| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/25/2000 | US6053394 Column grid array substrate attachment with heat sink stress relief |
| 04/25/2000 | US6053084 System and method for cutting panels |
| 04/25/2000 | US6052895 Conforming press-fit contact pin for printed circuit board |
| 04/25/2000 | US6052893 Process for manufacturing a resin-encapsulated electronic product |
| 04/20/2000 | WO2000022899A1 Deposited thin build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates |
| 04/20/2000 | WO2000022898A1 Heating device and heating method |
| 04/20/2000 | WO2000022897A1 Plug-in module with installation guide and retention feature |
| 04/20/2000 | WO2000022896A1 Fabrication process for flex circuit applications |
| 04/20/2000 | WO2000022895A1 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
| 04/20/2000 | WO2000022894A1 Apparatus and system with increased signal trace routing options in printed wiring boards and integrated circuit packaging |
| 04/20/2000 | WO2000022893A1 Article having an embedded electronic device, and method of making same |
| 04/20/2000 | WO2000022883A1 Matrix-inductor soldering apparatus and soldering process |
| 04/20/2000 | WO2000022814A2 Image sensor mounted by mass reflow |
| 04/20/2000 | WO2000022674A1 Tape ball grid array with interconnected ground plane |
| 04/20/2000 | WO2000022667A1 Apparatus and method for filling a ball grid array |
| 04/20/2000 | WO2000022613A1 Head suspension with flexible circuit interconnect for reduced moisture permeability |
| 04/20/2000 | WO2000022443A1 Improving multi-chip module testability using poled-polymer interlayer dielectrics |
| 04/20/2000 | WO2000022193A2 Electrodeposition of metals in small recesses using modulated electric fields |
| 04/20/2000 | WO2000021904A1 Composite plate and method for producing and using such a composite plate |
| 04/20/2000 | WO2000021900A1 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric |
| 04/20/2000 | WO2000021899A1 Impregnated glass fiber strands and products including the same |
| 04/20/2000 | WO2000021659A1 Integrated multilayered microfluidic devices and methods for making the same |
| 04/20/2000 | WO2000004075A3 Heat curable epoxy compositions |
| 04/20/2000 | WO2000003845A3 Device for the automated machining of workpieces |
| 04/20/2000 | DE19916010C1 Heat conduction device for circuit board component heat sink has press-fit element inserted in opening in printed circuit board between circuit board component and heat sink mounted on opposite circuit board surfaces |
| 04/20/2000 | DE19853018C1 Chip card antenna coil manufacturing and mounting method has stamped out coil windings held together by residual bridging sections separated upon application of adhesive foil bridges |
| 04/20/2000 | DE19847922A1 System for coating thin plates, especially circuit boards, has plate delivery, removal, transfer arrangement for feed mechanisms with synchronously operated parallel carriages on guide paths |
| 04/20/2000 | DE19846638A1 Composite board, especially a mounting board for power electronic modules, comprises a ceramic board eutectic bonded directly to a silver sheet |
| 04/20/2000 | DE19845665A1 Verfahren zur Herstellung eines Trägerelements für einen IC-Baustein zum Einbau in Chipkarten A process for producing a carrier element for an IC module for installation in smart card |
| 04/20/2000 | DE19845041A1 Production of photostructured layers on planar substrates used in the manufacture of sensors comprises using a screen printed layer with an added wet chemical structured binder |
| 04/20/2000 | DE19840501C1 Electrical contact device for mounting microchip on printed circuit board, uses rubber mat with metallised openings receiving contacts of microchip at one side and contacting printed circuit board at opposite side |
| 04/20/2000 | DE19836456C1 Elektrische Leiterplatte und Verfahren zur Herstellung derselben Electrical wiring board and method for producing same |
| 04/20/2000 | DE19830628C1 Verfahren zum Verpressen von Mehrlagenleiterplatten (Multilayer) A method for compressing multi-layer printed circuit boards (multilayer) |
| 04/20/2000 | CA2346111A1 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric |
| 04/20/2000 | CA2346059A1 Integrated multilayered microfluidic devices and methods for making the same |
| 04/20/2000 | CA2346027A1 Impregnated glass fiber strands and products including the same |
| 04/20/2000 | CA2344826A1 Fabrication process for flex circuit applications |
| 04/20/2000 | CA2344663A1 Tape ball grid array with interconnected ground plane |
| 04/20/2000 | CA2314109A1 Electrodeposition of metals in small recesses using modulated electric fields |
| 04/19/2000 | EP0994641A1 Apparatus and method for mounting electronic component |
| 04/19/2000 | EP0994640A2 Method of making a circuit assembly |
| 04/19/2000 | EP0994508A1 Semiconductor device comprising bump contacts |
| 04/19/2000 | EP0994507A2 Flip chip metallization for an electronic assembly |
| 04/19/2000 | EP0994171A2 Light-blocking anisotropically electroconductive adhesive film, and liquid crystal display device |
| 04/19/2000 | EP0994140A1 Curable resin composition for coating flexible circuits |
