| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 12/29/1999 | EP0966759A2 Thin-film component comprising a substrate with an elastic coating |
| 12/29/1999 | EP0966557A1 Circuitry and method for an electroplating plant or etching plant pulse power supply |
| 12/29/1999 | EP0932941A4 Slotline-mounted flip chip structures |
| 12/29/1999 | EP0746638B1 Surface treatment of an object |
| 12/29/1999 | CN1239863A Low-expansion circuit board and multilayer circuit board |
| 12/29/1999 | CN1239829A Method and apparatus for retention of fragile conductive trace with protective clamp |
| 12/29/1999 | CN1047870C Process and device for chemically treating substrates |
| 12/29/1999 | CA2335501A1 Method for coating printed circuit boards or similar substrates |
| 12/28/1999 | US6009327 Hand-off method in a personal communication service system |
| 12/28/1999 | US6008982 Low profile electrical distribution center and method of making a bus subassembly therefor |
| 12/28/1999 | US6008538 Method and apparatus providing redundancy for fabricating highly reliable memory modules |
| 12/28/1999 | US6008071 Method of forming solder bumps onto an integrated circuit device |
| 12/28/1999 | US6007886 Multilayered substrate and method for its production |
| 12/28/1999 | US6007867 Printing and drying layer of conductor paste to form dried, un-fired conductor trace; printing and drying feature definition layer of dielectric paste that is co-firable with conductor paste; co-firing dielectric and conductor pastes |
| 12/28/1999 | US6007866 Swelling, treating with alkaline permanganate, rinsing with water and acidic aqueous solution and water, neutralizing manganese dioxide layer with alkaline solution, rinsing with water and ethylene-3,4-dioxythiophene, acid, then coppering |
| 12/28/1999 | US6007758 Using conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent, firing of the substrate onto which the ink has been coated, and plating of copper thereon |
| 12/28/1999 | US6007743 Nickel powder and process for preparing the same |
| 12/28/1999 | US6007669 Layer to layer interconnect |
| 12/28/1999 | US6007668 Tape automated bonding (tab) formed by bonding a conductor metal foil onto an adhesive layer on a metal plate; coating the metal plate with a protective plating inert to the etchant and etching the foil; hermetic sealing |
| 12/28/1999 | US6007652 Forming a first metal layer on a film by vapor deposition for transferability; forming a second metal layer above by wet plating for its electrical properties; patterning; laminating a ceramic slurry on the pattern and peeling |
| 12/28/1999 | US6007490 Ultrasonic probe with disconnectable transducer |
| 12/28/1999 | US6007376 Circuit board electrical connector |
| 12/28/1999 | US6007357 Chip socket assembly and chip file assembly for semiconductor chips |
| 12/28/1999 | US6007349 Flexible contact post and post socket and associated methods therefor |
| 12/28/1999 | US6007348 Solder ball terminal |
| 12/28/1999 | US6007347 Coaxial cable to microstrip connection and method |
| 12/28/1999 | US6007185 Recording head, head cartridge and recording apparatus with flexible substrate coupling |
| 12/28/1999 | US6006636 Programmable punch mechanism |
| 12/28/1999 | US6006428 Polytetrafluoroethylene thin film chip carrier |
| 12/28/1999 | CA2018988C Photoresist |
| 12/23/1999 | WO1999066770A1 A flat flexible printed circuit conformable to a contoured surface |
| 12/23/1999 | WO1999066599A1 Solder ball terminal |
| 12/23/1999 | WO1999066555A1 Method for determining the desired decoupling components for power distribution systems |
| 12/23/1999 | WO1999066554A1 System and method for determining the desired decoupling components for power distribution systems using a computer system |
| 12/23/1999 | WO1999066518A1 Electric component |
| 12/23/1999 | WO1999065640A1 Method for encapsulating solder metal powders and solder metal powders produced according to this method |
| 12/23/1999 | WO1999065639A1 Laser drilling of holes in materials |
| 12/23/1999 | DE19926701A1 Contact plug for testing semiconductor disc of encased LSI component or printed circuit board for component to be tested |
| 12/23/1999 | DE19924239A1 Method to produce contact point on conductor, for electrical contacting to electric part |
| 12/23/1999 | DE19827529A1 Einrichtung zur Behandlung von Gegenständen, insbesondere Leiterplatten Device for treating objects, in particular printed circuit boards |
| 12/23/1999 | DE19827414A1 Verfahren zum Herstellen eines Metall-Keramik-Substrates A method for producing a metal-ceramic substrate |
| 12/22/1999 | EP0966187A2 Multilayer circuit assembly having surface mounted components on both sides |
| 12/22/1999 | EP0966186A2 Process for manufacturing a metal-ceramic substrate |
| 12/22/1999 | EP0966185A1 Printed wiring board and method of manufacturing the same |
| 12/22/1999 | EP0966032A2 Mounting a semiconductor chip into a circuit board |
| 12/22/1999 | EP0965997A1 Via-filling conductive paste composition |
