| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/24/2000 | CN1254493A Method of attaching metallic objects to printed circuit board |
| 05/24/2000 | CN1254252A Series-connected circuit board and its manufacture method |
| 05/24/2000 | CN1254251A Rolled copper foil as base plate for making flexible printed circuit board and its production method |
| 05/24/2000 | CN1254105A 液晶显示器 LCD Monitor |
| 05/24/2000 | CN1254104A Display unit installation and connection device |
| 05/24/2000 | CN1253977A Resin composite for coating external layer of flexible circuit |
| 05/24/2000 | CN1253970A Thermosetting resin composite for assembling process |
| 05/24/2000 | CN1253961A Polybenzoxazole resin and its precursor |
| 05/23/2000 | US6067002 Circuit substrate with a built-in coil |
| 05/23/2000 | US6066957 Floating spring probe wireless test fixture |
| 05/23/2000 | US6066909 Method and system for providing a spherical bearing in a thin film motor |
| 05/23/2000 | US6066889 Methods of selectively filling apertures |
| 05/23/2000 | US6066808 Multilayer circuit board having metallized patterns formed flush with a top surface thereof |
| 05/23/2000 | US6066551 Method for forming bump of semiconductor device |
| 05/23/2000 | US6066402 High temperature electronics assembly using lead-antimony-tin alloys |
| 05/23/2000 | US6066386 Printed circuit board with cavity for circuitization |
| 05/23/2000 | US6066231 Laminating device for joining a metal strip and an insulating material strip |
| 05/23/2000 | US6066219 One layer of aluminum nitride ceramic, in which one auxiliary or intermediate layer of aluminum oxide is applied to at least one side of this layer. |
| 05/23/2000 | US6066206 Dual track stenciling system with solder gathering head |
| 05/23/2000 | US6066197 Coatings and methods, especially for circuit boards |
| 05/23/2000 | US6065977 Device for connecting circuit boards to each other |
| 05/23/2000 | US6065398 Screen printing method and apparatus |
| 05/23/2000 | US6065201 Method of transferring conductive balls onto work piece |
| 05/23/2000 | CA2202084C Printing squeegee apparatus |
| 05/23/2000 | CA2103207C Method of and apparatus for cover sheet removal from laminated boards |
| 05/19/2000 | CA2288458A1 Resist pattern, process for the information of the same, and process forthe formation of wiring pattern |
| 05/18/2000 | WO2000028798A1 Method of manufacturing an interlayer via and a laminate precursor useful for same |
| 05/18/2000 | WO2000028627A1 Electric components for printed boards and method for automatically inserting said components in printed boards |
| 05/18/2000 | WO2000028552A1 Method and apparatus for photosensitized ultraviolet decontamination of surfaces and aerosol clouds |
| 05/18/2000 | WO2000028385A2 Method and device for aligning two photo masks with each other and optionally, an unexposed printed circuit board blank, and for subsequent simultaneous exposure in the production of double-sided printed circuit boards |
| 05/18/2000 | WO2000028367A1 Device for thermally, stably supporting a miniaturised component |
| 05/18/2000 | WO2000028362A1 Electro-optic module and method for the production thereof |
| 05/18/2000 | WO2000028115A1 Plating method and apparatus |
| 05/18/2000 | WO2000027685A1 Improvements relating to power steering |
| 05/18/2000 | WO2000027641A1 Method of manufacturing printed-circuit board, method of manufacturing recording device, and mask for printed-circuit board |
| 05/18/2000 | WO2000007222A3 Method for forming low-impedance high-density deposited-on-laminate structures having reduced stress |
| 05/18/2000 | WO2000005936A8 Hybrid solder ball and pin grid array circuit board interconnect system and method |
| 05/18/2000 | DE19954375A1 Rolled copper foil, especially for flexible printed circuits, consists of tough-pitch copper containing silver and having a specified softening temperature |
| 05/18/2000 | DE19854036A1 Applying pasty media e.g. adhesive, solder paste, conductive glue etc. to circuit board by transmitting vibration from squeegee to pasty medium |
| 05/18/2000 | CA2350075A1 Method of manufacturing an interlayer via and a laminate precursor useful for same |
| 05/17/2000 | EP1001667A2 Method for maintaining the printability of a solder paste |
| 05/17/2000 | EP1001439A1 Printed annular coil and method of manufacture thereof |
| 05/17/2000 | EP1001315A2 Method and device for exposing both sides of a sheet |
| 05/17/2000 | EP1001304A2 Liquid crystal display |
| 05/17/2000 | EP1001303A2 Display unit installing and connecting device |
| 05/17/2000 | EP1000529A1 Process and device for generating test patterns when applying solder paste by a screen printing process on printed circuit boards |
| 05/17/2000 | EP1000429A1 A protective containment apparatus for potted electronic circuits |