| 04/19/2000 | EP0993948A1 Method and apparatus for cleaning screen used in screen printing machine |
| 04/19/2000 | EP0993885A1 Punching apparatus for stamping and method for producing the same |
| 04/19/2000 | EP0993677A1 Thermal release for fixing on a circuit substrate |
| 04/19/2000 | CN2375057Y IC card placing mechanism of prewelder |
| 04/19/2000 | CN2375056Y Automatic printing machine needle mould device for placing PC board |
| 04/19/2000 | CN1251219A Cantact device,and tool for handling it |
| 04/19/2000 | CN1251142A Method and apparatus for mfg. thin film, thin film laminate, and electronic parts |
| 04/19/2000 | CN1251016A Method for checking soft printing circuit |
| 04/19/2000 | CN1250938A Sheet like variable resistor and method for making same |
| 04/19/2000 | CN1051670C Method for mfg. laminar stackable circuit board structure |
| 04/19/2000 | CN1051669C Circuit board having non-annular welding zone |
| 04/19/2000 | CN1051668C Circuit board with capacitor, and mfg. method therefor |
| 04/18/2000 | US6052286 Restrained center core anisotropically conductive adhesive |
| 04/18/2000 | US6052171 Liquid crystal display with electrically connected integrated circuits and opposite voltage line between input and output wirings |
| 04/18/2000 | US6051978 TDR tester for x-y prober |
| 04/18/2000 | US6051448 Method of manufacturing an electronic component |
| 04/18/2000 | US6051171 Method for controlling firing shrinkage of ceramic green body |
| 04/18/2000 | US6051150 Plasma etching method and method of manufacturing liquid crystal display panel |
| 04/18/2000 | US6051093 Mounting method of semiconductor element |
| 04/18/2000 | US6050832 Chip and board stress relief interposer |
| 04/18/2000 | US6050830 Tape carrier package for liquid crystal display |
| 04/18/2000 | US6050758 Automated chamfering apparatus |
| 04/18/2000 | US6050481 Method of making a high melting point solder ball coated with a low melting point solder |
| 04/18/2000 | US6050480 Solder paste for chip components |
| 04/18/2000 | US6050479 Defluxing agent cleaning method and cleaning apparatus |
| 04/18/2000 | US6049977 Method of forming electrically conductive pillars |
| 04/18/2000 | US6049976 Method of mounting free-standing resilient electrical contact structures to electronic components |
| 04/18/2000 | CA2000382C High density and high signal integrity connector |
| 04/14/2000 | CA2286231A1 Method for soldering dpak-type electronic components to circuit boards |
| 04/13/2000 | WO2000021347A1 Manufacturing method of circuit board, manufacturing apparatus for it, and porous sheet used in it |
| 04/13/2000 | WO2000021345A1 Manufacturing method of wiring circuit board, and wiring circuit board |
| 04/13/2000 | WO2000021344A1 Printed board assembly and method of its manufacture |
| 04/13/2000 | WO2000021126A1 Semiconductor copper bond pad surface protection |
| 04/13/2000 | WO2000021102A1 Capacitance-coupled high dielectric constant embedded capacitors |
| 04/13/2000 | WO2000021101A2 Large value buried inductors in low temperature co-fired ceramic circuit boards |
| 04/13/2000 | WO2000021027A1 Method for producing a supporting element for an integrated circuit module for placement in chip cards |
| 04/13/2000 | WO2000020223A1 Method for manufacture of electronic parts |
| 04/13/2000 | WO2000020222A1 Method for manufacture of electronic parts |
| 04/13/2000 | WO2000020214A1 Electrically conductive adhesive transfers |
| 04/13/2000 | WO2000020161A1 Unleaded solder powder and production method therefor |
| 04/13/2000 | WO2000020154A1 Method and apparatus for placing solder balls on a substrate |
| 04/13/2000 | DE19948059A1 Composition for preparing insulating materials used as raw materials for build-up print circuit boards, includes epoxy resin, curing agent and poly(ether sulfone) |
| 04/13/2000 | DE19845901A1 Surface mounted pin socket based on capillary action for printed circuit board, has flat substrate with through contacted holes causing capillary effect on molten solder to pull it through substrate |
| 04/13/2000 | DE19842590A1 Verfahren zur Herstellung von Schaltungsanordnungen A process for producing circuit arrangements |
| 04/13/2000 | DE19833131A1 Contacting electronic components on flexible substrates involves using substrate and other part elasticity and causing elastic deformation by contact force generating or introducing elements |
| 04/13/2000 | CA2346041A1 Large value buried inductors in low temperature co-fired ceramic circuit boards |
| 04/12/2000 | EP0993242A1 Method of producing ceramic multilayer substrate |
| 04/12/2000 | EP0993241A1 Copper coating |
| 04/12/2000 | EP0993240A1 Circuit board and connection method |
| 04/12/2000 | EP0993039A1 Substrate for mounting semiconductor chips |
| 04/12/2000 | EP0993034A2 Method for bonding bumped electronic components to a substrate |
| 04/12/2000 | EP0992940A2 Process for manufacturing IC card |
| 04/12/2000 | EP0992846A1 Use of an ink jet image as prepress intermediate |
| 04/12/2000 | EP0992617A2 Apparatus for treating objects, especially electroplating apparatus for printed circuit boards |
| 04/12/2000 | EP0992616A2 Apparatus for treating objects, especially electroplating apparatus for printed circuit boards |