| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/06/2000 | US6070788 Method of soldering terminal faces, as well as a method of manufacturing a solder alloy |
| 06/06/2000 | US6070785 Process for manufacturing boards that can accept a pluggable tab module that can be attached or removed without solder |
| 06/06/2000 | US6070783 Conductive ball attaching apparatus and method |
| 06/06/2000 | US6070782 Socketable bump grid array shaped-solder on copper spheres |
| 06/06/2000 | US6070779 Liquid dosing device |
| 06/06/2000 | US6070322 Method for making a printed circuit board |
| 06/06/2000 | US6070321 Solder disc connection |
| 06/06/2000 | CA2193012C Surface acoustic wave apparatus |
| 06/02/2000 | WO2000032021A1 Printed circuit assembly having locally enhanced wiring density |
| 06/02/2000 | WO2000032020A1 Edge connectors for printed circuit boards comprising conductive ink |
| 06/02/2000 | WO2000032019A1 Depaneling system having multiple router stations |
| 06/02/2000 | WO2000031844A1 Secondary electric power distribution cabinet in an aeroplane |
| 06/02/2000 | WO2000031832A1 High density electrical connector |
| 06/02/2000 | WO2000031797A2 Device for electronic packaging, pin jig fixture |
| 06/02/2000 | WO2000031591A1 Method of forming conductive pattern |
| 06/02/2000 | WO2000031318A1 Electroless silver plating solution for electronic parts |
| 06/02/2000 | WO2000030988A1 Aqueous cleaning |
| 06/02/2000 | WO2000020154A9 Method and apparatus for placing solder balls on a substrate |
| 06/02/2000 | WO2000003436A3 Low cost high power hermetic package with electrical feed-through bushings |
| 06/02/2000 | CA2352240A1 Aqueous cleaning |
| 06/02/2000 | CA2351421A1 Printed circuit assembly having locally enhanced wiring density |
| 06/02/2000 | CA2322683A1 Device for electronic packaging, pin jig fixture |
| 05/31/2000 | EP1005261A1 Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board |
| 05/31/2000 | EP1005260A2 Formation of thin film capacitors |
| 05/31/2000 | EP1005088A1 Sintered body for and manufacture of ceramic substrates |
| 05/31/2000 | EP1005086A2 Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate |
| 05/31/2000 | EP1005085A2 Resin-encapsulated electronic device |
| 05/31/2000 | EP1005084A1 Leaded semiconductor device package for use in nonsoldering assembling |
| 05/31/2000 | EP1005073A1 Method of forming dielectric thin film pattern and method of forming laminate pattern comprising dielectric thin film and conductive thin film |
| 05/31/2000 | EP1005066A2 Resist pattern, process for the information of the same, and process for the formation of wiring pattern |
| 05/31/2000 | EP1005065A2 Method of forming wiring pattern |
| 05/31/2000 | EP1004227A1 Intermediate layer to improve peel strength of copper foils |
| 05/31/2000 | EP1004226A1 Method and device for producing wire-written printed circuit boards |
| 05/31/2000 | EP1004141A1 A system and method for packaging integrated circuits |
| 05/31/2000 | EP1004126A1 Electrical component, specially a chip inductive resistor |
| 05/31/2000 | EP1004027A1 Magnetic current sensing and short circuit detection in plate structure |
| 05/31/2000 | EP1003645A1 Method of making masks and electronic parts |
| 05/31/2000 | EP0885315B1 Misted precursor deposition apparatus and method with improved mist and mist flow |
| 05/31/2000 | EP0879304B1 Production of bevelled galvanic structures |
| 05/31/2000 | DE19958029A1 Burn-in circuit board for burn-in testing of electronic apparatus, provides heat sink load for device under test (DUT) |
| 05/31/2000 | DE19957326A1 Contact structures, especially for wafer or chip testing pin cards, are produced by a two-dimensional photolithographic process on a silicon substrate |
| 05/31/2000 | DE19952246A1 Electromechanical component includes covering and support layers composed of inflammable plastic material |
| 05/31/2000 | CN1255087A Very ultra thin conductor layers for printed wiring boards |
| 05/31/2000 | CN1255039A Method for connection between electronic elements and circuit board and its finished products |
| 05/31/2000 | CN1255038A Composite for making printed substrate |
| 05/31/2000 | CN1254952A 电子器件 Electronic devices |
| 05/31/2000 | CN1254945A Method for forming wiring pattern |
| 05/31/2000 | CN1254944A Photoresist pattern, technology for forming photoresist pattern and technology for forming wiring pattern |
| 05/31/2000 | CN1254934A Formation of thin-film capacitor |
| 05/31/2000 | CN1254744A Electrically conducting adhesive, structural body for installation, LCD, electronic device and making method |
