| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/03/2000 | EP0996869A1 Pattern-forming methods and radiation sensitive materials |
| 05/03/2000 | EP0996770A1 Method and apparatus for treating metal surfaces by dry process |
| 05/03/2000 | EP0996534A1 Very ultra thin conductor layers for printed wiring boards |
| 05/03/2000 | EP0996523A1 Composition for preventing creeping of a flux for soldering |
| 05/03/2000 | EP0996521A1 Apparatus and method for making uniformly sized and shaped spheres |
| 05/03/2000 | EP0953008A4 Thermosetting resin compositions |
| 05/03/2000 | EP0883862B1 Integrated circuit card comprising a conductor pattern made of a conductive polymer |
| 05/03/2000 | EP0803135B1 Electrical connections with deformable contacts |
| 05/03/2000 | EP0783775B1 Solder-bearing lead and method of producing and using same |
| 05/03/2000 | CN2376698Y Aluminium rail for wave-peak welding |
| 05/03/2000 | CN1252129A Method for making cards with multiple contact tips for testing semiconductor chips |
| 05/03/2000 | CN1251830A Crystal glass composite article, crystal glass, insulating composite article, insulating paste and thick film circuit board |
| 05/03/2000 | CN1251801A Rubber for thermal pressed cushion and production thereof, and manufacture of thermal pressed cushions and printed circuit boards |
| 05/03/2000 | CN1052138C Printed circuit card with minor surface I/O pads |
| 05/03/2000 | CN1052088C Display board having wiring with three-layered structure and display device including the display board |
| 05/02/2000 | US6058256 Technique for effectively routing conduction paths in circuit layouts |
| 05/02/2000 | US6058021 Structure of mounting a semiconductor element onto a substrate |
| 05/02/2000 | US6058020 Component housing for surface mounting of a semiconductor component |
| 05/02/2000 | US6058017 Plastic integrated circuit card with an enclosed reinforcement structure separated from an integrated circuit module for protecting the integrated circuit module |
| 05/02/2000 | US6058014 Enhanced mounting hardware for a circuit board |
| 05/02/2000 | US6058013 Molded housing with integral heatsink |
| 05/02/2000 | US6057600 Structure for mounting a high-frequency package |
| 05/02/2000 | US6057527 Portable electric desoldering tool |
| 05/02/2000 | US6057414 Process of plasma treating polymer materials |
| 05/02/2000 | US6057240 Aqueous surfactant solution method for stripping metal plasma etch deposited oxidized metal impregnated polymer residue layers from patterned metal layers |
| 05/02/2000 | US6057221 Laser-induced cutting of metal interconnect |
| 05/02/2000 | US6057178 Method of padding an electronic component, mounted on a flat substrate, with a liquid filler |
| 05/02/2000 | US6057175 Method of making encapsulated package |
| 05/02/2000 | US6057173 Ablative bond pad formation |
| 05/02/2000 | US6057079 Dry film photoresist construction suitable for rolling up on itself |
| 05/02/2000 | US6057027 Method of making peripheral low inductance interconnects with reduced contamination |
| 05/02/2000 | US6056994 Liquid deposition methods of fabricating layered superlattice materials |
| 05/02/2000 | US6056831 Process for chemically and mechanically enhancing solder surface properties |
| 05/02/2000 | US6056558 Electrical connector with improved terminals for receiving solder balls |
| 05/02/2000 | US6056557 Board to board interconnect |
| 05/02/2000 | US6056191 Method and apparatus for forming solder bumps |
| 05/02/2000 | US6056190 Solder ball placement apparatus |
| 05/02/2000 | US6056189 Fluxing media for non-VOC, no-clean soldering |
| 05/02/2000 | US6056188 Method of attaching a component to a plate-shaped support |
| 05/02/2000 | US6056185 Method of connecting batteries to electronic circuits |
| 05/02/2000 | US6056184 Apparatus for shaping liquid portions of solder in soft soldering semiconductor chips |
| 05/02/2000 | US6055847 Measuring sensor having metal jacket lead and externally mounted threaded connector |
| 05/02/2000 | US6055725 Method for reducing shorts on a printed circuit board edge connector |
| 05/02/2000 | US6055723 Using fluoropolymers |
| 05/02/2000 | US6055722 Stripline flexible cable to printed circuit board attachment system |
| 05/02/2000 | CA2118649C Interconnection structure of electronic parts |
| 04/27/2000 | WO2000024051A1 Method and device for producing shaped ceramic bodies using setter plates |
| 04/27/2000 | WO2000024005A1 Particles |
| 04/27/2000 | WO2000023844A1 Device and method for the optical inspection of concealed soldered connections |
| 04/27/2000 | WO2000010200A8 Wafer plating method and apparatus |
| 04/27/2000 | WO1999061500A9 Adhesive composition |
| 04/27/2000 | DE19949771A1 Flexible circuit board for head gimbal assembly of hard disk has a conductive tab electrically connected to a pre-amp pad and head pad |