| 12/22/1999 | EP0965846A2 Integrated circuit test socket |
| 12/22/1999 | EP0965656A1 Method for selective activation and metallisation of materials |
| 12/22/1999 | EP0947124A4 A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion |
| 12/22/1999 | EP0931366A4 Low profile connector |
| 12/22/1999 | EP0897654B1 Process for establishing electrically conducting connections between two or more conductor structures |
| 12/22/1999 | CN1239565A Portable electronic device |
| 12/22/1999 | CN1239397A 电子电路组件 Electronic circuit assembly |
| 12/22/1999 | CA2273537A1 Portable electric desoldering tool |
| 12/21/1999 | US6005777 Ball grid array capacitor |
| 12/21/1999 | US6005776 Vertical connector based packaging solution for integrated circuits |
| 12/21/1999 | US6005773 Board-mountable power supply module |
| 12/21/1999 | US6005766 Multi-layered printed circuit board and its manufacturing method |
| 12/21/1999 | US6005467 Trimmable inductor |
| 12/21/1999 | US6005463 Through-hole interconnect device with isolated wire-leads and component barriers |
| 12/21/1999 | US6005399 Solder paste and residue measurement system |
| 12/21/1999 | US6005292 Lead-free interconnection for electronic devices |
| 12/21/1999 | US6005289 Package for semiconductor device laminated printed circuit boards |
| 12/21/1999 | US6005224 Method of soldering components to at least one carrier |
| 12/21/1999 | US6005198 Wiring board constructions and methods of making same |
| 12/21/1999 | US6005197 Embedded thin film passive components |
| 12/21/1999 | US6004833 Method for constructing a leadless array package |
| 12/21/1999 | US6004734 Circuit board substrate for use in fabricating a circuit board on which is formed a light sensitive emulsion layer covering and in direct contact with photoresist |
| 12/21/1999 | US6004679 Laminates containing addition-curable silicone adhesive compositions |
| 12/21/1999 | US6004657 Laminated electronic part |
| 12/21/1999 | US6004633 Microstructured dies made of non-conductive resins. |
| 12/21/1999 | US6004619 Production of dense structures using few process steps and without additional abrasion steps, laser ablation on a substrate of insulating material in accordance with a desired pattern. |
| 12/21/1999 | US6004139 Memory module interface card adapter |
| 12/21/1999 | US6003757 Apparatus for transferring solder bumps and method of using |
| 12/21/1999 | US6003753 Air-blow solder ball loading system for micro ball grid arrays |
| 12/21/1999 | US6003418 Punched slug removal system |
| 12/21/1999 | US6003225 Fabrication of aluminum-backed printed wiring boards with plated holes therein |
| 12/21/1999 | US6003221 Metal matrix composites containing electrical insulators |
| 12/21/1999 | CA2156466C Solder paste and method for producing |
| 12/21/1999 | CA2155257C Low inductance surface-mount connectors for interconnecting circuit devices and method for using same |
| 12/21/1999 | CA2142943C Method of depositing solid substance on a substrate |
| 12/16/1999 | WO1999065282A1 Ic stack utilizing flexible circuits with bga contacts |
| 12/16/1999 | WO1999065089A1 Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer |
| 12/16/1999 | WO1999064527A1 Composition and method for polishing in metal cmp |
| 12/16/1999 | WO1999064199A1 Solder powder, flux, solder paste, method for soldering, soldered circuit board and soldered junction product |
| 12/16/1999 | WO1999064195A2 Curved ceramic moulded part |
| 12/16/1999 | WO1999064167A1 Device and method for jetting droplets |
| 12/16/1999 | WO1999054525A3 Method for producing metallized substrate materials |
| 12/16/1999 | WO1997034320A9 Method and apparatus for fabricating silicon dioxide and silicon glass layers in integrated circuits |
| 12/16/1999 | DE19926117A1 Liquid etchant useful for roughening copper, especially in laminated circuit board production |
| 12/16/1999 | DE19925670A1 Electronic ceramic component manufacturing method, such as for laminated capacitor, inductor or LC filter |
| 12/16/1999 | DE19904258A1 Ball grid array semiconductor device e.g. for mobile telephone or personal computer |
| 12/16/1999 | DE19826189A1 Integrated capacitor for laminated circuits |
| 12/16/1999 | DE19826023A1 Multi-layer electric circuit device with surface mounted devices |
| 12/16/1999 | DE19825836A1 Thick-film heating conductor application method for hot water tank |
| 12/16/1999 | DE19825724A1 Electric circuit has high component density and can be produced without fixing arrangements for components to be contacted, cost-effectively and with small number of process steps |
| 12/16/1999 | DE19825684A1 Method of connecting electronic components |
| 12/16/1999 | DE19825666A1 Kontaktierung zwischen wenigstens zwei Leiterplatten Contact between at least two printed circuit boards |
| 12/16/1999 | DE19810809C1 Flexible conducting film production |
| 12/16/1999 | CA2299319A1 Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer |