components |
| 01/19/2000 | CN1241792A Sheet shape inducer |
| 01/19/2000 | CN1048446C A method of manufacturing a composite laminate comprising unidirectional reinforcing fibres for use in printed wire boards |
| 01/18/2000 | US6016253 Electronic module |
| 01/18/2000 | US6016089 Printed circuit with resilient contacts providing a ground path for common-mode filtration capacitors |
| 01/18/2000 | US6016087 Coupled microstrip lines |
| 01/18/2000 | US6016005 Multilayer, high density micro circuit module and method of manufacturing same |
| 01/18/2000 | US6015651 Solder resist ink composition of a novolak-epoxy resin |
| 01/18/2000 | US6015607 Flexible laminates and method of making the laminates |
| 01/18/2000 | US6015523 Molding polyvinyl alcohol resin by injection for electronic parts, dissolving in water and insertion core into mold cavity |
| 01/18/2000 | US6015520 Method for filling holes in printed wiring boards |
| 01/18/2000 | US6015509 Composition containing a polymer and conductive filler and use thereof |
| 01/18/2000 | US6015482 Printed circuit manufacturing process using tin-nickel plating |
| 01/18/2000 | US6015316 Circuit board mounted connector and contact used in the same |
| 01/18/2000 | US6015301 Surface mount socket |
| 01/18/2000 | US6015249 Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards |
| 01/18/2000 | US6015082 Surfaces coated with thin layers of metals or alloys, compressed and heated above the melting points to form solder joints |
| 01/18/2000 | US6015081 Electrical connections using deforming compression |
| 01/18/2000 | US6014809 Method for circuitizing over an edge of a circuit card |
| 01/18/2000 | US6014805 Method of fabricating a hybrid printed circuit board |
| 01/13/2000 | WO2000002430A1 Molded housing with integral heatsink |
| 01/13/2000 | WO2000002426A1 Post-treatment for copper on printed circuit boards |
| 01/13/2000 | WO2000002425A1 A device and method for mounting electronic components on printed circuit boards |
| 01/13/2000 | WO2000002424A1 Scanner system |
| 01/13/2000 | WO2000002245A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 01/13/2000 | WO2000002244A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 01/13/2000 | WO2000002243A1 Semiconductor device, method of manufacture, circuit board, and electronic device |
| 01/13/2000 | WO2000002088A1 Integral thin-film metal resistor with improved tolerance and simplified processing |
| 01/13/2000 | WO2000001782A1 Electroconductive, thermoplastic and heat-activated adhesive film |
| 01/13/2000 | WO2000001522A1 Improvements to press pads |
| 01/13/2000 | WO2000001506A1 Solder powder and method for preparing the same and solder paste |
| 01/13/2000 | WO1999060188A3 Method for electro copperplating substrates |
| 01/13/2000 | DE19931287A1 Method and apparatus for wave soldering |
| 01/13/2000 | DE19848474C1 Ceramic articles, especially electronic ceramic multilayer hybrids, are produced from green bodies containing organic materials |
| 01/13/2000 | DE19830540A1 Electronic flexible type circuit board especially for power semiconductors, sensors and passive components |
| 01/13/2000 | DE19826756A1 Verfahren zum Verkapseln von Mikrometallpulvern, daraus hergestellte Lotpulver und deren Verwendung A method for encapsulating micro metal powders, solder powders prepared therefrom and their use |
| 01/13/2000 | CA2335816A1 Post-treatment for copper on printed circuit boards |
| 01/13/2000 | CA2333722A1 Improvements to press pads |
| 01/13/2000 | CA2277768A1 Self-shearing stencil |
| 01/12/2000 | EP0971571A2 Process for manufacturing a multilayer |
| 01/12/2000 | EP0971570A1 Printed wiring board and its manufacturing method |
| 01/12/2000 | EP0971569A1 Enhanced mounting pads for printed circuit boards |
| 01/12/2000 | EP0971568A2 Electronic component |
| 01/12/2000 | EP0971474A1 Motor boot for a circuit board |
| 01/12/2000 | EP0971411A2 Semiconductor device |
| 01/12/2000 | EP0971405A2 Method for manufacturing a substrate for a polymer stud grid array |
| 01/12/2000 | EP0971370A1 Cable and method of manufacturing it |
| 01/12/2000 | EP0971313A1 Chip card manufacturing procedure limiting the mechanical stresses on it |
| 01/12/2000 | EP0970899A1 Method and device for processing articles, especially slice-shaped articles like plates, glaspanes, circuit boards, ceramic substrates |
| 01/12/2000 | EP0970594A1 Moulded sockets for electronic component attachment |
| 01/12/2000 | EP0970544A1 A contact device and a tool for handling it |
| 01/12/2000 | EP0970543A1 Compression connector |
| 01/12/2000 | EP0970522A1 Bga connector with heat activated connection and disconnection means |
| 01/12/2000 | EP0970521A1 Improved solder joint reliability |
| 01/12/2000 | EP0970520A2 Mounting structure and mounting process from semiconductor devices |
| 01/12/2000 | EP0970480A1 Vertically interconnected electronic assemblies and compositions useful therefor |
| 01/12/2000 | EP0970437A1 Electronic module for chip card |
| 01/12/2000 | EP0969982A2 Control device for a vehicle |
| 01/12/2000 | EP0944482A4 Apparatus and method for recovering photoresist developers and strippers |
| 01/12/2000 | EP0835600A4 Perimeter matrix ball grid array circuit package with a populated center |
| 01/12/2000 | EP0502023B1 Metallization of non-conductors |
| 01/12/2000 | CN1241297A High density electrical connectors |
| 01/12/2000 | CN1241285A Method of mfg. plurality of electronic components |
| 01/12/2000 | CN1241112A Electronic apparatus |
| 01/12/2000 | CN1241111A Soldering device |
| 01/12/2000 | CN1241110A Method for production of electrotechnical device |
| 01/12/2000 | CN1048359C Flexible wiring board having terminal array and its connection structure with circuit board |