| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 12/15/1999 | EP0964610A2 Printed wiring board and process for forming it |
| 12/15/1999 | EP0964609A1 Anti-bridging solder ball collection zones |
| 12/15/1999 | EP0964608A2 Method for laser soldering |
| 12/15/1999 | EP0964607A1 Solder resist window configurations for solder paste overprinting |
| 12/15/1999 | EP0964606A2 Interconnection between at least two circuit boards |
| 12/15/1999 | EP0964605A2 Low-thermal expansion circuit board and multilayer circuit board |
| 12/15/1999 | EP0964496A1 Electric connection box |
| 12/15/1999 | EP0964446A2 An electronic circuit assembly |
| 12/15/1999 | EP0964442A1 Ball arranging substrate for forming bump, ball arranging head, ball arranging device, and ball arranging method |
| 12/15/1999 | EP0963687A1 Coating device for coating solder resist on both sides of a printed circuit board |
| 12/15/1999 | EP0963290A1 High temperature release films |
| 12/15/1999 | EP0847314B1 Method of manufacturing a sintered structure on a substrate |
| 12/15/1999 | EP0799329B1 Conveyor device for vertically guiding plate-like objects for chemical or electrolytic surface-treatment |
| 12/15/1999 | CN1238899A Method for adding layers to PWB which yields high levels of copper to dielectric adhesion |
| 12/15/1999 | CN1238856A Chip module and manufacturing process thereof |
| 12/15/1999 | CN1238830A Method for production of conducting element and conducting element |
| 12/15/1999 | CN1238660A Method of forming lands on the surface of the circuit board |
| 12/15/1999 | CN1238659A Method and apparatus for spraying tin on circuit board |
| 12/15/1999 | CN1238576A Printed circuit card with minor surface I/O pads |
| 12/15/1999 | CN1238394A Process of controlling grain growth in metal films |
| 12/15/1999 | CN1047474C Electrically connecting structure |
| 12/15/1999 | CN1047411C Electrodeposited copper foil and process for making same |
| 12/14/1999 | USRE36446 Providing electrically insulating substrate; mounting a device having termainals on individual land areas; electrically connecting terminals; depositing curable layer of insulative material; curing; dividing into modular components |
| 12/14/1999 | US6002860 High frequency noise and impedance matched integrated circuits |
| 12/14/1999 | US6002595 Cable-to-board assemblies |
| 12/14/1999 | US6002594 Flexible touchpad circuit with mounted circuit board |
| 12/14/1999 | US6002590 Flexible trace surface circuit board and method for making flexible trace surface circuit board |
| 12/14/1999 | US6002589 Integrated circuit package for coupling to a printed circuit board |
| 12/14/1999 | US6002569 Electrostatic discharge protection apparatus |
| 12/14/1999 | US6002264 Interconnect adapter to printed circuit assembly for testing in an operational environment |
| 12/14/1999 | US6002180 Multi chip module with conductive adhesive layer |
| 12/14/1999 | US6002172 Substrate structure and method for improving attachment reliability of semiconductor chips and modules |
| 12/14/1999 | US6002168 Microelectronic component with rigid interposer |
| 12/14/1999 | US6001950 Heating glyoxal at a temperature of about 80-100 degrees c with a molar excess of a phenol in the presence of an acidic catalyst which is eliminated from the reaction mixture |
| 12/14/1999 | US6001537 Method of forming a layer having a high precision pattern and layer |
| 12/14/1999 | US6001493 First and second pattern of bumps (solder balls) arranged so during a transfer process, only the first pattern bumps are transferred to pad extensions of device; second bumps can be transferred to another device; use in making electronics |
| 12/14/1999 | US6001489 Flexible printed circuit and process for producing the same |
| 12/14/1999 | US6000951 Electrical ribbon wire connectors |
| 12/14/1999 | US6000886 Entry board for drilling small holes, a method of making the same and a method for drilling small holes through a printed circuit board by using said entry board |
| 12/14/1999 | US6000603 Patterned array of metal balls and methods of making |
| 12/14/1999 | US6000597 Molten solder dispensing system |
| 12/14/1999 | US6000130 Process for making planar redistribution structure |
| 12/14/1999 | US6000129 Process for manufacturing a circuit with filled holes |
| 12/14/1999 | US6000127 Electronic parts mounting method |
| 12/14/1999 | US6000126 Method and apparatus for connecting area grid arrays to printed wire board |
| 12/14/1999 | US6000124 Method and apparatus for manufacturing multilayer printed circuit board |
| 12/14/1999 | US6000120 Method of making coaxial transmission lines on a printed circuit board |
| 12/14/1999 | CA2189539C Stencil for depositing and portioning variously thick spot layers of a viscous material |