| 04/27/2000 | DE19847946A1 Multilayer circuit board, with an integrated capacitor, comprises a first planar aluminum insert electrode bearing an aluminum oxide layer as an insulating interlayer |
| 04/27/2000 | DE19847521A1 Einrichtung zum Abstützen einer Schaltungsplatine Means for supporting a circuit board |
| 04/27/2000 | DE19843628A1 Verbindungssystem Connection system |
| 04/26/2000 | EP0996323A2 Surface mounting part |
| 04/26/2000 | EP0996322A2 Electronic circuit unit useful for portable telephones or the like, and a method of manufacturing the same |
| 04/26/2000 | EP0996321A2 Anisotropically electroconductive adhesive and adhesive film |
| 04/26/2000 | EP0996320A1 Double sided circuit board |
| 04/26/2000 | EP0996319A2 Composite material used in making printed wiring boards |
| 04/26/2000 | EP0996318A2 Novel composite foil, process for producing the same and copper-clad laminate |
| 04/26/2000 | EP0996317A1 Structure and method for mounting an electronic circuit unit to a printed board |
| 04/26/2000 | EP0996180A1 Button cell support with vertical positioning |
| 04/26/2000 | EP0996172A1 Chip type semiconductor light emitting device |
| 04/26/2000 | EP0995346A1 A heating method for a printed circuit board and a printed circuit board comprising a heating element |
| 04/26/2000 | EP0995235A1 Contact and method for producing a contact |
| 04/26/2000 | EP0995207A1 Surface mount multilayer capacitor |
| 04/26/2000 | EP0994778A1 Doctor blade for applying products with high degree of viscosity and thixotropic properties on a substrate varying in height, through a stencil, applied to said substrate |
| 04/26/2000 | EP0994777A1 Method and device for producing a metallic or ceramic body |
| 04/26/2000 | EP0843894A4 Encapsulant with fluxing properties and method of use |
| 04/26/2000 | CN1251734A Method of arraging signal and destination pads to provide multiple signal/destination connection |
| 04/26/2000 | CN1251685A Monolithic inductor and method of manufacturing same |
| 04/26/2000 | CN1251684A Through-hole interconnect device with isolated wire-leads and component barriers |
| 04/26/2000 | CN1251425A Combined testing system and testing method using same |
| 04/26/2000 | CN1251333A Novel composite foil and its mfg. method, and copper-coated laminated plate |
| 04/26/2000 | CN1051904C Fixing end structure of electronic unit |
| 04/26/2000 | CN1051881C Mfg. method for circuit module |
| 04/25/2000 | US6055160 High temperature oven electrical feed through |
| 04/25/2000 | US6055151 A capacitor ink comprising a dielectric selected from barium titanate, titanium oxide and lead-magnesium niobate, a low firing temperature glass including 2% or less barium oxide and an organic vehicle for screen printing of ink on the tape |
| 04/25/2000 | US6054975 Liquid crystal display device having tape carrier packages |
| 04/25/2000 | US6054762 Semiconductor substrates of high reliability ceramic metal composites |
| 04/25/2000 | US6054761 Multi-layer circuit substrates and electrical assemblies having conductive composition connectors |
| 04/25/2000 | US6054756 Connection components with frangible leads and bus |
| 04/25/2000 | US6054755 Semiconductor package with improved moisture vapor relief function and method of fabricating the same |
| 04/25/2000 | US6054749 Thin film device repaired using enhanced repair process |
| 04/25/2000 | US6054673 Method and apparatus for laser drilling |
| 04/25/2000 | US6054653 Apparatus for attaching a surface mount component |
| 04/25/2000 | US6054652 Thin-film multi-layer substrate and electronic device |
| 04/25/2000 | US6054545 Modified cellulose compound and photopolymerizable resin composition containing the same |
| 04/25/2000 | US6054509 Adhesive of epoxy resin, nitrile rubbers and curing agent |
| 04/25/2000 | US6054375 Method for making laser synthesized ceramic electronic devices and circuits |
| 04/25/2000 | US6054171 Forming film of organic or polymeric material on top portion of protruding electrode formed on pad and second film of polymeric material to bury base portion of protruding electrode; removing first film after second film is cured |
| 04/25/2000 | US6054061 Composition for circuit board manufacture |
| 04/25/2000 | US6054008 Process for adhesively attaching a temporary lid to a microelectronic package |
| 04/25/2000 | US6053746 Circuit board connecting apparatus |
| 04/25/2000 | US6053743 Clip for surface mount termination of a coaxial cable |
| 04/25/2000 | US6053405 Electronic verification machine for documents |
| 04/25/2000 | US6053398 Solder bump forming method, solder bump forming apparatus, head unit for use therein and soldering method using the head unit |
| 04/25/2000 | US6053397 Applying a resist or polymer film onto the support substrate as a mask layer, producing holes in mask layer by laser ablation over the copper pad, filling the holes with solder paste to a specific level, reflowing the solder to form bumps |
| 04/25/2000 | US6053395 Method of flip-chip bonding between a chip element and a wafer-board |