| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/04/2000 | US6084781 Assembly aid for mounting packaged integrated circuit devices to printed circuit boards |
| 07/04/2000 | US6084780 Printed circuit board with high electronic component density |
| 07/04/2000 | US6084776 Control device, consisting of at least two housing parts |
| 07/04/2000 | US6084663 Method and an apparatus for inspection of a printed circuit board assembly |
| 07/04/2000 | US6084309 Semiconductor device and semiconductor device mounting structure |
| 07/04/2000 | US6084300 Compact resin-sealed semiconductor device |
| 07/04/2000 | US6084296 Low cost high power hermetic package with electrical feed-through bushings |
| 07/04/2000 | US6083855 Methods of manufacturing voidless resin impregnated webs |
| 07/04/2000 | US6083837 Fabrication of components by coining |
| 07/04/2000 | US6083768 Inverted orientation until the viscous material dries or cures enough to maintain definition |
| 07/04/2000 | US6083666 Method of forming a bump comprising protuberances |
| 07/04/2000 | US6083635 Electroluminescence; cationic polythiophene and sugar; electroconductivity; radiation transparent |
| 07/04/2000 | US6083633 Copper and transition metal layers; prevention of intermetallic formation; tin coating; oxidation and corrosion resistance |
| 07/04/2000 | US6083454 Apparatus and method for making uniformly sized and shaped spheres |
| 07/04/2000 | US6083375 Each pad includes a base pad which is encapsulated within a series of successively electroplated metal encapsulating films to produce a corrosion-resistant terminal metal pad. |
| 07/04/2000 | US6083340 Process for manufacturing a multi-layer circuit board |
| 07/04/2000 | US6083039 Connector contact mold-positioning |
| 07/04/2000 | US6083032 Pin adjustment fixture for printed wiring board (PWB) mounting |
| 07/04/2000 | US6082610 Method of forming interconnections on electronic modules |
| 07/04/2000 | US6082606 Method and machine for wave soldering or tinning |
| 07/04/2000 | US6082605 Continuous mode solder jet apparatus |
| 07/04/2000 | US6081999 Wire-circuit sheet manufacturing method |
| 07/04/2000 | US6081998 Method of surface mounting a connector |
| 07/04/2000 | US6081996 Through hole circuit board interconnect |
| 07/04/2000 | CA2014871C Package to board variable pitch tab |
| 06/29/2000 | WO2000038493A1 Air-wound coil for vacuum pick-up, surface mounting, and adjusting |
| 06/29/2000 | WO2000038487A1 Production of photoresist coatings |
| 06/29/2000 | WO2000038232A1 Wire bond compensation |
| 06/29/2000 | WO2000038111A1 Method for making a contactless chip card |
| 06/29/2000 | WO2000038108A1 Device arranged for contactless communication and provided with a data carrier with fully enclosed holding means for holding a chip and a passive component |
| 06/29/2000 | WO2000037884A1 Method and apparatus for measuring positioning error using index mark, and machining apparatus that corrects error based on measured result |
| 06/29/2000 | WO2000037579A1 Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
| 06/29/2000 | WO2000027171A3 Electromechanical component |
| 06/29/2000 | WO2000004595A3 Land-side mounting of components to an integrated circuit package |
| 06/29/2000 | DE19962031A1 Electrical illumination unit for toy model, has bulb mounted in carrier that can be positioned on power supply ribbon connection. |
| 06/29/2000 | DE19961537A1 Glass-ceramic board, especially a multilayer wiring board, comprises a co-fired product of a silver-based conductive material and a glass-ceramic insulation material containing an oxidizable metal |
| 06/29/2000 | DE19958199A1 Electrical connector for producing solderless connection between coil and circuit board e.g. for motor vehicle anti-lock braking system, has coil body with protruding plastic stud, and pre-tinned coil wire section |
| 06/29/2000 | DE19861162A1 Verfahren zur Herstellung einer Leiterplatte sowie Leiterplatte A process for producing a printed circuit board and circuit board |
| 06/29/2000 | DE19837663C2 Aufbau eines Steuergerätes Construction of a control unit |
| 06/28/2000 | EP1014776A1 Method for mechanicaly fixing components on a board and device for applying this method |
| 06/28/2000 | EP1014772A2 High frequency circuit packaging structure |
| 06/28/2000 | EP1014769A2 Manufacturing method of printed circuit board |
| 06/28/2000 | EP1014768A2 Process and apparatus for fabricating multilayers |
| 06/28/2000 | EP1014767A1 Thermal stress relief for surface mount components using via filling |
| 06/28/2000 | EP1014764A1 Printed circuit device |
| 06/28/2000 | EP1014515A2 Method for the ultrasonic multidirectional interconnection of flat cables |
| 06/28/2000 | EP1014436A2 Process for producing a substrate |
| 06/28/2000 | EP1014399A2 Flexible thin film capacitor and method for producing the same |
| 06/28/2000 | EP1014302A1 Noncontact ic card and manufacture thereof |
| 06/28/2000 | EP1014096A2 Substrate and method for inspection |
| 06/28/2000 | EP1013391A2 Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch substrate, and a switch substrate |