| 12/14/1999 | CA2154409C Connecting member and a connecting method using the same |
| 12/12/1999 | CA2274339A1 Method for laser soldering |
| 12/09/1999 | WO1999063795A1 Method for producing wirings having solder bumps |
| 12/09/1999 | WO1999063794A1 A method of mounting a semiconductor die on a printed circuit board |
| 12/09/1999 | WO1999063793A1 Apparatus and method for drilling microvia holes in electrical circuit interconnection packages |
| 12/09/1999 | WO1999063627A1 Double adherent electrically conductive tape |
| 12/09/1999 | WO1999063589A1 Pad grid array and a method for producing such a pad grid array |
| 12/09/1999 | WO1999063588A1 Method for remelting solder layers |
| 12/09/1999 | WO1999063557A1 Printed annular coil and method of manufacture thereof |
| 12/09/1999 | WO1999063554A1 Transformer bobbin |
| 12/09/1999 | WO1999063553A1 Thick film resistor compositions for making heat-transfer tapes and use thereof |
| 12/09/1999 | WO1999063552A1 Rigid/flex printed circuit board and manufacturing method therefor |
| 12/09/1999 | WO1999046965A3 Integrated circuit connection using an electrically conductive adhesive |
| 12/09/1999 | WO1999030376A3 Battery-included pcb |
| 12/09/1999 | DE19922161A1 Anti-adhesion coating for e.g. soldering/welding tools and electric contacts |
| 12/09/1999 | DE19921121A1 Electrophotographic apparatus for forming circuit structure on ceramic green layer |
| 12/09/1999 | DE19921109A1 Elektronikbauteil Electronic component |
| 12/09/1999 | DE19842080A1 Carrier disk manufacture for semiconductor chip |
| 12/09/1999 | DE19825451A1 Keramischer Träger mit einer elektrischen Schaltung und mit einer Anschlußvorrichtung Ceramic substrate with an electrical circuit and with a connecting device |
| 12/09/1999 | DE19822470A1 Flat molded part for securing electronic components, e.g. flip-chips and ball grid arrays to carriers |
| 12/08/1999 | EP0963143A1 Ceramic substrate with electrical circuit and with connecting means |
| 12/08/1999 | EP0963142A2 Assembly having a back plate with inserts |
| 12/08/1999 | EP0963021A1 Bus bar wiring board and method of producing the same |
| 12/08/1999 | EP0962977A2 Electrically conductive paste and ceramic multi-layered substrate |
| 12/08/1999 | EP0962969A2 Method for forming bumps |
| 12/08/1999 | EP0962962A2 Patterning technique using a template, and a ink jet system |
| 12/08/1999 | EP0962827A2 Photoimageable composition having improved photoinitiator system |
| 12/08/1999 | EP0962580A1 Screen-like plated article comprising mesh-like fabric using sheath-core composite filaments and cylinder for rotary screen |
| 12/08/1999 | EP0961809A1 Low temperature method and compositions for producing electrical conductors |
| 12/08/1999 | EP0851902B1 Method for coating |
| 12/08/1999 | CN2353111Y Rotary disc and combination type machine for soldering circuit plate |
| 12/08/1999 | CN2353110Y Spraying machine |
| 12/08/1999 | CN2352341Y Screen printer |
| 12/08/1999 | CN1237927A Inverted stamping process |
| 12/08/1999 | CN1237874A Soldering apparatus, and agent and method for separating solder and solder oxides |
| 12/08/1999 | CN1237873A Method for producing vias in manufacture of printed wiring boards |
| 12/08/1999 | CN1237809A Add-on electrical assembly with light transmission means |
| 12/08/1999 | CN1237802A Battery holder |
| 12/08/1999 | CN1237791A 半导体器件 Semiconductor devices |
| 12/08/1999 | CN1237720A Photoimageable composition having improved photoinitiator system |
| 12/08/1999 | CN1237713A Method for removing micro short circuit and its apparatus |
| 12/08/1999 | CN1237547A Borate glass based ceramic tape |
| 12/08/1999 | CN1237508A Resin-coated composite foil, production thereof, and productions of multilayer copper-clad laminate and multilayer printed wiring board using resin-coated composite foil |
| 12/08/1999 | CN1237489A Rolled copper foil and method of manufacturing the same |
| 12/08/1999 | CA2273754A1 Enhanced mounting pads for printed circuit boards |
| 12/08/1999 | CA2273752A1 Anti-bridging solder ball collection zones |
| 12/08/1999 | CA2273662A1 Solder resist window configurations for solder paste overprinting |
| 12/07/1999 | US5999414 Physically separating printed circuit boards with a resilient, conductive contact |
| 12/07/1999 | US5999413 Resin sealing type semiconductor device |
| 12/07/1999 | US5999412 Printed-circuit board and method for the precise assembly and soldering of electronic components on the surface of the printed-circuit board |
| 12/07/1999 | US5999408 Enhanced heat transfer in printed circuit boards |
| 12/07/1999 | US5999006 Method of and apparatus for conducting analysis of buried oxides |