| 05/17/2000 | EP0999950A1 Trim panel having grooves with integrally formed electrical circuits |
| 05/17/2000 | EP0883980B1 High speed depaneling apparatus and method |
| 05/17/2000 | EP0880754B1 Method and device for bonding a wire conductor |
| 05/17/2000 | EP0800755B1 Dual air knife for hot air solder levelling |
| 05/17/2000 | EP0687405B1 Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture |
| 05/17/2000 | CN1253709A Reel for winding photosensitive film |
| 05/17/2000 | CN1253708A Apparatus for coating of flat-form substrates, especially of printed circuit boards |
| 05/17/2000 | CN1253707A Process and apparatus for treatment of flat-form material, especially of printed circuit board |
| 05/17/2000 | CN1253662A Board for mounting semiconductor element, method for manufacturing same, and semiconductor device |
| 05/17/2000 | CN1253467A Flat resistor and capacitor and making method thereof |
| 05/17/2000 | CN1253466A Flat resistor and capacitor and making method thereof |
| 05/17/2000 | CN1253465A Built-in fingered flat capacitor and resistor and making method thereof |
| 05/17/2000 | CN1253377A Module type semi-conductor device |
| 05/16/2000 | US6064576 Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board |
| 05/16/2000 | US6064560 Active carbon and process for its production |
| 05/16/2000 | US6064415 Thermal head and its fabrication method |
| 05/16/2000 | US6064120 Apparatus and method for face-to-face connection of a die face to a substrate with polymer electrodes |
| 05/16/2000 | US6063701 Conductive particle transferring method |
| 05/16/2000 | US6063647 Method for making circuit elements for a z-axis interconnect |
| 05/16/2000 | US6063481 Process for removal of undersirable conductive material on a circuitized substrate and resultant circuitized substrate |
| 05/16/2000 | US6063476 Method of fabricating plastic mask for paste printing, plastic mask for paste printing, and paste printing method |
| 05/16/2000 | US6063445 Preconditioning etching |
| 05/16/2000 | US6063191 Apparatus for the coating of flat-form substrates especially of printed circuit boards |
| 05/16/2000 | US6063172 Aqueous immersion plating bath and method for plating |
| 05/16/2000 | US6062903 High power surface mount interconnect apparatus for electrical power control module |
| 05/16/2000 | US6062901 Low profile battery holder assembly for printed circuit board |
| 05/16/2000 | US6062890 Electrical connector |
| 05/16/2000 | US6062877 Connector for a circuit board |
| 05/16/2000 | US6062873 Socket for chip package test |
| 05/16/2000 | US6062460 Apparatus for producing an electronic circuit |
| 05/16/2000 | US6062135 Screening apparatus including a dual reservoir dispensing assembly |
| 05/16/2000 | CA2195830C Connector fixing construction |
| 05/16/2000 | CA2019836C Reduced cycle method for the fabrication of printed circuits and composition used in said method |
| 05/11/2000 | WO2000027178A1 Case for circuit board for horizontal or vertical mounting |
| 05/11/2000 | WO2000027175A1 Adhesion-promoting layer for generating conductor structures with good adhesive properties on insulating material used in electronics |
| 05/11/2000 | WO2000027174A1 An electrical component and an electrical circuit module having connected ground planes |
| 05/11/2000 | WO2000027173A1 Test coupon for printed wiring board |
| 05/11/2000 | WO2000027172A1 Foldable circuits and method of making same |
| 05/11/2000 | WO2000027171A2 Electromechanical component |
| 05/11/2000 | WO2000026957A1 Method of manufacturing a multi-layered ceramic substrate |
| 05/11/2000 | WO2000026951A1 Method and device for removing a cut-out from a layer of material |
| 05/11/2000 | WO2000026942A2 Method for producing filled vias in electronic components |
| 05/11/2000 | WO2000026726A1 Method of forming pattern |
| 05/11/2000 | WO2000026724A1 Organic-solvent-based photosensitive resist composition and method of forming resist pattern |
| 05/11/2000 | WO2000026318A1 Adhesive composition |
| 05/11/2000 | WO2000025972A1 Solder paste with a time-temperature indicator |
| 05/11/2000 | WO2000025971A1 Apparatus and method for inerting a wave soldering installation |
| 05/11/2000 | WO2000025961A1 Component of printed circuit boards |
| 05/11/2000 | WO2000025941A1 Methods of forming metal contact pads on a metal support substrate |
| 05/11/2000 | WO2000013190A8 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part |
| 05/11/2000 | WO2000007219A3 High density printed circuit substrate and method of fabrication |
| 05/11/2000 | DE19952966A1 Modular semiconductor device, e.g. a power semiconductor module, has a tin-soldered heat sink of reduced thickness relative to the tin solder layer |
| 05/11/2000 | DE19952934A1 Contacting device for flat foil conductor has contact pin with sprung region, inserted into opening in foil |