| 05/31/2000 | CN1254710A Polybenzoxazole resin and precursor thereof |
| 05/31/2000 | CN1053081C Method for producing multi-layer printing circuit board |
| 05/30/2000 | US6069847 Timer |
| 05/30/2000 | US6069482 Ball grid array package emulator |
| 05/30/2000 | US6069444 Electroluminescent lamp devices and their manufacture |
| 05/30/2000 | US6069407 BGA package using PCB and tape in a die-up configuration |
| 05/30/2000 | US6069402 Card with a built-in electronic part |
| 05/30/2000 | US6069323 Pad with indentations surface mount |
| 05/30/2000 | US6069322 Universal fixture for holding printed circuit boards during processing |
| 05/30/2000 | US6069029 Semiconductor device chip on lead and lead on chip manufacturing |
| 05/30/2000 | US6068947 Thin-profile battery circuits and constructions and button-type battery circuits and constructions |
| 05/30/2000 | US6068912 Platible non-metallic filler material for metallurgical screening paste |
| 05/30/2000 | US6068782 Individual embedded capacitors for laminated printed circuit boards |
| 05/30/2000 | US6068669 Compliant interconnect for testing a semiconductor die |
| 05/30/2000 | US6068235 Microphone connector assembly and method |
| 05/30/2000 | US6068202 Spraying and dispensing apparatus |
| 05/30/2000 | US6068175 System for replacing a first area array component connected to an interconnect board |
| 05/30/2000 | US6067903 Apparatus for supporting and tensioning a stencil |
| 05/30/2000 | US6067843 Measuring sensor |
| 05/25/2000 | WO2000030420A1 Method of manufacturing multilayer wiring boards |
| 05/25/2000 | WO2000030419A1 Method of manufacturing wiring boards |
| 05/25/2000 | WO2000030418A1 Carbon coating method for electromagnetic shielding of electronic circuit boards to provide electromagnetic compatibility |
| 05/25/2000 | WO2000030206A1 Adapters for rf connectors |
| 05/25/2000 | WO2000030171A1 Low alpha emissive solder bumps |
| 05/25/2000 | WO2000029638A1 Electroless silver plating solution for electronic parts |
| 05/25/2000 | DE3914462C2 Verfahren zur Montage von elektronischen Bauelementen auf einer Leiterplatte A method of mounting electronic components on a printed circuit board |
| 05/25/2000 | DE19950562A1 Chip-type electronic component manufacturing method for filter, involves activating irradiation portion of film, which is then precipitated by immersing substrate in non-electrolytic bath |
| 05/25/2000 | DE19853805A1 Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie Electrically conductive, thermoplastic and heat-activatable adhesive film |
| 05/25/2000 | DE19853777A1 Heat sink element for printed circuit board electronic component provided by metallic plate with pins along at least one side edge fitting through holes in surface of printed circuit board |
| 05/25/2000 | DE19852832A1 Production of e.g. multilayer metal plastic laminate forming lead frame, includes stamping processes raising contact surfaces and adhesive dams, advancing miniaturization by replacement of ball grid arrays |
| 05/25/2000 | CA2290306A1 Method of forming wiring pattern |
| 05/24/2000 | EP1003358A2 Process for connecting a component and circuit assembly |
| 05/24/2000 | EP1003216A2 Multilayered ceramic structure |
| 05/24/2000 | EP1003211A2 Multilayer ceramic structure |
| 05/24/2000 | EP1002844A2 Electroconductive, thermoplastic and heat-activatable adhesive film |
| 05/24/2000 | EP1002638A2 Method of manufacturing a flexible circuit board |
| 05/24/2000 | EP1002612A1 Kinetically controlled solder bonding |
| 05/24/2000 | EP1002611A1 Solder ball connections and assembly process |
| 05/24/2000 | EP1002610A1 Solder ball connections and assembly process |
| 05/24/2000 | EP1002452A1 Contact arrangement linking two substrates and method for the production of said contact arrangement |
| 05/24/2000 | EP1002451A1 Circuit board mount |
| 05/24/2000 | EP1002322A1 Chemical compounds made of intrinsically conductive polymers and metals |
| 05/24/2000 | EP1001852A1 Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
| 05/24/2000 | EP0918610B1 Circuit-carrying automotive component and method of manufacturing the same |
| 05/24/2000 | EP0852896A4 Method and circuit board panel for preventing assembly-line delamination and sagging for circuit board manufacturing |
| 05/24/2000 | EP0729656B1 Shunt connector |
| 05/24/2000 | EP0715773B1 Cross-connect system |
| 05/24/2000 | EP0612463B2 Device for formation of a film on the walls of holes in printed circuit boards |
| 05/24/2000 | CN2379993Y Tin soldering machine |
| 05/24/2000 | CN2379226Y Miniature printing circuit brushing machine |