| 06/28/2000 | EP1012880A1 Substrate for electronic packaging, pin jig fixture |
| 06/28/2000 | EP1012858A1 Through-hole interconnect device with isolated wire-leads and component barriers |
| 06/28/2000 | EP1012831A1 Assembly for chip(s) with magnetic head(s) and method for making same |
| 06/28/2000 | EP1012354A1 Lead-free tin alloy |
| 06/28/2000 | EP1012082A2 Conveyor system with lifting mechanism |
| 06/28/2000 | EP1011973A2 Viewing and imaging systems |
| 06/28/2000 | EP0824426B1 Control system for an automotive vehicle multi-functional apparatus |
| 06/28/2000 | EP0782765B1 Polymer stud grid array package |
| 06/28/2000 | CN1258190A Method for mfg. printed circuit board |
| 06/28/2000 | CN1258189A Method for attaching electric conductor to substrate |
| 06/28/2000 | CN1258188A Glass-ceramic board |
| 06/28/2000 | CN1258098A Back electrode type electronic component and electronic assembly mounting same to printed circuit board |
| 06/28/2000 | CN1054001C Method and apparatus for locating electrical circuit members |
| 06/28/2000 | CN1053860C Process and device for resin impregnation of porous web |
| 06/27/2000 | US6081613 System for inspecting an appearance of a printed circuit board |
| 06/27/2000 | US6081430 High-speed backplane |
| 06/27/2000 | US6081416 Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic |
| 06/27/2000 | US6081180 Toroid coil holder with removable top |
| 06/27/2000 | US6081055 Vibration motor |
| 06/27/2000 | US6081031 Semiconductor package consisting of multiple conductive layers |
| 06/27/2000 | US6081026 High density signal interposer with power and ground wrap |
| 06/27/2000 | US6081023 Semiconductor device |
| 06/27/2000 | US6080969 Apparatus for and method of thermally processing substrate |
| 06/27/2000 | US6080936 Connecting board with oval-shaped protrusions |
| 06/27/2000 | US6080836 Applying a layer of a cyanate ester resin to the surface of the composite, and etching the surface using an etching solution comprising a quaternary ammonium hydroxide and/or a primary amine; forms highly conductive metallic coating |
| 06/27/2000 | US6080709 Comprising 1) oxalic acid or ammonium oxalate and 2) polyaminocarboxylic acids, but contains no hydrogen fluoride. |
| 06/27/2000 | US6080684 During lamination, the first coating acts like an impenetrable insulating sheet, and preventing glass fiber contact with the conductive planes. the second coating is fluid enough to fill in spaces in the planes |
| 06/27/2000 | US6080668 Sequential build-up organic chip carrier and method of manufacture |
| 06/27/2000 | US6080650 Method and apparatus for attaching particles to a substrate |
| 06/27/2000 | US6080603 Fixtures and methods for lead bonding and deformation |
| 06/27/2000 | US6080596 Method for forming vertical interconnect process for silicon segments with dielectric isolation |
| 06/27/2000 | US6080592 Computers |
| 06/27/2000 | US6080509 Thin-profile battery circuits and constructions, button-type battery circuits and constructions, methods of forming thin-profile battery circuits and constructions, and methods of forming button-type battery circuits and constructions |
| 06/27/2000 | US6080494 Method to manufacture ball grid arrays with excellent solder ball adhesion for semiconductor packaging and the array |
| 06/27/2000 | US6080450 Comprising a free radical-polymerizable liquid composition, about 0.02 to 1.0 percent of a fluorescing agent, said fluorescing agent fluorescing at wavelengths above 350 nm and including a phosphine oxide photoinitiator |
| 06/27/2000 | US6080443 Method for production of microcapsule type conductive filler |
| 06/27/2000 | US6080336 Via filling conductive paste consists of a silver coated copper particles, liquid epoxy resin having two or more epoxy groups, resol phenolic resin and a curing agent for epoxy resin |
| 06/27/2000 | US6080335 Conductive paste and method for producing ceramic substrate using the same |
| 06/27/2000 | US6079991 Method for placing contact on electrical connector |
| 06/27/2000 | US6079638 Nozzle assembly improvement |
| 06/27/2000 | US6079620 Board adapter |
| 06/27/2000 | US6079100 Method of making a printed circuit board having filled holes and fill member for use therewith |
| 06/27/2000 | US6079099 Electronic component manufacturing method |
| 06/27/2000 | US6079098 Method and apparatus for processing substrates |
| 06/27/2000 | CA2166926C Packaging multi-chip modules without wire-bond interconnection |
| 06/27/2000 | CA2137980C Metal surface dry fluxing method and device for use before brazing or tinning |
| 06/22/2000 | WO2000036891A1 Improved methods for wire-scribing filament circuit patterns with planar and non-planar portions; improved wire-scribed boards, interconnection cards, and smart cards made by these methods |
| 06/22/2000 | WO2000036889A1 An environmentally desirable method of manufacturing printed circuits |
| 06/22/2000 | WO2000036888A1 Flexible interconnection between integrated circuit chip and substrate or printed circuit board |